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Institution	Date	Title	Author
國立中山大學	2007	Thermomechanical Properties of Nanosilica Reinforced PEEK Composites	Y.H. Lai;M.C. Kuo;J.C. Huang;M. Chen
國立臺灣海洋大學	1995	Thermomechanical Response Analysis of Lithographic Mask Structure Using FEM	D. C. Li;S. W. Chyuan;J. T. Chen;C. Y. Sun
國立中山大學	2000	Thermomechanical Treatment in Processing High Strain Rate Superplastic 6061 Al with 1% SiO2?nano-Particles	T.D. Wang;J.C. Huang
中華大學	2005	Thermometer Code Current Mode 8-bits Digital-to-Analog Converter Design	林君明; Lin, Jium-Ming
臺大學術典藏	2018-09-10T15:21:01Z	Thermometry for Dirac fermions in graphene	Hsu, C.-S.; Lo, S.-T.; Chuang, C.; Huang, L.-I.; Woo, T.-P.; Liang, C.-T.; Fukuyama, Y.; Yang, Y.; Elmquist, R.E.; Wang, P.; Lin, X.; Liu, F.-H.; CHI-TE LIANG et al.
臺大學術典藏	2019-12-27T01:16:42Z	Thermometry for Dirac fermions in graphene	Liu, F.-H.; Hsu, C.-S.; Lo, S.-T.; Chuang, C.; Huang, L.-I.; Woo, T.-P.; Liang, C.-T.; Fukuyama, Y.; Yang, Y.; Elmquist, R.E.; Wang, P.; Lin, X.; TAK-PONG WOO
國立交通大學	2014-12-08T15:30:49Z	Thermomigration in eutectic-SnPb solder with Cu UBM at the room temperature	Lin, Jie An; Chen, Chih
國立交通大學	2014-12-08T15:14:17Z	Thermomigration in flip-chip SnPb solder joints under alternating current stressing	Hsiao, Hsiang-Yao; Chen, Chih
國立交通大學	2014-12-08T15:09:48Z	Thermomigration in Pb-free SnAg solder joint under alternating current stressing	Hsiao, Hsiang-Yao; Chen, Chih
國立交通大學	2014-12-08T15:29:18Z	Thermomigration in solder joints	Chen, Chih; Hsiao, Hsiang-Yao; Chang, Yuan-Wei; Ouyang, Fanyi; Tu, K. N.

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