| 臺大學術典藏 |
2018-09-10T15:22:11Z |
Warm Start for parameter selection of linear classifiers
|
Chu, B.-Y.;Ho, C.-H.;Tsai, C.-H.;Lin, C.-Y.;Lin, C.-J.; Chu, B.-Y.; Ho, C.-H.; Tsai, C.-H.; Lin, C.-Y.; Lin, C.-J.; CHIH-JEN LIN |
| 臺大學術典藏 |
2020-05-04T07:48:08Z |
Warm Start for Parameter Selection of Linear Classifiers.
|
CHIH-JEN LIN; Lin, Chih-Jen; Chu, Bo-Yu;Ho, Chia-Hua;Tsai, Cheng-Hao;Lin, Chieh-Yen;Lin, Chih-Jen; Chu, Bo-Yu; Ho, Chia-Hua; Tsai, Cheng-Hao; Lin, Chieh-Yen |
| 國立成功大學 |
2013-09-24 |
Warm-night temperature delays spike emergence and alters carbon pool metabolism in the stem and leaves of Phalaenopsis aphroide
|
Liu, Y. C.; Tseng, K. M.; Chen, C. C.; Tsai, Y. T.; Liu, C. H.; Chen, W. H.; Wang, H. L. |
| 國立成功大學 |
2023 |
WARM-tree: Making Quadtrees Write-efficient and Space-economic on Persistent Memories
|
Wu, S.-T.;Chen, L.-C.;Huang, P.-C.;Chang, Y.-H.;Ho, C.-C.;Shih, W.-K. |
| 國立成功大學 |
2015-04-06 |
Warm-white light-emitting diode with high color rendering index fabricated by combining trichromatic InGaN emitter with single red phosphor
|
Sheu, Jinn-Kong; Chen, Fu-Bang; Wang, Yen-Chin; Chang, Chih-Chiang; Huang, Shih-Hsien; Liu, Chun-Nan; Lee, Ming-Lun |
| 淡江大學 |
2023-09-08T04:05:14Z |
Warming China Russia Relations over the Ukraine War and the Situation In East Asia
|
Ma, Chun-wei |
| 臺大學術典藏 |
2020-02-05T05:10:51Z |
Warming impact on herbivore population composition affects top-down control by predators
|
Wang Y.-J.;Nakazawa T.;Ho C.-K.; Wang Y.-J.; Nakazawa T.; Ho C.-K.; CHUAN-KAI HO |
| 國立成功大學 |
2017 |
Warming impact on herbivore population composition affects top-down control by predators
|
Wang, Y.-J.;Nakazawa, T.;Ho, C.-K. |
| 臺大學術典藏 |
2020-02-05T05:10:51Z |
Warming neutralizes host-specific competitive advantages between a native and invasive herbivore
|
Lin Z.-H.;Wu C.-H.;Ho C.-K.; Lin Z.-H.; Wu C.-H.; Ho C.-K.; CHUAN-KAI HO |
| 臺大學術典藏 |
2018-09-10T09:16:55Z |
WarmL1: A warm-start homotopy-based reconstruction algorithm for sparse signals
|
Yang, T.-J.; Tsai, Y.-M.; Li, C.-T.; Chen, L.-G.; LIANG-GEE CHEN |
| 修平科技大學 |
2012-04-25 |
Warning
|
陳珮純; 王婉欣; 程如慧; 林嘉芸; 黃聖頷 |
| 國立臺灣海洋大學 |
2015 |
Warning Model for Shallow Landslides Induced by Extreme Rainfall
|
Chien, L.-K;Hsu, C.-F;Yin, L.-C |
| 國立成功大學 |
2023-01 |
Warpage and residual stress analyses of post-mold cure process of IC packages
|
Lin;Ming-Yu;Zeng;Yong-Jie;Hwang;Sheng-Jye;Wang;Ming-Han;Liu;Hui-Ping;Fang;Chin-Lung |
| 國立交通大學 |
2018-08-21T05:53:22Z |
Warpage Characteristics and Process Development of Through Silicon Via-Less Interconnection Technology
|
Shen, Wen-Wei; Lin, Yu-Min; Wu, Sheng-Tsai; Lee, Chia-Hsin; Huang, Shin-Yi; Chang, Hsiang-Hung; Chang, Tao-Chih; Chen, Kuan-Neng |
| 國立高雄第一科技大學 |
2015.07 |
Warpage control of headlight lampshades fabricated using external gas-assisted injection molding
|
Nian, Shih-Chih;Li, Ming-Hung;Huang, Ming-Shyan; 黃明賢 |
| 國立高雄第一科技大學 |
2015.02 |
Warpage control of thin-walled injection molding using local mold temperatures
|
Nian, Shih-Chih;Wu, Chih-Yang;Huang, Ming-Shyan; 黃明賢 |
| 國立成功大學 |
2011-12 |
Warpage evolution of overmolded ball grid array package during post-mold curing thermal process
|
Chiu, TC; Huang, HW; Lai, YS |
| 中原大學 |
2009-06 |
Warpage Management Using Three Dimensional Thickness Control Method in Injection Molding
|
Y. Chang; S. T. Huang; S. W. Huang; S. C. Chen; C. T. Huang; M. C. Chen; V. Yang |
| 國立中山大學 |
2000-06-05 |
Warpage Measurements of IC Package During The IR-reflow Process
|
C.H. Chien; Y.T. Chiou; M.L.Tsai; T.C. Hung |
| 國立臺灣科技大學 |
2016 |
Warpage of embossed thermoplastic substrates and the effects on solvent bonding
|
Chen, P.-C;Yen, Yen Y.-C. |
| 元智大學 |
2023-06-15 |
Warpage of Semiconductor Packages
|
M. Y. Huang; Niann-i YU |
| 臺北醫學大學 |
2011 |
Warpage Phenomenon of Thin-Wall Injection Molding
|
Chiang, Yuh-Chyun;Cheng, Hsin-Chung;Huang, Chiung-Fang;Lee, Jeou-Long;Lin, Yi;Shen, Yung-Kang |
| 臺北醫學大學 |
2011 |
Warpage Phenomenon of Thin-Wall Injection Molding
|
Chiang, Yuh-Chyun;Cheng, Hsin-Chung;Huang, Chiung-Fang;Lee, Jeou-Long;Lin, Yi;Shen, Yung-Kang |
| 國立成功大學 |
2013-03 |
Warpage Prediction and Experiments of Fan-Out Waferlevel Package During Encapsulation Process
|
Deng, Shang-Shiuan; Hwang, Sheng-Jye; Lee, Huei-Huang |
| 國立成功大學 |
2018-01 |
Warpage simulation for the reconstituted wafer used in fan-out wafer level packaging
|
Chiu;Tz-Cheng;Yeh;En-Yu |
