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Institution	Date	Title	Author
修平科技大學	2012-04-25	Warning	陳珮純; 王婉欣; 程如慧; 林嘉芸; 黃聖頷
國立臺灣海洋大學	2015	Warning Model for Shallow Landslides Induced by Extreme Rainfall	Chien, L.-K;Hsu, C.-F;Yin, L.-C
國立成功大學	2023-01	Warpage and residual stress analyses of post-mold cure process of IC packages	Lin;Ming-Yu;Zeng;Yong-Jie;Hwang;Sheng-Jye;Wang;Ming-Han;Liu;Hui-Ping;Fang;Chin-Lung
國立交通大學	2018-08-21T05:53:22Z	Warpage Characteristics and Process Development of Through Silicon Via-Less Interconnection Technology	Shen, Wen-Wei; Lin, Yu-Min; Wu, Sheng-Tsai; Lee, Chia-Hsin; Huang, Shin-Yi; Chang, Hsiang-Hung; Chang, Tao-Chih; Chen, Kuan-Neng
國立高雄第一科技大學	2015.07	Warpage control of headlight lampshades fabricated using external gas-assisted injection molding	Nian, Shih-Chih;Li, Ming-Hung;Huang, Ming-Shyan; 黃明賢
國立高雄第一科技大學	2015.02	Warpage control of thin-walled injection molding using local mold temperatures	Nian, Shih-Chih;Wu, Chih-Yang;Huang, Ming-Shyan; 黃明賢
國立成功大學	2011-12	Warpage evolution of overmolded ball grid array package during post-mold curing thermal process	Chiu, TC; Huang, HW; Lai, YS
中原大學	2009-06	Warpage Management Using Three Dimensional Thickness Control Method in Injection Molding	Y. Chang; S. T. Huang; S. W. Huang; S. C. Chen; C. T. Huang; M. C. Chen; V. Yang
國立中山大學	2000-06-05	Warpage Measurements of IC Package During The IR-reflow Process	C.H. Chien; Y.T. Chiou; M.L.Tsai; T.C. Hung
國立臺灣科技大學	2016	Warpage of embossed thermoplastic substrates and the effects on solvent bonding	Chen, P.-C;Yen, Yen Y.-C.

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