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Institution	Date	Title	Author
國立高雄第一科技大學	2015.02	Warpage control of thin-walled injection molding using local mold temperatures	Nian, Shih-Chih;Wu, Chih-Yang;Huang, Ming-Shyan; 黃明賢
國立成功大學	2011-12	Warpage evolution of overmolded ball grid array package during post-mold curing thermal process	Chiu, TC; Huang, HW; Lai, YS
中原大學	2009-06	Warpage Management Using Three Dimensional Thickness Control Method in Injection Molding	Y. Chang; S. T. Huang; S. W. Huang; S. C. Chen; C. T. Huang; M. C. Chen; V. Yang
國立中山大學	2000-06-05	Warpage Measurements of IC Package During The IR-reflow Process	C.H. Chien; Y.T. Chiou; M.L.Tsai; T.C. Hung
國立臺灣科技大學	2016	Warpage of embossed thermoplastic substrates and the effects on solvent bonding	Chen, P.-C;Yen, Yen Y.-C.
元智大學	2023-06-15	Warpage of Semiconductor Packages	M. Y. Huang; Niann-i YU
臺北醫學大學	2011	Warpage Phenomenon of Thin-Wall Injection Molding	Chiang, Yuh-Chyun;Cheng, Hsin-Chung;Huang, Chiung-Fang;Lee, Jeou-Long;Lin, Yi;Shen, Yung-Kang
臺北醫學大學	2011	Warpage Phenomenon of Thin-Wall Injection Molding	Chiang, Yuh-Chyun;Cheng, Hsin-Chung;Huang, Chiung-Fang;Lee, Jeou-Long;Lin, Yi;Shen, Yung-Kang
國立成功大學	2013-03	Warpage Prediction and Experiments of Fan-Out Waferlevel Package During Encapsulation Process	Deng, Shang-Shiuan; Hwang, Sheng-Jye; Lee, Huei-Huang
國立成功大學	2018-01	Warpage simulation for the reconstituted wafer used in fan-out wafer level packaging	Chiu;Tz-Cheng;Yeh;En-Yu

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