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教育部委托研究计画 计画执行:国立台湾大学图书馆
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显示项目 918386-918395 / 2348419 (共234842页)
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| 國立高雄第一科技大學 |
2015.02 |
Warpage control of thin-walled injection molding using local mold temperatures
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Nian, Shih-Chih;Wu, Chih-Yang;Huang, Ming-Shyan; 黃明賢 |
| 國立成功大學 |
2011-12 |
Warpage evolution of overmolded ball grid array package during post-mold curing thermal process
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Chiu, TC; Huang, HW; Lai, YS |
| 中原大學 |
2009-06 |
Warpage Management Using Three Dimensional Thickness Control Method in Injection Molding
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Y. Chang; S. T. Huang; S. W. Huang; S. C. Chen; C. T. Huang; M. C. Chen; V. Yang |
| 國立中山大學 |
2000-06-05 |
Warpage Measurements of IC Package During The IR-reflow Process
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C.H. Chien; Y.T. Chiou; M.L.Tsai; T.C. Hung |
| 國立臺灣科技大學 |
2016 |
Warpage of embossed thermoplastic substrates and the effects on solvent bonding
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Chen, P.-C;Yen, Yen Y.-C. |
| 元智大學 |
2023-06-15 |
Warpage of Semiconductor Packages
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M. Y. Huang; Niann-i YU |
| 臺北醫學大學 |
2011 |
Warpage Phenomenon of Thin-Wall Injection Molding
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Chiang, Yuh-Chyun;Cheng, Hsin-Chung;Huang, Chiung-Fang;Lee, Jeou-Long;Lin, Yi;Shen, Yung-Kang |
| 臺北醫學大學 |
2011 |
Warpage Phenomenon of Thin-Wall Injection Molding
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Chiang, Yuh-Chyun;Cheng, Hsin-Chung;Huang, Chiung-Fang;Lee, Jeou-Long;Lin, Yi;Shen, Yung-Kang |
| 國立成功大學 |
2013-03 |
Warpage Prediction and Experiments of Fan-Out Waferlevel Package During Encapsulation Process
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Deng, Shang-Shiuan; Hwang, Sheng-Jye; Lee, Huei-Huang |
| 國立成功大學 |
2018-01 |
Warpage simulation for the reconstituted wafer used in fan-out wafer level packaging
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Chiu;Tz-Cheng;Yeh;En-Yu |
显示项目 918386-918395 / 2348419 (共234842页)
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每页显示[10|25|50]项目
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