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显示项目 220086-220095 / 2348638 (共234864页)
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机构 日期 题名 作者
國立臺灣科技大學 2018 Barrier properties of layered-silicate reinforced ethylenepropylenediene monomer/chloroprene rubber nanorubbers Wu C.M.; Hsieh W.Y.; Cheng K.B.; Lai C.-C.; Lee K.C.
中國文化大學 2018-05 Barrier Properties of Layered-Silicate Reinforced Ethylenepropylenediene Monomer/Chloroprene Rubber Nanorubbers Wu, CM (Wu, Chang Mou); Hsieh, WY (Hsieh, Wen Yen); Cheng, KB (Cheng, Kuo Bin); Lai, CC (Lai, Chiu-Chun); Lee, KC (Lee, Kuei Chi)
國立交通大學 2014-12-08T15:48:56Z Barrier properties of very thin Ta and TaN layers against copper diffusion Wang, MT; Lin, YC; Chen, MC
臺大學術典藏 2019-05-07T07:26:54Z Barrier smoothing for nonsmooth convex minimization. Yen-Huan Li; Cevher, Volkan; Tran-Dinh, Quoc; Tran-Dinh, Quoc;Yen-Huan Li;Cevher, Volkan
國立交通大學 2015-07-21T08:28:41Z Barrier Strain and Carbon Incorporation-Engineered Performance Improvements for AlGaN/GaN High Electron Mobility Transistors Tien Tung Luong; Ho, Yen Teng; Binh Tinh Tran; Woong, Yuen Yee; Chang, Edward Yi
國立臺灣科技大學 2008 Barrier-free Cu metallization with a novel copper seed layer containing various insoluble substances Chu, J.P.;Lin, C.H.;John, V.S.
國立交通大學 2014-12-16T06:14:24Z Barrier-overpassing transporter Cheng; Pi-Ying; Guo; Fang-Fu; Wong; Kian-Poh; Lin; I-Chung; Lee; Yu-Hsien
國立交通大學 2014-12-16T06:15:56Z BARRIER-OVERPASSING TRANSPORTER Cheng, Pi-Ying; Guo, Fang-Fu; Wong, Kian-Poh; Lin, I-Chung; Lee, Yu-Hsien
國立臺灣科技大學 2012 Barrierless Cu-Ni-Mo interconnect films with high thermal stability against silicide formation Li, X.N.;Liu, L.J.;Zhang, X.Y.;Chu, J.P.;Wang, Q.;Dong, C.
國立臺灣科技大學 2013 Barrierless Cu-Ni-Nb thin films on silicon with high thermal stability and low electrical resistivity Li, X.N.;Zhao, L.R.;Li, Z.;Liu, L.J.;Bao, C.M.;Chu, J.P.;Dong, C.

显示项目 220086-220095 / 2348638 (共234864页)
<< < 22004 22005 22006 22007 22008 22009 22010 22011 22012 22013 > >>
每页显示[10|25|50]项目