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顯示項目 220086-220095 / 2348674 (共234868頁)
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機構 日期 題名 作者
國立成功大學 2009 Barrier option pricing: a hybrid method approach Wang, Andrew Ming-Long; Liu, Yu-Hong; Hsiao, Yi-Long
臺大學術典藏 2004 Barrier Options Lyuu, Yuh-Dauh; Lyuu, Yuh-Dauh
國立臺灣大學 2004 Barrier Options Lyuu, Yuh-Dauh
元智大學 2014-09-08 Barrier Properties of Bio-based Polyester Nanocomposite Membranes Y.-M. Sun; C.-H. Lan; C.-Y. Huang; X.-T. Chen; C.-Y. Yen
國立臺灣科技大學 2018 Barrier properties of layered-silicate reinforced ethylenepropylenediene monomer/chloroprene rubber nanorubbers Wu C.M.; Hsieh W.Y.; Cheng K.B.; Lai C.-C.; Lee K.C.
中國文化大學 2018-05 Barrier Properties of Layered-Silicate Reinforced Ethylenepropylenediene Monomer/Chloroprene Rubber Nanorubbers Wu, CM (Wu, Chang Mou); Hsieh, WY (Hsieh, Wen Yen); Cheng, KB (Cheng, Kuo Bin); Lai, CC (Lai, Chiu-Chun); Lee, KC (Lee, Kuei Chi)
國立交通大學 2014-12-08T15:48:56Z Barrier properties of very thin Ta and TaN layers against copper diffusion Wang, MT; Lin, YC; Chen, MC
臺大學術典藏 2019-05-07T07:26:54Z Barrier smoothing for nonsmooth convex minimization. Yen-Huan Li; Cevher, Volkan; Tran-Dinh, Quoc; Tran-Dinh, Quoc;Yen-Huan Li;Cevher, Volkan
國立交通大學 2015-07-21T08:28:41Z Barrier Strain and Carbon Incorporation-Engineered Performance Improvements for AlGaN/GaN High Electron Mobility Transistors Tien Tung Luong; Ho, Yen Teng; Binh Tinh Tran; Woong, Yuen Yee; Chang, Edward Yi
國立臺灣科技大學 2008 Barrier-free Cu metallization with a novel copper seed layer containing various insoluble substances Chu, J.P.;Lin, C.H.;John, V.S.

顯示項目 220086-220095 / 2348674 (共234868頁)
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