| 臺大學術典藏 |
2020-05-12T02:53:22Z |
Interfacial Reactions between Liquid Indium and Nickel Substrate
|
Tseng, Y.H.; Yeh, M.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
2000 |
Interfacial Reactions between Liquid Indium and Silver Substrates
|
Liu, Y. M.; Chen, Y. L.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:20Z |
Interfacial reactions between liquid indium and silver substrates
|
Liu, Y.M.; Chen, Y.L.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:16Z |
Interfacial reactions between liquid Sn-8Zn-3Bi solders and Cu substrates
|
Lin, W.H.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立成功大學 |
2011-08 |
Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates
|
Wu, R. W.; Tsao, L. C.; Chang, S. Y.; Jain, C. C.; Chen, R. S. |
| 國立臺灣大學 |
2011 |
Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates
|
Wu, R.W.; Tsao, L.C.; Chang, S.Y.; Jain, C.C.; Chen, R.S. |
| 國立中山大學 |
1989 |
Interfacial Reactions Between Metal and Gallium Arsenide
|
L.C. Lin;K.J. Schulz;K.C. Hsieh;Y.A. Chang |
| 國立臺灣大學 |
1999-01 |
Interfacial reactions between Ni substrate and the component Bi in solders
|
Lee, M. S.; Liu, C. M.; Kao, and C. R. |
| 國立臺灣科技大學 |
2008 |
Interfacial reactions between Ni/430 stainless steel as interconnect material and Ag-Cu alloy fillers in SOFC system
|
Yen, Y.-W.;Lee, C.-Y.;Huang, D.-P.;Su, J.-W. |
| 國立臺灣科技大學 |
2008 |
Interfacial reactions between Ni/430 stainless steel as the interconnect material and Ag-Cu alloy fillers in a solid oxide fuel cell system
|
Yen, Y.-W.;Lee, C.-Y.;Huang, D.-P.;Su, J.-W. |
| 國立臺灣科技大學 |
2018 |
Interfacial Reactions between Pb-free Solders and Cu-Ti Alloy (C1990HP)
|
安德罗 |
| 國立臺灣科技大學 |
2013 |
Interfacial reactions between SAC405 and SACNG lead-free solders with Au/Ni(P)/Cu substrate reflowed using the CO2 laser and hot-air methods
|
Yen, Y.-W.;Hsiao, H.-M.;Lo, S.-C.;Fu, S.-M. |
| 國立臺灣科技大學 |
2018 |
Interfacial reactions between Sn and Au-xCu alloys
|
Lin, C.H.;Yeh, C.Y.;Yen, Yen Y.W. |
| 國立臺灣科技大學 |
2009 |
Interfacial reactions between Sn-9Zn + Cu lead-free solders and the Au substrate
|
Liou W.-k.; Yen Y.-w.; Chen K.-d. |
| 國立臺灣科技大學 |
2009 |
Interfacial reactions between Sn-9Zn+Cu lead-free solders and the Au substrate
|
Liou, W.K.;Yen, Y.W.;Chen, K.D. |
| 國立臺灣科技大學 |
2012 |
Interfacial reactions between Sn-Zn alloys and Au substrate
|
Yen, Y.-W.;Lin, M.-C.;Lin, C.-K.;Chen, W.-C. |
| 國立交通大學 |
2020-02-02T23:54:41Z |
Interfacial reactions between Ti and Y2O3/Ca4Ti3O10 composites
|
Lu, Ming-Wei; Lin, Kun-Lin; Lin, Chien-Cheng |
| 國立交通大學 |
2014-12-08T15:45:57Z |
Interfacial reactions between Ti-6Al-4V alloy and zirconia mold during casting
|
Lin, KF; Lin, CC |
| 國立交通大學 |
2014-12-08T15:47:27Z |
Interfacial reactions between zirconia and titanium
|
Lin, KF; Lin, CC |
| 國立成功大學 |
2014-01 |
Interfacial Reactions in Cu/Ga and Cu/Ga/Cu Couples
|
Lin, Shih-kang; Cho, Cheng-liang; Chang, Hao-miao |
| 國立成功大學 |
2013-10-15 |
Interfacial reactions in Sn-20In-2.8Ag/Cu couples
|
Lin, Shih-kang; Hsu, Che-wei; Chen, Sinn-wen; Hsu, Chia-ming |
| 國立臺灣科技大學 |
2012 |
Interfacial reactions in Sn/Fe-xNi couples
|
Yen, Y.-W.;Hsiao, H.-M.;Lin, S.-W.;Huang, P.-J.;Lee, C. |
| 國立臺灣科技大學 |
2017 |
Interfacial reactions in the Au/Sn-xZn/Cu sandwich couples
|
Yen, Yen Y.-W;Lin, C.-Y;Hermana, G.N;Chen, P.-Y;Wu, Y.-P. |
| 中原大學 |
2005 |
Interfacial Reactions in the Sn-(Ag)/(Ni,V) Couples and Phase Equilibria of the Sn-Ni-V System at the Sn-rich Corner
|
Chih-chi Chen;Sinn-wen Chen;Ching-ya Kao; |
| 臺大學術典藏 |
2021-08-05T02:41:04Z |
Interfacial reactions in Zn4Sb3/titanium diffusion couples
|
Chen C.-H;Yeh W.-T;Chuang T.-H.; Chen C.-H; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG |
