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Institution	Date	Title	Author
臺大學術典藏	2020-05-12T02:53:22Z	Interfacial Reactions between Liquid Indium and Nickel Substrate	Tseng, Y.H.; Yeh, M.S.; Chuang, T.H.; TUNG-HAN CHUANG
國立臺灣大學	2000	Interfacial Reactions between Liquid Indium and Silver Substrates	Liu, Y. M.; Chen, Y. L.; Chuang, T. H.
臺大學術典藏	2020-05-12T02:53:20Z	Interfacial reactions between liquid indium and silver substrates	Liu, Y.M.; Chen, Y.L.; Chuang, T.H.; TUNG-HAN CHUANG
臺大學術典藏	2020-05-12T02:53:16Z	Interfacial reactions between liquid Sn-8Zn-3Bi solders and Cu substrates	Lin, W.H.; Chuang, T.H.; TUNG-HAN CHUANG
國立成功大學	2011-08	Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates	Wu, R. W.; Tsao, L. C.; Chang, S. Y.; Jain, C. C.; Chen, R. S.
國立臺灣大學	2011	Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates	Wu, R.W.; Tsao, L.C.; Chang, S.Y.; Jain, C.C.; Chen, R.S.
國立中山大學	1989	Interfacial Reactions Between Metal and Gallium Arsenide	L.C. Lin;K.J. Schulz;K.C. Hsieh;Y.A. Chang
國立臺灣大學	1999-01	Interfacial reactions between Ni substrate and the component Bi in solders	Lee, M. S.; Liu, C. M.; Kao, and C. R.
國立臺灣科技大學	2008	Interfacial reactions between Ni/430 stainless steel as interconnect material and Ag-Cu alloy fillers in SOFC system	Yen, Y.-W.;Lee, C.-Y.;Huang, D.-P.;Su, J.-W.
國立臺灣科技大學	2008	Interfacial reactions between Ni/430 stainless steel as the interconnect material and Ag-Cu alloy fillers in a solid oxide fuel cell system	Yen, Y.-W.;Lee, C.-Y.;Huang, D.-P.;Su, J.-W.

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