|
显示项目 519181-519205 / 2346260 (共93851页)
<< < 20763 20764 20765 20766 20767 20768 20769 20770 20771 20772 > >>
每页显示[10|25|50]项目
| 國立臺灣大學 |
2002 |
Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films
|
Su, T. L.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H. |
| 國立交通大學 |
2014-12-08T15:48:54Z |
Interfacial reactions of Ni on Si0.76Ge0.24 and Si by pulsed laser annealing
|
Luo, JS; Lin, WT; Chang, CY; Tsai, WC |
| 國立成功大學 |
1998-07 |
Interfacial reactions of Ni on Si0.76Ge0.24 and Si by pulsed laser annealing
|
Luo, Jian-Shing; Lin, Wen-Tai; Chang, C. Y.; Tsai, W. C. |
| 國立交通大學 |
2014-12-08T15:45:14Z |
Interfacial reactions of Ni/Si0.76Ge0.24 and Ni/Si1-x-yGexCy by vacuum annealing and pulsed KrF laser annealing
|
Luo, JS; Lin, WT; Chang, CY; Shih, PS |
| 國立成功大學 |
2000-06 |
Interfacial reactions of Ni/Si0.76Ge0.24 and Ni/Si1-x-yGexCy by vacuum annealing and pulsed KrF laser annealing
|
Luo, Jian-Shing; Lin, Wen-Tai; Chang, C. Y.; Shih, P. S. |
| 國立臺灣科技大學 |
2012 |
Interfacial reactions of Pb-free solders with Au/Pd/Ni/brass multilayer substrates
|
Yen, Y.-W.;Tsai, P.-H.;Fang, Y.-K.;Chen, B.-J.;Lee, C. |
| 國立交通大學 |
2014-12-08T15:48:43Z |
Interfacial reactions of Pd/Si0.76Ge0.24 by pulsed KrF laser annealing
|
Chen, DR; Luo, JS; Lin, WT; Chang, CY; Shih, PS |
| 國立成功大學 |
2008-02-25 |
Interfacial reactions of Pt-based Schottky contacts on InGaP
|
Chu, L. H.; Chang, Edward Yi; Wu, Y. H.; Huang, J. C.; Chen, Q. Y.; Chu, W. K.; Seo, H. W.; Lee, Ching-Ting |
| 國立交通大學 |
2014-12-08T15:12:34Z |
Interfacial reactions of Pt-based Schottky contacts on nGaP
|
Chu, L. H.; Chang, E. Y.; Wu, Y. H.; Huang, J. C.; Chen, Q. Y.; Chu, W. K.; Seo, H. W.; Lee, C. T. |
| 國立臺灣科技大學 |
2008 |
Interfacial Reactions of Pure Sn and Sn-3.0Ag-0.5Cu Lead-free Solders with the Fe-42Ni Substrate
|
Yu-Ping Hsieh;Wei-Kai Liou;Yee-Wen Yen |
| 國立臺灣科技大學 |
2010 |
Interfacial reactions of pure Sn, Sn-3.0Ag-0.5Cu and Sn-9.0Zn lead-free solders with the Fe-42Ni substrate
|
Hsieh Y.-P.; Jao C.-C.; Yen Y.-W. |
| 國立臺灣大學 |
2004-12 |
Interfacial Reactions of r.f-Sputtered TiNi Thin Film on (100) Silicon with SiN Diffusion-Barrier
|
Wu, S.K.; Su, J.J.; Wang, J.Y. |
| 國立臺灣大學 |
2004 |
Interfacial reactions of rf-sputtered TiNi thin films on (100) silicon with a SiN diffusion barrier
|
Wu, S.K.; Su, J.J.; Wang, J.Y. |
| 臺大學術典藏 |
2018-09-10T04:48:31Z |
Interfacial reactions of rf-sputtered TiNi thin films on (100) silicon with a SiN diffusion barrier
|
SHYI-KAAN WU;Wang, J.Y.;Su, J.J.;Wu, S.K.;SHYI-KAAN WU; Wu, S.K.; Su, J.J.; Wang, J.Y.; SHYI-KAAN WU |
| 國立東華大學 |
2004 |
Interfacial Reactions of rf-Sputtered TiNi Thin Films on (100) Silicon with SiN Diffusion-Barrier
|
Wang,Jian-Yih; Wu,S. K.; Su,J. J. |
| 國立臺灣科技大學 |
2014 |
Interfacial reactions of Sn, Sn-3.0Ag-0.5Cu, and Sn-9Zn lead-free solders with Fe-42Ni substrates
|
Yen, Y.-W.;Hsieh, Y.-P.;Jao, C.-C.;Chiu, C.-W.;Li, Y.-S. |
| 國立臺灣科技大學 |
2009 |
Interfacial reactions of Sn-0.7Cu, Sn-58Bi and Sn-9Zn lead-free solders with the Au/Ni/SUS 304 substrate
|
Chen K.-D.; Chen H.; Yen Y.-W. |
| 國立臺灣科技大學 |
2014 |
Interfacial reactions of Sn-58Bi and Sn-0.7Cu lead-free solders with Alloy 42 substrate
|
Yen, Y.-W.;Syu, R.-S.;Chen, C.-M.;Jao, C.-C.;Chen, G.-D. |
| 國立臺灣科技大學 |
2010 |
Interfacial Reactions of Sn-58Bi and Sn-9Zn Lead-Free Solders with Au/Ni/SUS304 Multi layer Substrate
|
Yen, Y.W.;Liaw, D.W.;Chen, K.D.;Chen, H. |
| 國立臺灣科技大學 |
2009 |
Interfacial Reactions of Sn-9Zn-xCu (x=1, 4, 7, 10) Solders with Ni Substrates
|
Liou, W.K.;Yen, Y.W.;Jao, C.C. |
| 淡江大學 |
2023-11-17 |
Interfacial Reactions of Sn52In on ENEPIG Substrates
|
Chang, K.C.;Lin, S.T.;Wang, Y.W. |
| 國立交通大學 |
2014-12-08T15:01:52Z |
Interfacial reactions of the Co/Si1-xGex system
|
Luo, JS; Lin, WT; Chang, CY; Tsai, WC; Wang, SJ |
| 國立成功大學 |
2001 |
Interfacial reactions of Ti/Cu/(100)Si
|
Yeh, M. H.; Lin, Wen-Tai |
| 國立交通大學 |
2014-12-08T15:04:34Z |
INTERFACIAL REACTIONS OF TITANIUM THIN-FILMS ON ION-IMPLANTED (001) SI
|
LIAUH, HR; CHEN, MC; CHEN, JF; CHEN, LJ; LUR, W; CHU, CH |
| 國立聯合大學 |
2010 |
Interfacial Reactions, Microstructure, and Strength of Sn-8Zn-3Bi and Sn-9Zn-Al Solder on Cu and Au/Ni (P) Pads
|
Hsi, CS; Lin, CT; Chang, TC; Wang, MC; Liang, MK |
显示项目 519181-519205 / 2346260 (共93851页)
<< < 20763 20764 20765 20766 20767 20768 20769 20770 20771 20772 > >>
每页显示[10|25|50]项目
|
