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显示项目 648376-648385 / 2348487 (共234849页)
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| 國立交通大學 |
2014-12-08T15:31:26Z |
Package routability- and IR-drop-aware finger/pad planning for single chip and stacking IC designs
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Lu, Chao-Hung; Chen, Hung-Ming; Liu, Chien-Nan Jimmy; Shih, Wen-Yu |
| 國立交通大學 |
2015-12-04T07:03:11Z |
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
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LIN Chien-Chung; KUO Hao-Chung; CHEN Kuo-Ju; HAN Hau-Vei; CHEN Hsin-Chu |
| 國立交通大學 |
2017-02-09 |
PACKAGE STRUCTURE OF A LIGHT-EMITTING DEVICE
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Hsien-Hao Tu; Zong-Yi Tu; Kuo-Ju Chen; Hau-Vei Han; Chin-Wei Sher; Hao-Chung Kuo; Chien-Chung Lin |
| 國立臺灣科技大學 |
2020 |
Package structure of polarized white chip-on-board light-emitting diode with high thermal conductivity
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Su, J.-C.;Huang, S.-B. |
| 義守大學 |
2007-02 |
Package-induced cross-coupling effect on amplifier harmonic suppression
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Han-Jan Chen;Tsung-Hui Huang;Chin-Sheng Chang;Lih-Shan Chen;Jui-Hong Horng;Yeong-Her Wang;Mau-Phon Houng |
| 國立成功大學 |
2007-02 |
Package-induced cross-coupling effect on amplifier harmonic suppression
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Chen, Han-Jan; Huang, Tsung-Hui; Chang, Chin-Sheng; Chen, Lih-Shan; Horng, Jui-Hong; Wang, Yeong-Her; Houng, Mau-Phon |
| 國立成功大學 |
2016-08-03 |
Package-on-Package封裝體之熱傳研究
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周景弘; Chou, Ching-Hung |
| 國立成功大學 |
2016-07-08 |
Package-on-Package封裝體之熱傳研究
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周景弘; Chou, Ching-Hung |
| 臺大學術典藏 |
2018-09-10T04:55:28Z |
Package-strain-enhanced device and circuit performance
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Maikap, S.;Liao, M.H.;Yuan, F.;Lee, M.H.;Huang, C.-F.;Chang, S.T.;Liu, C.W.; Maikap, S.; Liao, M.H.; Yuan, F.; Lee, M.H.; Huang, C.-F.; Chang, S.T.; Liu, C.W.; CHEE-WEE LIU |
| 臺大學術典藏 |
2019-03-11T08:00:57Z |
Package-strain-enhanced device and circuit performance
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Liu, C.W.;Chang, S.T.;Huang, C.-F.;Lee, M.H.;Yuan, F.;Maikap, S.;Liao, M.H.; Maikap, S.; Liao, M.H.; Yuan, F.; Lee, M.H.; Huang, C.-F.; Chang, S.T.; Liu, C.W. |
显示项目 648376-648385 / 2348487 (共234849页)
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