| 臺大學術典藏 |
2021-07-06T08:49:50Z |
Interfacial properties of Pluronics and the interactions between Pluronics and cholesterol/DPPC mixed monolayers
|
LIN-CHAU CHANG; Chang Y.-Y.; Gau C.-S. |
| 國立臺灣科技大學 |
2012 |
Interfacial Properties of Polyethylene Glycol/Vinyltriethoxysilane (PEG/VTES) Copolymers and their Application to Stain Resistance
|
Chao, Yin-Chun;Su, Shuenn-Kung;Lin, Ya-Wun;Hsu, Wan-Ting;Huang, Kuo-Shien |
| 國立臺灣科技大學 |
2011 |
Interfacial reaction and electrical characteristics of Cu(RuTaNx) on GaAs: Annealing effects
|
Leau, W.K.;Chu, J.P.;Lin, C.H. |
| 元智大學 |
Jan-15 |
Interfacial Reaction and Mechanical Characterization of Sn-Ag-Cu/Au/Pd(P)/Cu Solder Joints: Thick Pd(P) Deposition
|
Cheng-En Ho; Wan-Zhen Hsieh; Cheng-Hsien Yang; Ting-Chun Yeh; Tsai-Tung Kuo |
| 元智大學 |
Feb-19 |
Interfacial reaction and mechanical reliability between Sn-3Ag-0.5Cu alloy and ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad
|
Ying-Syuan Wu; Pei-Tzu Lee; Wan-Zhen Hsieh; Tsai-Tung Kuo; Cheng-En Ho |
| 元智大學 |
2013-12-1 |
Interfacial reaction and mechanical reliability of PTH solder joints with different solder/surface finish combinations
|
C. H. Kao; H. H. Hua; H. Y. Chan; T. H. Yang; Kuen-Song Lin; Cheng-En Ho |
| 元智大學 |
2013-12-1 |
Interfacial Reaction and Mechanical Reliability of PTH Solder Joints with Different Solder/Surface Finish Combinations
|
Kuen-Song Lin; Cheng-En Ho; Ho-Yang Chan; Shih-Ju Wang; Chin-Hung Kuo |
| 國立交通大學 |
2014-12-08T15:16:20Z |
Interfacial reaction and shear strength of Pb-free SnAg2.5Cu0.86b0.5 and SnAg3.0Cu0.5Sb0.2 solder bumps on Au/Ni(P) metallization
|
Hsu, YC; Huang, YM; Chen, C; Wang, H |
| 國立臺灣大學 |
2012 |
Interfacial Reaction and Wettability of 72Ag-28Cu Braze on CP-Ti Substrate Using Infrared Heating
|
Shiue, R.K.; Wu, S.K.; Chen, F.Y.; Yang, T.E. |
| 臺大學術典藏 |
2018-09-10T09:17:50Z |
Interfacial reaction and wettability of 72Ag-28Cu braze on CP-Ti substrate using infrared heating
|
Lin, Ming-Tsan;Yang, T.E.;Chen, F.Y.;Wu, S.K.;Shiue, R.K.;Yang, T.E.;Chen, F.Y.;Wu, S.K.;Shiue, R.K.;陳炯年;李伯皇;楊博仁;楊偉勛;林明燦;Yu, Linda Chia-Hui;Lee, Po-Huang;Chen, Chiung-Nien;Yang, T.E.;Chen, F.Y.;Nien, Hsiao-Ching;Wu, S.K.;Yang, Wei-Shiung;Shiue, R.K.;SHYI-KAAN WU;Yang, Po-Jen; Shiue, R.K.; Wu, S.K.; Chen, F.Y.; Yang, T.E.; Shiue, R.K.; Wu, S.K.; Chen, F.Y.; Yang, T.E.; Yang, Po-Jen; SHYI-KAAN WU; Shiue, R.K.; Yang, Wei-Shiung; Wu, S.K.; Nien, Hsiao-Ching; Chen, F.Y.; Yang, T.E.; Chen, Chiung-Nien; Lee, Po-Huang; Yu, Linda Chia-Hui; Lin, Ming-Tsan; 林明燦; 楊偉勛; 楊博仁; 李伯皇; 陳炯年 |
| 國立臺灣大學 |
2010 |
Interfacial Reaction Between 95Pb-5Sn Solder Bump and 37Pb-63Sn Presolder in Flip-Chip Solder Joints
|
Chang, C.C.; Wang, Y.W.; Lai, Y.S.; Kao, C.R. |
| 臺大學術典藏 |
2020-04-28T07:11:48Z |
Interfacial Reaction Between 95Pb-5Sn Solder Bump and 37Pb-63Sn Presolder in Flip-Chip Solder Joints
|
Chang, C. C.; Wang, Y. W.; Lai, Y. S.; Kao, C. R.; CHIEN-CHENG CHANG |
| 國立交通大學 |
2014-12-08T15:17:35Z |
Interfacial Reaction Between Eutectic Sn-Pb Solder and Electroplated-Ni as well as Electroless-Ni Metallization During Reflow
|
Chen, Hsiao-Yun; Chen, Chih |
| 國立臺灣大學 |
2002 |
Interfacial Reaction between Liquid Sn-20In-2.8Ag Solder and Ag Substrate
|
Chiang, M. J.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Interfacial reaction between liquid Sn-20In-2.8Ag solder and Ag substrate
|
Chiang, M.J.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立成功大學 |
2014-05 |
Interfacial Reaction Between Low-Temperature Co-fired Ceramics and NiCuZn Ferrites in Multilayer Composites
|
Hsiang, Hsing-I; Lyu, Bing Jyun; Mei, Li-Then; Hsi, Chi-Shiung |
| 國立臺灣科技大學 |
2019 |
Interfacial reaction between sn and cu-ti alloy (C1990hp)
|
Laksono, A.D.;Chang, J.-S.;Yan, J.;Yen, Yen Y.-W. |
| 國立交通大學 |
2014-12-08T15:09:47Z |
Interfacial reaction between Sn-1Ag-0.5Cu(-Co) solder and Cu substrate with Au/Ni surface finish during reflow reaction
|
Lin, K. S.; Huang, H. Y.; Chou, C. P. |
| 國立成功大學 |
2019 |
Interfacial reaction between YSZ electrolyte and La 0.7 Sr 0.3 VO 3 perovskite anode for application
|
Liu, C.-Y.;Tsai, S.-Y.;Ni, C.-T.;Fung, K.-Z. |
| 國立成功大學 |
2019-03 |
Interfacial reaction between YSZ electrolyte and La0.7Sr0.3VO3 perovskite anode for application
|
Liu;Chi-Yang;Tsai;Shu-Yi;Ni;Chung-Ta;Fung;Kuan-Zong |
| 國立中山大學 |
1992 |
Interfacial Reaction Characterization in Aluminum Base Composites
|
Y.S. Lo;J.C. Huang |
| 國立臺灣大學 |
2007 |
Interfacial reaction issues for lead-free electronic solders
|
Ho, C. E.; Yang, S. C.; Kao, C. R. |
| 臺大學術典藏 |
2001 |
Interfacial reaction of infrared brazed NiAl/Al/NiAl and Ni3Al/Al/Ni3Al joints
|
Yang, T.Y.; Wu, S.K.; Shiue, R.K.; SHYI-KAAN WU; SHYI-KAAN WU;Shiue, R.K.;Wu, S.K.;Yang, T.Y.;SHYI-KAAN WU |
| 國立臺灣大學 |
2001 |
Interfacial reaction of infrared brazed NiAl/Al/NiAl and Ni3Al/Al/Ni3Al joints
|
Yang, T. Y.; Wu, S. K.; Shiue, R. K. |
| 臺大學術典藏 |
2020-05-12T02:52:55Z |
Interfacial reaction of infrared brazed NiAl/Al/NiAl and Ni3Al/Al/Ni3Al joints
|
Yang, T.Y.; Wu, S.K.; Shiue, R.K.; REN-KAE SHIUE |
| 國立成功大學 |
2004 |
Interfacial reaction of TiO2/NiCuZn ferrites in multilayer composites
|
Hsiang, Hsing-I; Liao, Wen-Chang; Wang, Yu-Ju; Cheng, Ya-Fang |
| 國立交通大學 |
2014-12-08T15:09:55Z |
Interfacial Reactions and Bonding Strength of Sn-xAg-0.5Cu/Ni BGA Solder Joints
|
Lin, K. S.; Huang, H. Y.; Chou, C. P. |
| 國立臺灣大學 |
2010 |
Interfacial Reactions and Doping in Organic Light Emitting Diodes Incorporated with Cesium-Based Compounds
|
Chen, Mei-Hsin; Lu, Yin-Jui; Chang, Yu-Jen; Wu, Chung-Chih; Wu, Chih-I |
| 臺北醫學大學 |
2005 |
Interfacial reactions and electrical properties of hafnium-based thin films in Cu/barrier/n+-p junction diodes
|
歐耿良; 黃豪銘; 李勝揚; 林哲堂; Ou,Keng-Liang; Tsai,Ming-Hung; Huang,Haw-Ming; Chiou,Shi-Yung; Lin,Che-Tong; Lee,Sheng-Yang |
| 國立成功大學 |
2002-05 |
Interfacial reactions and electrical properties of Hf/p-Si0.85Ge0.15
|
Chung, Ming-Shaw; Wang, Ming-Jun; Lin, Wen-Tai; Chang, Tao-Chih; Fang, Yean-Kuen |
| 元智大學 |
2013-03 |
Interfacial Reactions and Electromigration in Flip-Chip Solder Joints
|
Cheng-En Ho; C. R. Kao; K. N. Tu |
| 國立臺灣科技大學 |
2009 |
Interfacial reactions and mechanism properties between SAC 405 and SACNG lead-free solders with Au/Ni(P)/Cu substrates reflowed by CO2 laser
|
Lo S.-C.; Hsieh Y.-P.; Yen Y.-W. |
| 國立東華大學 |
2006 |
Interfacial Reactions between Bi-Ag High Temperature Solders and Metallic Substrates
|
Song,J. M.; Chuang,H. Y.; Wu,Z. M. |
| 國立臺灣科技大學 |
2008 |
Interfacial reactions between Cu alloy and GaAs
|
Chu, J.P.;Leau, W.K.;Lin, C.H. |
| 臺大學術典藏 |
2019-11-27T02:02:30Z |
Interfacial reactions between Cu and Sn, Sn-Ag, Sn-Bi, Sn-Zn solder under space confinement for 3D IC micro joint applications
|
C. ROBERT KAO;Kao C.R.;Yu J.J.;Shih W.L.;Yang T.L.; Yang T.L.; Shih W.L.; Yu J.J.; Kao C.R.; C. ROBERT KAO |
| 國立交通大學 |
2015-07-21T08:28:57Z |
Interfacial reactions between Cu and SnAgCu solder doped with minor Ni
|
Cheng, Hsi-Kuei; Huang, Chin-Wen; Lee, Hsuan; Wang, Ying-Lang; Liu, Tzeng-Feng; Chen, Chih-Ming |
| 國立臺灣科技大學 |
2011 |
Interfacial reactions between high-Pb solders and Ag
|
Lin, C.P.;Chen, C.M.;Yen, Y.W.;Wu, H.J.;Chen, S.W. |
| 國立臺灣大學 |
2000 |
Interfacial Reactions between In10Ag Solders and Ag Substrates
|
Liu, Y. M.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:20Z |
Interfacial reactions between In10Ag solders and Ag substrates
|
TUNG-HAN CHUANG; Chuang, T.H.; Liu, Y.M. |
| 國立臺灣科技大學 |
2017 |
Interfacial reactions between lead-free solders and Cu-40Zn alloys
|
Yen, Yen Y.-W.;Chen, P.-Y.;Chen, G.-D. |
| 國立臺灣科技大學 |
2019 |
Interfacial Reactions Between Lead-Free Solders and Ni-Pd-Co Alloys
|
Yen, Yen Y.-W.;Hsiao, Hsiao H.-M.;Chen, K.-J.;Lin, Y.-S.;Lai, M.-T. |
| 國立臺灣科技大學 |
2009 |
Interfacial reactions between lead-free solders and the multilayer Au/Ni/SUS304 substrate
|
Yen Y.-W.; Lee C.-Y.; Kuo M.-H.; Chao K.-S.; Chen K.-D. |
| 國立臺灣大學 |
2000 |
Interfacial Reactions between Liquid In48Sn Solders and Ag Substrates
|
Huang, Y. T.; Chuang, T. H. |
| 國立臺灣大學 |
2000 |
Interfacial reactions between liquid indium and Au-deposited substrates
|
Liu, Y. M.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:20Z |
Interfacial reactions between liquid indium and Au-deposited substrates
|
Liu, Y.M.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
1999 |
Interfacial reactions between liquid indium and nickel substrate
|
Tseng, Y. H.; Yeh, M. S.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:22Z |
Interfacial Reactions between Liquid Indium and Nickel Substrate
|
Tseng, Y.H.; Yeh, M.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
2000 |
Interfacial Reactions between Liquid Indium and Silver Substrates
|
Liu, Y. M.; Chen, Y. L.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:20Z |
Interfacial reactions between liquid indium and silver substrates
|
Liu, Y.M.; Chen, Y.L.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:16Z |
Interfacial reactions between liquid Sn-8Zn-3Bi solders and Cu substrates
|
Lin, W.H.; Chuang, T.H.; TUNG-HAN CHUANG |
