| 國立臺灣科技大學 |
2011 |
Interfacial reactions between high-Pb solders and Ag
|
Lin, C.P.;Chen, C.M.;Yen, Y.W.;Wu, H.J.;Chen, S.W. |
| 國立臺灣大學 |
2000 |
Interfacial Reactions between In10Ag Solders and Ag Substrates
|
Liu, Y. M.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:20Z |
Interfacial reactions between In10Ag solders and Ag substrates
|
TUNG-HAN CHUANG; Chuang, T.H.; Liu, Y.M. |
| 國立臺灣科技大學 |
2017 |
Interfacial reactions between lead-free solders and Cu-40Zn alloys
|
Yen, Yen Y.-W.;Chen, P.-Y.;Chen, G.-D. |
| 國立臺灣科技大學 |
2019 |
Interfacial Reactions Between Lead-Free Solders and Ni-Pd-Co Alloys
|
Yen, Yen Y.-W.;Hsiao, Hsiao H.-M.;Chen, K.-J.;Lin, Y.-S.;Lai, M.-T. |
| 國立臺灣科技大學 |
2009 |
Interfacial reactions between lead-free solders and the multilayer Au/Ni/SUS304 substrate
|
Yen Y.-W.; Lee C.-Y.; Kuo M.-H.; Chao K.-S.; Chen K.-D. |
| 國立臺灣大學 |
2000 |
Interfacial Reactions between Liquid In48Sn Solders and Ag Substrates
|
Huang, Y. T.; Chuang, T. H. |
| 國立臺灣大學 |
2000 |
Interfacial reactions between liquid indium and Au-deposited substrates
|
Liu, Y. M.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:20Z |
Interfacial reactions between liquid indium and Au-deposited substrates
|
Liu, Y.M.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
1999 |
Interfacial reactions between liquid indium and nickel substrate
|
Tseng, Y. H.; Yeh, M. S.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:22Z |
Interfacial Reactions between Liquid Indium and Nickel Substrate
|
Tseng, Y.H.; Yeh, M.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
2000 |
Interfacial Reactions between Liquid Indium and Silver Substrates
|
Liu, Y. M.; Chen, Y. L.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:20Z |
Interfacial reactions between liquid indium and silver substrates
|
Liu, Y.M.; Chen, Y.L.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:16Z |
Interfacial reactions between liquid Sn-8Zn-3Bi solders and Cu substrates
|
Lin, W.H.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立成功大學 |
2011-08 |
Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates
|
Wu, R. W.; Tsao, L. C.; Chang, S. Y.; Jain, C. C.; Chen, R. S. |
| 國立臺灣大學 |
2011 |
Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates
|
Wu, R.W.; Tsao, L.C.; Chang, S.Y.; Jain, C.C.; Chen, R.S. |
| 國立中山大學 |
1989 |
Interfacial Reactions Between Metal and Gallium Arsenide
|
L.C. Lin;K.J. Schulz;K.C. Hsieh;Y.A. Chang |
| 國立臺灣大學 |
1999-01 |
Interfacial reactions between Ni substrate and the component Bi in solders
|
Lee, M. S.; Liu, C. M.; Kao, and C. R. |
| 國立臺灣科技大學 |
2008 |
Interfacial reactions between Ni/430 stainless steel as interconnect material and Ag-Cu alloy fillers in SOFC system
|
Yen, Y.-W.;Lee, C.-Y.;Huang, D.-P.;Su, J.-W. |
| 國立臺灣科技大學 |
2008 |
Interfacial reactions between Ni/430 stainless steel as the interconnect material and Ag-Cu alloy fillers in a solid oxide fuel cell system
|
Yen, Y.-W.;Lee, C.-Y.;Huang, D.-P.;Su, J.-W. |
| 國立臺灣科技大學 |
2018 |
Interfacial Reactions between Pb-free Solders and Cu-Ti Alloy (C1990HP)
|
安德罗 |
| 國立臺灣科技大學 |
2013 |
Interfacial reactions between SAC405 and SACNG lead-free solders with Au/Ni(P)/Cu substrate reflowed using the CO2 laser and hot-air methods
|
Yen, Y.-W.;Hsiao, H.-M.;Lo, S.-C.;Fu, S.-M. |
| 國立臺灣科技大學 |
2018 |
Interfacial reactions between Sn and Au-xCu alloys
|
Lin, C.H.;Yeh, C.Y.;Yen, Yen Y.W. |
| 國立臺灣科技大學 |
2009 |
Interfacial reactions between Sn-9Zn + Cu lead-free solders and the Au substrate
|
Liou W.-k.; Yen Y.-w.; Chen K.-d. |
| 國立臺灣科技大學 |
2009 |
Interfacial reactions between Sn-9Zn+Cu lead-free solders and the Au substrate
|
Liou, W.K.;Yen, Y.W.;Chen, K.D. |
