| 朝陽科技大學 |
2021-05-28 |
Thermal Comfort of a Walking Environment under an Elevated Urban Railway: A Case Study of Taichung Overpass
|
許國威 |
| 中國醫藥大學 |
2007-12 |
Thermal Comfort Requirements for Occupants of Semi-Outdoor and Outdoor Environments in Hot-Humid Regions
|
黃瑞隆(Reuy Lung Hwang); 林子平(Tzu-Ping Lin)* |
| 中國醫藥大學 |
2008.06 |
Thermal comfort requirements in air-conditioned residences in hot-humid climate
|
鄭明仁(Ming-Jen Cheng); 黃瑞隆(Reuy Lung Hwang)* |
| 國立成功大學 |
2004-02 |
Thermal compensation for a chirp fiber bragg grating bonded substrate
|
Chang, Y. M.; Cheng, Chih-Chun; Lo, Yu-Lung |
| 臺大學術典藏 |
2022-09-21T23:30:34Z |
Thermal Compression Cu-Cu bonding using electroless Cu and the evolution of voids within bonding interface
|
Huang, C. H.; Shih, P. S.; Huang, J. H.; Grafner, S. J.; Chen, Y. A.; Kao, C. R. |
| 國立交通大學 |
2019-04-03T06:39:00Z |
Thermal conductance and the Peltier coefficient of carbon nanotubes
|
Lin, MF; Chuu, DS; Shung, KWK |
| 臺大學術典藏 |
2018-09-10T07:09:18Z |
Thermal conduction analysis on microwave IC packages
|
J.-F. Kiang; S.-P. Liu; W.-T. Lo; JEAN-FU KIANG |
| 國立成功大學 |
2001-04 |
Thermal conduction of a circular inclusion with variable interface parameter
|
Chen, Tungyang |
| 國立臺灣科技大學 |
2013 |
Thermal conductive performance of organosoluble polyimide/BN and polyimide/(BN + ALN) composite films fabricated by a solution-cast method
|
Kuo, D.H.;Lin, C.Y.;Jhou, Y.C.;Cheng, J.Y.;Liou, G.S. |
| 臺大學術典藏 |
2018-09-10T09:43:06Z |
Thermal conductive performance of organosoluble polyimide/BN and polyimide/(BN + ALN) composite films fabricated by a solution-cast method
|
GUEY-SHENG LIOU;Liou, G.S.;Cheng, J.Y.;Jhou, Y.C.;Lin, C.Y.;Kuo, D.H.;GUEY-SHENG LIOU; Kuo, D.H.; Lin, C.Y.; Jhou, Y.C.; Cheng, J.Y.; Liou, G.S.; GUEY-SHENG LIOU |
| 元智大學 |
2015-07-12 |
THERMAL CONDUCTIVITIES OF ALIGNED CNT NANOCOMPOSITES
|
M. W. Wang; C. C. Liao; Niann-i YU |
| 元智大學 |
2011-12-10 |
Thermal Conductivities of CNT/Epoxy Composites
|
C. Huang; Niann-i YU |
| 元智大學 |
2017-07-16 |
THERMAL CONDUCTIVITIES OF GNP/CNT/EPOXY COMPOSITES
|
C.P. Su; Niann-i YU |
| 元智大學 |
2015-11-20 |
Thermal Conductivities of GNP/CNT/Epoxy Nanocomposites
|
C. P. Su; Niann-i YU |
| 元智大學 |
2014-11-21 |
Thermal Conductivities of GNP/Epoxy Composites
|
K. Y. Huang; Niann-i YU |
| 元智大學 |
2006-12 |
Thermal conductivities of multiwalled carbon nanotube/epoxy Composites
|
江右君; 唐伯偉; 余念一 |
| 元智大學 |
2020 |
Thermal Conductivity Analysis and Optimization of the Locking Positions of a DC-DC Voltage Converter for the Hybrid Electric Vehicle Power System
|
Di-Jun Chen; 陳帝均 |
| 國立成功大學 |
2017 |
Thermal conductivity and dielectric properties of PEDOT:PSS-AlN filler reinforced water-soluble polymer composites
|
Yang;Chang-Ting;Hsiang;Hsing-I;Huang;Tzu-Sheng;Huang;Pei-Chen;Han;Yu-Kai |
| 國立臺灣科技大學 |
2013 |
Thermal conductivity and electrical conductivity of silicone rubber filled with aluminum nitride and aluminum powder
|
Chiu, H.-T.;Liu, Y.-L.;Lin, C.-W.;Shong, Z.-J.;Tsai, P.-A. |
| 臺大學術典藏 |
2021-10-21T23:28:13Z |
Thermal conductivity and electrical resistivity of single copper nanowires
|
Peng, Wei Tsu; Chen, Fu Ren; MING-CHANG LU |
| 國立勤益科技大學 |
2011-07 |
Thermal Conductivity and Morphology of Silver-Filled Multi-Walled Carbon Nanotubes/Polyimide Nanocomposite Films
|
蔡美慧 |
| 中國文化大學 |
2019-10 |
Thermal conductivity and stability for ultrathin SiO2 nanowires: insight from molecular dynamics simulation
|
Su, CH (Su, Chia-Hao); Chen, HL (Chen, Hui-Lung); Ju, SP (Ju, Shin-Pon); Liao, BY (Liao, Bo-Yuan); Pan, CT (Pan, Cheng-Tang) |
| 國立交通大學 |
2014-12-08T15:20:33Z |
Thermal conductivity and structure of non-covalent functionalized graphene/epoxy composites
|
Teng, Chih-Chun; Ma, Chen-Chi M.; Lu, Chu-Hua; Yang, Shin-Yi; Lee, Shie-Heng; Hsiao, Min-Chien; Yen, Ming-Yu; Chiou, Kuo-Chan; Lee, Tzong-Ming |
| 元智大學 |
2012-07-01 |
Thermal conductivity enhancement and shape-stabilization of phase change materials using nanographite additives
|
J.N. Shi; N.W. Pu; Y.M. Liu; Y.C. Fan; N.T. Wen; C.K. Lin; M.D. Ger |
| 元智大學 |
Oct-15 |
Thermal Conductivity from Hierarchical Heat Sinks Using Carbon Nanotubes and Graphene Nanosheets
|
Chien-Te Hsieh; C.-E. Lee; Y.-F. Chen; J.-K. Chang; H. Teng |
| 元智大學 |
Oct-15 |
Thermal Conductivity from Hierarchical Heat Sinks Using Carbon Nanotubes and Graphene Nanosheets
|
Chien-Te Hsieh; C.-E. Lee; Y.-F. Chen; J.-K. Chang; H. Teng |
| 淡江大學 |
2005-02 |
Thermal conductivity in the doped two-leg ladder antiferromagnet Sr_14-x Ca_x Cu_24 O_41
|
Qin, Jihong; Feng, Shiping; Yuan, Feng; Chen, Wei-yeu |
| 臺大學術典藏 |
2008 |
Thermal conductivity measurement and interface thermal resistance estimation using SiO2 thin film
|
Chang, Tien-Yao; Yao, Da-Jeng; Huang, Mei-Jiau; Chien, Heng-Chieh; Chien, Heng-Chieh; Yao, Da-Jeng; Huang, Mei-Jiau; Chang, Tien-Yao |
| 國立臺灣大學 |
2008 |
Thermal conductivity measurement and interface thermal resistance estimation using SiO2 thin film
|
Chien, Heng-Chieh; Yao, Da-Jeng; Huang, Mei-Jiau; Chang, Tien-Yao |
| 淡江大學 |
2009-07 |
Thermal conductivity modeling of compacted type nanocomposites
|
Hsieh, Tse-yang; Yang, Jaw-yen; Hong, Zuu-chang |
| 國立臺灣大學 |
2010 |
Thermal conductivity modeling of micro- and nanoporous silicon
|
Liu, Liang-Chun; Huang, Mei-Jiau |
| 國立臺灣海洋大學 |
2012-06 |
Thermal conductivity modeling of periodic porous silicon with aligned cylindrical pores
|
Tse-Yang Hsieh; Herng Lin; Tsang-Jen Hsieh; Juan-Chen Huang |
| 國立臺灣海洋大學 |
2012 |
Thermal conductivity modeling of periodic porous silicon with aligned cylindrical pores
|
Tse-Yang Hsieh;Herng Lin;Tsang-Jen Hsieh;and Juan-Chen Huang |
| 臺大學術典藏 |
2020-05-22T05:37:19Z |
Thermal conductivity of B-C-N and BN nanotubes
|
Chang, C.W.; Han, W.-Q.; Zettl, A. |
| 臺大學術典藏 |
2020-05-22T05:37:19Z |
Thermal conductivity of B-C-N and BN nanotubes
|
Zettl, A.; Han, W.-Q.; Chang, C.W. |
| 臺大學術典藏 |
2020-04-28T07:11:27Z |
Thermal conductivity of boron nitride nanoribbons: Anisotropic effects and boundary scattering
|
Chen, Y.-C.; Lee, S.-C.; Liu, T.-H.; Chang, C.-C.; CHIEN-CHENG CHANG |
| 國立成功大學 |
2009-04-08 |
Thermal conductivity of carbon nanotubes with quantum correction via heat capacity
|
Wu, Michael C. H.; Hsu, Jang-Yu |
| 國立成功大學 |
2009-04-01 |
Thermal conductivity of carbon nanotubes with quantum correction via heat capacity
|
Wu, Michael; Hsu, J. Y. |
| 國立成功大學 |
2016-05 |
Thermal Conductivity of Epoxy Resin Composites Filled with Combustion Synthesized h-BN Particles
|
Chung, Shyan-Lung; Lin, Jeng-Shung |
| 國立成功大學 |
2018-12 |
Thermal conductivity of epoxy resin composites filled with combustion-synthesized AlN powder
|
Chung;Shyan-Lung;Lin;Jeng-Shung |
| 國立臺灣大學 |
1991 |
Thermal Conductivity of Glass Fiber Reinforced Polypropylene Under High Pressure
|
Yeh, C. L.; Tseng, H. C.; Wang, Y. Z.; 謝國煌; Yeh, C. L.; Tseng, H. C.; Wang, Y. Z.; Hsieh, Kuo-Huang |
| 國立臺灣大學 |
1964 |
Thermal Conductivity of Liquids
|
林聖賢; Eyring, H.; Davis, W. J.; Lin, Sheng-Hsien; Eyring, H.; Davis, W. J. |
| 國立交通大學 |
2020-07-01T05:22:07Z |
Thermal Conductivity of Multiwalled Carbon Nanotubes-Kapok Seed Oil-Based Nanofluid
|
Ul Islam, Badar; Mukhtar, Ahmad; Saqib, Sidra; Mahmood, Abid; Rafiq, Sikander; Hameed, Ayesha; Khan, Muhammad Saad; Hamid, Khalid; Ullah, Sami; Al-Sehemi, Abdullah G.; Ibrahim, Muhammad |
| 臺大學術典藏 |
2018-09-10T07:31:04Z |
Thermal Conductivity of Nanofluid with Magnetic Nanoparticles
|
PING-HEI CHEN;PING-HEI CHEN;PING-HEI CHEN; PING-HEI CHEN; PING-HEI CHEN |
| 國立交通大學 |
2014-12-08T15:46:31Z |
Thermal conductivity of polyurethane foams
|
Wu, JW; Sung, WF; Chu, HS |
| 臺大學術典藏 |
2008 |
Thermal conductivity of Si/SiGe superlatice film
|
Liu, Chun-Kai; Yu, Chih-Kuang; Chien, Heng-Chieh; Hsu, Chung-Yen; Dai, Ming-Ji; Luo, Guang-Li; Huang, Mei-Jiau; Liu, Chun-Kai; Yu, Chih-Kuang; Chien, Heng-Chieh; Hsu, Chung-Yen; Dai, Ming-Ji; Luo, Guang-Li; Huang, Mei-Jiau |
| 國立臺灣大學 |
2008 |
Thermal conductivity of Si/SiGe superlatice film
|
Liu, Chun-Kai; Yu, Chih-Kuang; Chien, Heng-Chieh; Hsu, Chung-Yen; Dai, Ming-Ji; Luo, Guang-Li; Huang, Mei-Jiau |
| 國立成功大學 |
1980-05 |
Thermal Conductivity on Netron-Irradiated Glassy Carbon
|
周啟 |
| 中華大學 |
2009 |
Thermal Consolidation of a Poroelastic Full Space Subjected to a Decaying Point Heat Source
|
呂志宗; Lu, John C.-C. |
| 大葉大學 |
2006-01 |
Thermal Contact Residual Stress Analysis of Elastic-Plastic Bilayer Micro-Cantilevers with Platinum Electrodes
|
Chen, L.W.;Lee, C.Y.;Tsai, C.H.;chen, Y.C. |
