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Showing items 872251-872260 of 2348719 (234872 Page(s) Totally)
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| 朝陽科技大學 |
2021-05-28 |
Thermal Comfort of a Walking Environment under an Elevated Urban Railway: A Case Study of Taichung Overpass
|
許國威 |
| 中國醫藥大學 |
2007-12 |
Thermal Comfort Requirements for Occupants of Semi-Outdoor and Outdoor Environments in Hot-Humid Regions
|
黃瑞隆(Reuy Lung Hwang); 林子平(Tzu-Ping Lin)* |
| 中國醫藥大學 |
2008.06 |
Thermal comfort requirements in air-conditioned residences in hot-humid climate
|
鄭明仁(Ming-Jen Cheng); 黃瑞隆(Reuy Lung Hwang)* |
| 國立成功大學 |
2004-02 |
Thermal compensation for a chirp fiber bragg grating bonded substrate
|
Chang, Y. M.; Cheng, Chih-Chun; Lo, Yu-Lung |
| 臺大學術典藏 |
2022-09-21T23:30:34Z |
Thermal Compression Cu-Cu bonding using electroless Cu and the evolution of voids within bonding interface
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Huang, C. H.; Shih, P. S.; Huang, J. H.; Grafner, S. J.; Chen, Y. A.; Kao, C. R. |
| 國立交通大學 |
2019-04-03T06:39:00Z |
Thermal conductance and the Peltier coefficient of carbon nanotubes
|
Lin, MF; Chuu, DS; Shung, KWK |
| 臺大學術典藏 |
2018-09-10T07:09:18Z |
Thermal conduction analysis on microwave IC packages
|
J.-F. Kiang; S.-P. Liu; W.-T. Lo; JEAN-FU KIANG |
| 國立成功大學 |
2001-04 |
Thermal conduction of a circular inclusion with variable interface parameter
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Chen, Tungyang |
| 國立臺灣科技大學 |
2013 |
Thermal conductive performance of organosoluble polyimide/BN and polyimide/(BN + ALN) composite films fabricated by a solution-cast method
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Kuo, D.H.;Lin, C.Y.;Jhou, Y.C.;Cheng, J.Y.;Liou, G.S. |
| 臺大學術典藏 |
2018-09-10T09:43:06Z |
Thermal conductive performance of organosoluble polyimide/BN and polyimide/(BN + ALN) composite films fabricated by a solution-cast method
|
GUEY-SHENG LIOU;Liou, G.S.;Cheng, J.Y.;Jhou, Y.C.;Lin, C.Y.;Kuo, D.H.;GUEY-SHENG LIOU; Kuo, D.H.; Lin, C.Y.; Jhou, Y.C.; Cheng, J.Y.; Liou, G.S.; GUEY-SHENG LIOU |
Showing items 872251-872260 of 2348719 (234872 Page(s) Totally)
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