| 臺大學術典藏 |
2021-09-02T00:04:00Z |
Thermoelectric transport of the half-filled lowest Landau level in a p-type Ge/SiGe heterostructure
|
Liu X;Lu T.-M;Harris C.T;Lu F.-L;Liu C.-Y;Li J.-Y;Liu C.W;Du R.-R.; Liu X; Lu T.-M; Harris C.T; Lu F.-L; Liu C.-Y; Li J.-Y; Liu C.W; Du R.-R.; CHEE-WEE LIU |
| 國立臺灣大學 |
2009-12 |
Thermoelectric Water-Cooling Device Applied to Electronic Equipment
|
Huang, H. S.; Weng, Y. C.; Chang, Y. W.; Chen, S. L. |
| 國立臺灣大學 |
2010 |
Thermoelectric water-cooling device applied to electronic equipment
|
Huang, Hsiang-Sheng; Weng, Ying-Che; Chang, Yu-Wei; Chen, Sih-Li; Ke, Ming-Tsun |
| 國立臺灣大學 |
1995-03 |
THERMOELECTRIC-POWER STUDY ON HIGH-T-C BI-2212 AND BI-2223 OXIDES INTERCALATED WITH ORGANIC-MOLECULES ZINCPHTHALOCYANINE
|
HUANG, ZJ; LIN, JG; LIN, JJ; et al. |
| 國立臺灣海洋大學 |
2012-04 |
Thermoelectrics with earth abundant elements: high performance p-type PbS nanostructured with SrS and CaS.
|
Zhao LD1; He J; Wu CI; Hogan TP; Zhou X; Uher C; Dravid VP; Kanatzidis MG |
| 國立成功大學 |
2012-03 |
Thermogelling polymers composed of poly(cyclohexylenedimethylene adipate) and poly(ethylene glycol)
|
Tsai, Yuhsin; Jheng, Li-Cheng; Hsu, Steve Lien-Chung |
| 中國醫藥大學 |
2012-03 |
Thermogelling polymers composed of poly(cyclohexylenedimethylene adipate) and poly(ethylene glycol)
|
蔡育勳(Yuhsin Tsai)*;(Li-Cheng Jheng);(Lien-Chung Hsu) |
| 國立臺灣大學 |
2000-06 |
Thermographic study of palmar and facial skin temperature of hyperhidrosis patients before and after thoracic sympathectomy
|
Tsai, JC; Lim, KB; Lin, SY; Kao, MC |
| 臺大學術典藏 |
2018-09-10T03:31:46Z |
Thermographic study of palmar and facial, skin temperature of hyperhidrosis patients before and after thoracic sympathectomy
|
Tsai, J.-C. and Lim, K.-B. and Lin, S.-Y. and Kao, M.-C.; JUI-CHANG TSAI |
| 臺大學術典藏 |
2020-02-27T03:47:05Z |
Thermographic study of palmar and facial, skin temperature of hyperhidrosis patients before and after thoracic sympathectomy
|
Jui-Chang Tsai;Lim K.-B.;Lin S.-Y.;Kao M.-C.; JUI-CHANG TSAI; Lim K.-B.; Lin S.-Y.; Kao M.-C. |
| 國立臺灣大學 |
1993-09 |
Thermography in Pain Clinic
|
林慶美; 吳宗正; 林仙養; 劉健強; Lim, K. B.; Wu, T. J.; Lin, Shian-Yeang; Liu, Chien-Chiang |
| 國立成功大學 |
2013-05 |
Thermogravimetric analysis and kinetics of co-pyrolysis of raw/torrefied wood and coal blends
|
Lu, Ke-Miao; Lee, Wen-Jhy; Chen, Wei-Hsin; Lin, Ta-Chang |
| 國立臺灣大學 |
2000-02 |
Thermogravimetric Analysis of Activated Sludge Flocculated with Polyelectrolyte.
|
Chu, C.P.; Chang, C.Y.; Lee, D.J. |
| 國立臺灣大學 |
2001-02 |
Thermogravimetric Analysis of Corn Cob Impregnated with Zinc Chloride for Preparation of Activated Carbon.
|
Tsai, W.T.; Chang, C.Y.; Wang, S.Y.; Lee, S.L. |
| 國立成功大學 |
2017 |
Thermogravimetric analysis of sludge pyrolysis oil mixed with heavy fuel oil
|
Chatelier, S.;Kuan, Y.H.;Chen, G.-B.;Lin, H.-T.;Lin, T.-H. |
| 國家衛生研究院 |
2004-06-07 |
Thermoinactivaion analysis of vacuolar H+-pyrophosphatase
|
Yang, SH; Jiang, SS; Hsiao, YY; Van, RC; Pan, YJ; Pan, RL |
| 亞洲大學 |
2011-06 |
Thermokinetic parameters and thermal hazard evaluation for three organic peroxides by DSC and TAM III
|
Shang-Hao Liu;Chun-Ping Lin;Chi-Min Shu |
| 義守大學 |
2015-11 |
Thermolability, enzymatic degradation and aminolysis of solution-grown single crystals of novel poly(ethylene succinate-co-5mol% trimethylene succinate)s
|
Wen-Chuan Hsieh;Guan-Cheng Chen;Chun-Che Sung;Ken-Ichi Kasuya;Yuya Tachibana;Chi-he Chen;Ming Chen;Tzong-Rong Ling;Chih-Pong Chang |
| 國立交通大學 |
2014-12-08T15:06:01Z |
THERMOLUMINESCENT RESPONSE OF THULIUM ACTIVATED CALCIUM FLUORIDES TO COPPER K-ALPHA X-RADIATION
|
CHIOU, BS; LIU, JI; HSU, PC; WENG, PS |
| 臺大學術典藏 |
2018-09-10T06:57:17Z |
Thermolysis of tert-butyl cubanepercarboxylate. The cubyl radical
|
Luh, T.-Y.;Stock, L.M.; Luh, T.-Y.; Stock, L.M.; TIEN-YAU LUH |
| 國立成功大學 |
2013-03 |
Thermomagnetic characterization in AISI 316L austenitic stainless steel fibers with various true strains
|
Yang, Shun-Tung; Shyr, Tien-Wei; Hwang, Weng-Sing; Ko, Cheng-Nan |
| 國立臺灣大學 |
1996 |
Thermomagnetic effect in ferrofluids with weakly coupled particles
|
Jang, I. J.; Yao, Y. D.; Klik, I.; Horng, H. E.; Yang, H. C. |
| 東海大學 |
2010 |
Thermomagnetic irreversibility and magnetic short range ordering in Mn2.5Co0.5O4 tetragonal spinel thin films
|
王昌仁; Kuo, K.M., Chern, G., Li, Y.Y. and Wang, C.R. |
| 國立交通大學 |
2020-10-05T02:00:30Z |
THERMOMAGNETIC MICRO-TRACKS-GUIDED MAGNETIC BEAD MANIPULATION: A DEMONSTRATION OF MOVING BEAD ACROSS DIFFERENT TRACKS ENABLED BY NOVEL EMBEDDED ON-CHIP MICRO HEATING WIRES
|
Fang, Lin-Huei; Duan, Hao; Chen, Chin-Chung; Cheng, Chin-Cheng; Chung, Tien-Kan |
| 國立臺灣大學 |
1993-11 |
Thermomagnetic Properties of Hysteresis, Coercivity and Dynamic Switching Field Distribution in Micromagnets
|
黃暉理; Huang, Huei-Li |
| 國立臺灣大學 |
1995 |
Thermomagnetics of reversible transverse susceptibility
|
Yang, Jyh-Shinn; Chang, Ching-Ray; Klik, Ivo |
| 臺大學術典藏 |
2019-12-20T01:17:41Z |
Thermomagnetics of Reversible Transverse Susceptibility
|
Yang, Js;Chang, Cr;Klik, I.; Yang, Js; Chang, Cr; Klik, I.; CHING-RAY CHANG |
| 國立成功大學 |
2008-05-15 |
Thermomechanical and optical characteristics of stretched polyvinylidene fluoride
|
Chang, Wen-Yang; Fang, Te-Hua; Lin, Yu-Cheng |
| 國立高雄第一科技大學 |
2004.04 |
Thermomechanical Behavior of Underfill/Solder Mask/Substrate Interface UnderThermal Cycling
|
C.-H.Chien;Y.-C.Chen, C.-C;Hsieh, Y.-T.;Chiou;Y.-D.Wu;Chen, T.-R; 謝其昌 |
| 臺大學術典藏 |
2018-09-10T05:58:00Z |
Thermomechanical criteria for overlay alignment in flexible thin-film electronic circuits
|
Gleskova, H.; Cheng, I.-C.; Wagner, S.; Suo, Z.; I-CHUN CHENG |
| 義守大學 |
2005-07 |
Thermomechanical effects on adsorbed water in clays around a heat source
|
Chenmin Ma;Tomasz Hueckel |
| 國立臺灣大學 |
2010 |
Thermomechanical models for the dynamics and melting processes in the Mariana subduction system
|
Lin, Shu-Chuan; Kuo, Ban-Yuan; Chung, Sun-Lin |
| 國立成功大學 |
2022-03-25 |
Thermomechanical properties of cold-sprayed copper coatings from differently fabricated powders
|
Wei;Jun, Fu;chou;Yen, Bang;Fung;Zhong, Kuan;Tsai;Yi, Shu |
| 國立中山大學 |
2007 |
Thermomechanical Properties of Nanosilica Reinforced PEEK Composites
|
Y.H. Lai;M.C. Kuo;J.C. Huang;M. Chen |
| 國立中山大學 |
2007 |
Thermomechanical Properties of Nanosilica Reinforced PEEK Composites
|
Y.H. Lai;M.C. Kuo;J.C. Huang;M. Chen |
| 國立中山大學 |
2006-10-22 |
Thermomechanical Properties of Nanosilica Reinforced PEEK Composites
|
Y.H. Lai;M.C. Kuo;J.C. Huang;M. Chen |
| 國立臺灣海洋大學 |
1995 |
Thermomechanical Response Analysis of Lithographic Mask Structure Using FEM
|
D. C. Li;S. W. Chyuan;J. T. Chen;C. Y. Sun |
| 國立中山大學 |
2000 |
Thermomechanical Treatment in Processing High Strain Rate Superplastic 6061 Al with 1% SiO2?nano-Particles
|
T.D. Wang;J.C. Huang |
| 中華大學 |
2005 |
Thermometer Code Current Mode 8-bits Digital-to-Analog Converter Design
|
林君明; Lin, Jium-Ming |
| 臺大學術典藏 |
2018-09-10T15:21:01Z |
Thermometry for Dirac fermions in graphene
|
Hsu, C.-S.; Lo, S.-T.; Chuang, C.; Huang, L.-I.; Woo, T.-P.; Liang, C.-T.; Fukuyama, Y.; Yang, Y.; Elmquist, R.E.; Wang, P.; Lin, X.; Liu, F.-H.; CHI-TE LIANG et al. |
| 臺大學術典藏 |
2019-12-27T01:16:42Z |
Thermometry for Dirac fermions in graphene
|
Liu, F.-H.; Hsu, C.-S.; Lo, S.-T.; Chuang, C.; Huang, L.-I.; Woo, T.-P.; Liang, C.-T.; Fukuyama, Y.; Yang, Y.; Elmquist, R.E.; Wang, P.; Lin, X.; TAK-PONG WOO |
| 國立交通大學 |
2014-12-08T15:30:49Z |
Thermomigration in eutectic-SnPb solder with Cu UBM at the room temperature
|
Lin, Jie An; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:14:17Z |
Thermomigration in flip-chip SnPb solder joints under alternating current stressing
|
Hsiao, Hsiang-Yao; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:09:48Z |
Thermomigration in Pb-free SnAg solder joint under alternating current stressing
|
Hsiao, Hsiang-Yao; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:29:18Z |
Thermomigration in solder joints
|
Chen, Chih; Hsiao, Hsiang-Yao; Chang, Yuan-Wei; Ouyang, Fanyi; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:11:46Z |
Thermomigration of Cu-Sn and Ni-Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints
|
Chen, Hsiao-Yun; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:22:41Z |
Thermomigration of Ti in flip-chip solder joints
|
Chen, Hsiao-Yun; Lin, Han-Wen; Liu, Chien-Min; Chang, Yuan-Wei; Huang, Annie T.; Chen, Chih |
| 國立中山大學 |
2009 |
Thermomigration versus electromigration in microelectronics solder joints
|
M.F. Abdulhamid;C. Basaran;Y.S. Lai |
| 國立臺灣大學 |
1989 |
Thermophilic and Thermotolerant Fungi in Taiwan (I)
|
Chen, G. Y.; 陳瑞青; Chen, G. Y.; Chen, Zuei-Ching |
| 國立臺灣大學 |
1990 |
Thermophilic and Thermotolerant Fungi in Taiwan (II)
|
Chen, G. Y.; 陳瑞青; Chen, G. Y.; Chen, Zuei-Ching |
