| 中原大學 |
2002 |
Thermal Stability of Epoxy Resins Containing Flame Retardant Components: An Evaluation with Thermogravimetric Analysis
|
Chuan Shao Wu;Ying Ling Liu;Yie Chan Chiu;Yie Shun Chiu |
| 中原大學 |
2004-03 |
Thermal stability of epoxy-silica hybrid materials by thermogravimetric analysis
|
Ying-Ling Liu;Wen-Lung Wei;Keh-Ying Hsu;Wen-Hsuan Ho |
| 中原大學 |
2004 |
Thermal stability of epoxy-silica hybrid materials by thermogravimetric analysis
|
Ying-Ling Liu;Wen-Lung Wei;Keh-Ying Hsu;Wen-Hsuan Ho |
| 國立臺灣大學 |
1999-05 |
Thermal stability of fullerene-linked oligoaniline star macromolecules
|
Wang, LY; Anantharaj, V; Chu, CC; Chiang, LY |
| 臺大學術典藏 |
2020-05-12T02:53:06Z |
Thermal stability of grain structure and material properties in an annealing twinned Ag-4Pd alloy wire
|
Chuang, T.-H.; Lin, H.-J.; Chuang, C.-H.; Shiue, Y.-Y.; Shieu, F.-S.; Huang, Y.-L.; Hsu, P.-C.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:09Z |
Thermal stability of grain structure and material properties in an annealing-twinned Ag-8Au-3Pd alloy wire
|
Chuang, T.-H.; Wang, H.-C.; Tsai, C.-H.; Chang, C.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:27:50Z |
Thermal stability of grain structure for Ag nanotwinned films sputtered with substrate bias
|
Lai Y.-C;Wu P.-C;Chuang T.-H.; Lai Y.-C; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:30:50Z |
Thermal stability of grain structure for Ag nanotwinned films sputtered with substrate bias
|
Lai Y.-C;Wu P.-C;Chuang T.-H.; Lai Y.-C; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-09-21T23:19:31Z |
Thermal stability of grain structure for Ag nanotwinned films sputtered with substrate bias
|
Lai, Yu Chang; Wu, Po Ching; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-03-22T08:30:51Z |
Thermal stability of grain structure for Ag nanotwinned films sputtered with substrate bias
|
Lai Y.-C;Wu P.-C;Chuang T.-H.; Lai Y.-C; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG |
| 國立聯合大學 |
2009 |
Thermal stability of hafnium and hafnium nitride gates on HfO2 gate dielectrics
|
Tsai, CH; Lai, YS; Chen, JS |
| 國立成功大學 |
2009-11-13 |
Thermal stability of hafnium and hafnium nitride gates on HfO2 gate dielectrics
|
Tsai, Chih-Huang; Lai, Yi-Sheng; Chen, Jen-Sue |
| 國立東華大學 |
2008-12 |
Thermal stability of hard transparent AlxCoCrCuFeNi oxide films
|
Wong,M.S.; Chen,T.K. |
| 國立成功大學 |
2021 |
Thermal Stability of HfO2|AlGaN|GaN Normally-Off Transistors with Ni|Au and Pt Gate Metals
|
Lin, Y.-C.;Niu, J.-S.;Liu, W.-C.;Tsai, J.-H. |
| 國立成功大學 |
2013-09 |
Thermal Stability of High-Power LEDs Analyzed With Efficient Nondestructive Methodology
|
Lee, Pei-Hsuan; Chou, Jung-Hua; Tseng, Hsien-Cheng |
| 中原大學 |
1996 |
Thermal Stability of Horizontally Superposed Porous and Fluid Layers in a Rotating System
|
Jong Jhy Jou;Kuang Yuan Kung;Cheng Hsing Hsu |
| 國立成功大學 |
2008-03-31 |
Thermal stability of indium tin oxide thin films co-sputtered with zinc oxide
|
Liu, Day-Shan; Sheu, Chia-Sheng; Lee, Ching-Ting; Lin, Chun-Hsing |
| 國立臺灣海洋大學 |
2013-12 |
Thermal stability of Ir–Re coatings annealed in oxygen containing atmospheres
|
Shih-Chang Liu; Yung-I Chen; Hung-Yin Tsai; Kuo-Cheng Lin; Yung-Hsing Chen |
| 國立臺灣海洋大學 |
2019-03 |
Thermal stability of laminated Ru–Al/Ru–Al–Zr coatings on Inconel 617
|
Yung-I Chen; Jia-Wei Jhang |
| 國立臺灣大學 |
1989 |
Thermal Stability of Mo-γ-Fe2O3 Particles
|
郭博成; Hsu, J. H.; Hsu, C. W.; Kuo, Po-Cheng; Hsu, J. H.; Hsu, C. W. |
| 元智大學 |
2013-01 |
Thermal Stability of MWCNTs Reinforced Nanocomposites
|
Shiuh-Chuan Her; Chun-Yu Lai |
| 國立交通大學 |
2014-12-08T15:07:42Z |
Thermal Stability of Nickel Silicide and Shallow Junction Electrical Characteristics with Carbon Ion Implantation
|
Tsui, Bing-Yue; Lee, Chen-Ming |
| 元智大學 |
2008-04 |
Thermal stability of ordered mesoporous yttria-stabilized zirconia
|
洪逸明; Kuan- Zong Fung; De-Tsai Hung; Min-Hsiung Hon |
| 國立成功大學 |
2008 |
Thermal stability of ordered mesoporous yttria-stabilized zirconia
|
Hung, I-Ming; Fung, Kuan-Zong; Hung, De-Tsai; Hon, Min-Hsiung |
| 國立臺灣科技大學 |
2013 |
Thermal stability of organofunctional polysiloxanes
|
Pham, Q.-T.;Chern, C.-S. |
| 國立交通大學 |
2014-12-08T15:41:11Z |
Thermal stability of plasma-treated ohmic contacts to n-GaN
|
Lee, CC; Lin, SD; Lee, CP; Yeh, MH; Lee, WI; Kuo, CT |
| 臺大學術典藏 |
2018-09-10T03:26:01Z |
Thermal stability of poly(oxyalkylene)amine-grafted polypropylene copolymers
|
JIANG-JEN LIN;Wei, K.-M.;Shau, S.-M.;Lin, J.-J.;JIANG-JEN LIN; Lin, J.-J.; Shau, S.-M.; Wei, K.-M.; JIANG-JEN LIN |
| 國立交通大學 |
2014-12-08T15:26:54Z |
Thermal stability of PVD TiN gate and its impacts on characteristics of CMOS transistors
|
Wang, MF; Kao, YC; Huang, TY; Lin, HC; Chang, CY |
| 國立臺灣海洋大學 |
2018-07 |
Thermal stability of Ru–Al multilayered thin films on Inconel 617
|
Yung-I Chen; Zhi-Ting Zheng; Jia-Wei Jhang |
| 國立交通大學 |
2014-12-08T15:48:55Z |
Thermal stability of selective chemical vapor deposited tungsten contact and effects of in situ N-2 plasma treatment
|
Wang, MT; Wang, PC; Chuang, MC; Chen, LJ; Chen, MC |
| 國立交通大學 |
2020-02-02T23:55:33Z |
Thermal Stability of Shallow Ge N+-P Junction with Thin GeSn Top Layer
|
Liao, Hsiu-Hsien; Chen, Yi-Ju; Tsui, Bing-Yue |
| 臺大學術典藏 |
1999 |
Thermal stability of Si/Si1 – x – yGexCy/Si quantum wells grown by rapid thermal chemical vapor deposition
|
Liu, C. W.; Tseng, Y. D.; Chern, M. Y.; Chang, C. L.; Sturm, J. C.Liucw; Liu, C. W.; Tseng, Y. D.; Chern, M. Y.; Chang, C. L.; Sturm, J. C.; LiuCW |
| 國立臺灣大學 |
1999 |
Thermal stability of Si/Si1 – x – yGexCy/Si quantum wells grown by rapid thermal chemical vapor deposition
|
Liu, C. W.; Tseng, Y. D.; Chern, M. Y.; Chang, C. L.; Sturm, J. C. |
| 臺大學術典藏 |
2018-09-10T07:29:05Z |
Thermal stability of Si/Si1-x-yGexCy/Si quantum wells grown by rapid thermal chemical vapor deposition
|
Liu, C.W.; Tseng, Y.D.; Chern, M.Y.; Chang, C.L.; Sturm, J.C.; MING-YAU CHERN |
| 臺大學術典藏 |
2018-09-10T07:37:20Z |
Thermal stability of Si/Si1-x-yGexCy/Si quantum wells grown by rapid thermal chemical vapor deposition
|
Liu, C.W.; Tseng, Y.D.; Chern, M.Y.; Chang, C.L.; Sturm, J.C.; CHEE-WEE LIU |
| 國立臺灣大學 |
2004 |
Thermal stability of some naphthalene- and phenyl-based epoxy resins
|
Duann, Yeh-Fang; Liu, Tsan-Min; Cheng, Kuo-Chung; Su, W.-F. |
| 國立臺灣大學 |
2004 |
Thermal stability of some naphthalene- and phenyl-based epoxy resins
|
Duann, Yeh-Fang; Liu, Tsan-Min; Cheng, Kuo-Chung; Su, W.-F. |
| 臺大學術典藏 |
2018-09-10T05:02:51Z |
Thermal stability of some naphthalene- and phenyl-based epoxy resins
|
WEI-FANG SU;Su, W.-F.;Cheng, K.-C.;Liu, T.-M.;Duann, Y.-F.;WEI-FANG SU; Duann, Y.-F.; Liu, T.-M.; Cheng, K.-C.; Su, W.-F.; WEI-FANG SU |
| 國立成功大學 |
2001-09 |
Thermal stability of sputtered tungsten carbide as diffusion barrier for copper metallization
|
Wang, Shui-Jinn; Tsai, Hao-Yi; Sun, Shi-Chung; Shiao, M. H. |
| 中原大學 |
1995-06 |
Thermal Stability of Structural Aluminum in the Mesoporous Molecular Sieve MCM-41
|
Zhaohua Luan;Chi-Feng Cheng;Heyong He;Jacek Klinowski |
| 國立成功大學 |
2006-12-20 |
Thermal stability of Ta-Si-N nanocomposite thin films at different nitrogen flow ratios
|
Chung, Chen-Kuei; Chen, T. S.; Peng, C. C.; Wu, B. H. |
| 國立臺灣海洋大學 |
2014-11 |
Thermal stability of TaN, CrTaN, TaSiN, and CrTaSiN hard coatings in oxygen containing atmospheres
|
Yung-I Chen; Kun-Yi Lin; Hsiu-Hui Wang; Kuo-Cheng Lin |
| 國立交通大學 |
2014-12-08T15:18:31Z |
Thermal stability of trimethylsilylated mesoporous silica thin films as the ultralow-k dielectric for copper interconnects
|
Chen, JY; Pan, FM; Chang, L; Cho, AT; Chao, KJ |
| 中國醫藥大學 |
2014-08-21 |
Thermal stability of two monomers used in the chemical process
|
廖家玉(Jia-Yu Liao);陳濰君(Wei-Chun Chen);王義文(Wang, Yih-Wen);徐啟銘(Chi-Min Shu);(Jiann-Rong Chen) |
| 國立交通大學 |
2014-12-08T15:02:38Z |
Thermal stability of W-contacted junction diodes
|
Yeh, WK; Chan, KY; Chang, TC; Chen, MC; Lin, MS |
| 國立交通大學 |
2019-04-02T05:59:09Z |
Thermal stability of W-contacted junction diodes
|
Yeh, WK; Chan, KY; Chang, TC; Chen, MC; Lin, MS |
| 臺大學術典藏 |
2018-09-10T07:40:06Z |
Thermal stability studies of CVD-grown graphene nanoribbons: Defect annealing and loop formation
|
Kim, Y.A.; Hayashi, T.; Morelos-G\\'omez, A.; Hofmann, M.; Muramatsu, H.; Endo, M.; Terrones, H.; Shull, R.D.; Dresselhaus, M.S.; Terrones, M.; Campos-Delgado, J.; Mario Hofmann et al. |
| 國立臺灣科技大學 |
2009 |
Thermal stability study of Cu(MoN x ) seed layer on barrierless Si
|
Chu J.P.; Lin C.H.; Leau W.K.; John V.S. |
| 國立臺灣科技大學 |
2009 |
Thermal Stability Study of Cu(MoNx) Seed Layer on Barrierless Si
|
Chu, J.P.;Lin, C.H.;Leau, W.K.;John, V.S. |
| 國立交通大學 |
2014-12-08T15:42:52Z |
Thermal stability study of Ni/Ta n-GaN Schottky contacts
|
Chen, GL; Chang, FC; Shen, KC; Ou, J; Chen, WH; Lee, MC; Chen, WK; Jou, MJ; Huang, CN |
