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教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
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顯示項目 918056-918065 / 2348419 (共234842頁)
<< < 91801 91802 91803 91804 91805 91806 91807 91808 91809 91810 > >>
每頁顯示[10|25|50]項目
| 國立彰化師範大學 |
2000 |
Wafer Bonding of 50 Mms Diameter Mirror Substrate to AlGaInP Light-emitting Diode Wafer
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Seieh, C. H. ; Horng, R. H. ; Huang, Man-Fang; Wuu, D. S. ; Peng, W. C. ; Tsai, S. J. ; Liu, J. S. |
| 國立彰化師範大學 |
2001 |
Wafer Bonding of 50-mm-Diameter Mirror Substrates to AlGaInP Light-Emitting Diode Wafers
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Horng, R. H. ; Wuu, D. S. ; Seieh, C. H. ; Peng, W. C. ; Huang, Man-Fang; Tsai, S. J. ; Liu, J. S. |
| 國立交通大學 |
2014-12-08T15:26:16Z |
Wafer bonding using indium tin oxide intermediate layer for high brightness LEDs
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Liu, PC; Hou, CY; Wu, YCS |
| 國立臺灣海洋大學 |
2009-12 |
Wafer Defect Inspection by Neural Analysis of Region Features
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Chuan-Yu Chang; Chun-Hsi Li; Yung-Chi Chang; MuDer Jeng |
| 國立交通大學 |
2014-12-08T15:09:01Z |
Wafer defect pattern recognition by multi-class support vector machines by using a novel defect cluster index
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Chao, Li-Chang; Tong, Lee-Ing |
| 國立高雄第一科技大學 |
2012.05 |
Wafer Identification Recognition by Stroke Analysis and Template Matching
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Hsu, Wei-Chih;Yu, Tsan-Ying;Chen, Kuan-Liang |
| 國立交通大學 |
2017-04-21T06:49:36Z |
Wafer Level Batch Fabrication and Assembly of Small Form Factor Optical Pickup Head
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Hsiao, Sheng-Yi; Lee, Chih-Chun; Chiu, Yi; Shih, Hsi-Fu; Chiou, Jin-Chem; Shieh, Han-Ping D.; Fang, Weileun |
| 中華大學 |
2007 |
Wafer Level MEMS Vertical Probe Card Design
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林君明; Lin, Jium-Ming |
| 國立交通大學 |
2014-12-16T06:14:01Z |
Wafer level packaging method and a packaging structure using thereof
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Chen Tsung-Lin; Lien Jui-Chien |
| 中華大學 |
2008 |
Wafer Level Test Vertical Probe Design
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林君明; Lin, Jium-Ming |
顯示項目 918056-918065 / 2348419 (共234842頁)
<< < 91801 91802 91803 91804 91805 91806 91807 91808 91809 91810 > >>
每頁顯示[10|25|50]項目
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