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显示项目 435971-435980 / 2347856 (共234786页)
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| 中國文化大學 |
2004 |
Formation of simple crystal structures in Cu-Co-Ni-Cr-Al-Fe-Ti-V alloys with multiprincipal metallic elements
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Yeh JW; Chen SK; Gan JY; Lin SJ; Chin TS; Shun TT; Tsau CH; Chang SY |
| 臺大學術典藏 |
2018-09-10T14:54:17Z |
Formation of single crystal si-nanowire by electric field self-redistribution effect in anodic oxidation for multilayer array application
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Tian, W.-C.; Tseng, P.-H.;Tian, W.-C.;Pan, S.C.;Hwu, J.-G.; Tseng, P.-H.; JENN-GWO HWU; Hwu, J.-G.; Pan, S.C. |
| 臺大學術典藏 |
2020-06-11T06:10:03Z |
Formation of single crystal si-nanowire by electric field self-redistribution effect in anodic oxidation for multilayer array application
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Tseng, P.-H.;Tian, W.-C.;Pan, S.C.;Hwu, J.-G.; Tseng, P.-H.; Tian, W.-C.; Pan, S.C.; Hwu, J.-G.; WEI-CHENG TIAN |
| 臺大學術典藏 |
2020-06-16T06:32:07Z |
Formation of single-electron-transistors using self-assembly of nanoparticle chains
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Tsai, L.-C.;Cheng, I.-C.;Tu, M.-C.;Chen, C.-D.;Lin, H.-Y.; Tsai, L.-C.; Cheng, I.-C.; Tu, M.-C.; Chen, C.-D.; Lin, H.-Y.; I-CHUN CHENG |
| 國立交通大學 |
2014-12-08T15:28:45Z |
Formation of size-tunable dandelion-like hierarchical rutile titania nanospheres for dye-sensitized solar cells
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Lan, Chi-Ming; Liu, Shang-En; Shiu, Jia-Wei; Hu, Jyun-Yu; Lin, Meng-Hung; Diau, Eric Wei-Guang |
| 國立交通大學 |
2014-12-08T15:05:45Z |
FORMATION OF SLIDING REGIME WITH UNCERTAIN PLANT-PARAMETERS
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HONG, CM; WU, YC |
| 國立交通大學 |
2014-12-08T15:36:03Z |
Formation of Sn-rich phases via the decomposition of Cu6Sn5 compounds during current stressing
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Lin, C. K.; Liu, Chien-Ming; Chen, Chih |
| 南台科技大學 |
2002-12 |
Formation of Solid Sulfur by Decomposition of Carbon Disulfide in the Oxygen-Lean Cold Plasma Environment
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廖渭銅; Tsai Cheng-Hsien; Lee Wen-Jhy; Chen Chuh-Yung; Liao Wei-Tung ; ShihMinliang; |
| 國立成功大學 |
2002-03-20 |
Formation of solid sulfur by decomposition of carbon disulfide in the oxygen-lean cold plasma environment
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Tsai, Cheng-Hsien; Lee, Wen-Jhy; Chen, Chuh-Yung; Liao, Wei-Tung; Shih, Minliang |
| 國立成功大學 |
2015-07 |
Formation of Solid-Solution Cu-to-Cu Joints Using Ga Solder and Pt under Bump Metallurgy for Three-Dimensional Integrated Circuits
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Lin, Shih-kang; Chang, Hao-miao; Cho, Cheng-liang; Liu, Yu-chen; Kuo, Yi-kai |
显示项目 435971-435980 / 2347856 (共234786页)
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每页显示[10|25|50]项目
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