| 中原大學 |
2005 |
Interfacial Phenomena Analysis on Crossflow Ultrafiltration of Protein Mixtures
|
Tung, K. L.;C. L. Li;C. C. Hu; |
| 臺大學術典藏 |
2018-09-10T06:32:06Z |
Interfacial physics in organic light emitting devices
|
Wu, C.-I.; CHIH-I WU |
| 國立交通大學 |
2014-12-08T15:09:08Z |
Interfacial Polar-Bonding-Induced Multifunctionality of Nano-Silicon in Mesoporous Silica
|
Huang, Jung Y.; Shieh, Jia M.; Kuo, Hao C.; Pan, Ci L. |
| 義守大學 |
2008-04 |
Interfacial polarization phenomenon in the recrystallization of poly(butylene succinate)
|
Horng-Jer Tai |
| 國立臺灣大學 |
1991 |
Interfacial Polyfunctional Condensation, ATR Study
|
陳劉旺; Chern, Y. T.; Chen, Leo-Wang; Chern, Y. T. |
| 國立臺灣大學 |
1991 |
Interfacial Polyfunctional Condensation, Curing Reaction
|
陳劉旺; Chern, Y. T.; Chen, Leo-Wang; Chern, Y. T. |
| 國立臺灣大學 |
1991 |
Interfacial Polyfunctional Condensation, Effect of the Reaction Conditions
|
陳劉旺; Chern, Y. T.; Chen, Leo-Wang; Chern, Y. T. |
| 國立臺灣科技大學 |
2008 |
Interfacial polymerized thin-film composite membranes for pervaporation separation of aqueous isopropanol solution
|
Li, C.-L.;Huang, S.-H.;Liaw, D.-J.;Lee, K.-R.;Lai, J.-Y. |
| 南亞技術學院 |
2008-09-22 |
Interfacial polymerized thin-film composite membranes for pervaporation separation of aqueous isopropanol solution
|
Li, CL Li, Chi-Lan; Huang, SH Huang, Shu-Hsien; Liaw, DJ Liaw, Der-Jang; Lee, KR Lee, Kueir-Rarn; Lai, JY Lai, Juin-Yih |
| 國立臺灣科技大學 |
2013 |
Interfacial properties and fatigue behavior of carbon fiber epoxy laminate composites
|
Chiu, H.-T.;Liu, Y.-L.;Liang, K.-C.;Tsai, P.-A. |
| 中國文化大學 |
2006-12-1 |
Interfacial Properties between Poly (p-phenylene-2, 6-benzobisoxazole) (PBO) Fiber and Rubber after Electron Beam Irradiation and Plasma Treatment
|
陳銘進; 邢文灝; 石佩玉 |
| 臺大學術典藏 |
2021-07-06T08:49:50Z |
Interfacial properties of Pluronics and the interactions between Pluronics and cholesterol/DPPC mixed monolayers
|
LIN-CHAU CHANG; Chang Y.-Y.; Gau C.-S. |
| 國立臺灣科技大學 |
2012 |
Interfacial Properties of Polyethylene Glycol/Vinyltriethoxysilane (PEG/VTES) Copolymers and their Application to Stain Resistance
|
Chao, Yin-Chun;Su, Shuenn-Kung;Lin, Ya-Wun;Hsu, Wan-Ting;Huang, Kuo-Shien |
| 國立臺灣科技大學 |
2011 |
Interfacial reaction and electrical characteristics of Cu(RuTaNx) on GaAs: Annealing effects
|
Leau, W.K.;Chu, J.P.;Lin, C.H. |
| 元智大學 |
Jan-15 |
Interfacial Reaction and Mechanical Characterization of Sn-Ag-Cu/Au/Pd(P)/Cu Solder Joints: Thick Pd(P) Deposition
|
Cheng-En Ho; Wan-Zhen Hsieh; Cheng-Hsien Yang; Ting-Chun Yeh; Tsai-Tung Kuo |
| 元智大學 |
Feb-19 |
Interfacial reaction and mechanical reliability between Sn-3Ag-0.5Cu alloy and ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad
|
Ying-Syuan Wu; Pei-Tzu Lee; Wan-Zhen Hsieh; Tsai-Tung Kuo; Cheng-En Ho |
| 元智大學 |
2013-12-1 |
Interfacial reaction and mechanical reliability of PTH solder joints with different solder/surface finish combinations
|
C. H. Kao; H. H. Hua; H. Y. Chan; T. H. Yang; Kuen-Song Lin; Cheng-En Ho |
| 元智大學 |
2013-12-1 |
Interfacial Reaction and Mechanical Reliability of PTH Solder Joints with Different Solder/Surface Finish Combinations
|
Kuen-Song Lin; Cheng-En Ho; Ho-Yang Chan; Shih-Ju Wang; Chin-Hung Kuo |
| 國立交通大學 |
2014-12-08T15:16:20Z |
Interfacial reaction and shear strength of Pb-free SnAg2.5Cu0.86b0.5 and SnAg3.0Cu0.5Sb0.2 solder bumps on Au/Ni(P) metallization
|
Hsu, YC; Huang, YM; Chen, C; Wang, H |
| 國立臺灣大學 |
2012 |
Interfacial Reaction and Wettability of 72Ag-28Cu Braze on CP-Ti Substrate Using Infrared Heating
|
Shiue, R.K.; Wu, S.K.; Chen, F.Y.; Yang, T.E. |
| 臺大學術典藏 |
2018-09-10T09:17:50Z |
Interfacial reaction and wettability of 72Ag-28Cu braze on CP-Ti substrate using infrared heating
|
Lin, Ming-Tsan;Yang, T.E.;Chen, F.Y.;Wu, S.K.;Shiue, R.K.;Yang, T.E.;Chen, F.Y.;Wu, S.K.;Shiue, R.K.;陳炯年;李伯皇;楊博仁;楊偉勛;林明燦;Yu, Linda Chia-Hui;Lee, Po-Huang;Chen, Chiung-Nien;Yang, T.E.;Chen, F.Y.;Nien, Hsiao-Ching;Wu, S.K.;Yang, Wei-Shiung;Shiue, R.K.;SHYI-KAAN WU;Yang, Po-Jen; Shiue, R.K.; Wu, S.K.; Chen, F.Y.; Yang, T.E.; Shiue, R.K.; Wu, S.K.; Chen, F.Y.; Yang, T.E.; Yang, Po-Jen; SHYI-KAAN WU; Shiue, R.K.; Yang, Wei-Shiung; Wu, S.K.; Nien, Hsiao-Ching; Chen, F.Y.; Yang, T.E.; Chen, Chiung-Nien; Lee, Po-Huang; Yu, Linda Chia-Hui; Lin, Ming-Tsan; 林明燦; 楊偉勛; 楊博仁; 李伯皇; 陳炯年 |
| 國立臺灣大學 |
2010 |
Interfacial Reaction Between 95Pb-5Sn Solder Bump and 37Pb-63Sn Presolder in Flip-Chip Solder Joints
|
Chang, C.C.; Wang, Y.W.; Lai, Y.S.; Kao, C.R. |
| 臺大學術典藏 |
2020-04-28T07:11:48Z |
Interfacial Reaction Between 95Pb-5Sn Solder Bump and 37Pb-63Sn Presolder in Flip-Chip Solder Joints
|
Chang, C. C.; Wang, Y. W.; Lai, Y. S.; Kao, C. R.; CHIEN-CHENG CHANG |
| 國立交通大學 |
2014-12-08T15:17:35Z |
Interfacial Reaction Between Eutectic Sn-Pb Solder and Electroplated-Ni as well as Electroless-Ni Metallization During Reflow
|
Chen, Hsiao-Yun; Chen, Chih |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Interfacial reaction between liquid Sn-20In-2.8Ag solder and Ag substrate
|
Chiang, M.J.; Chuang, T.H.; TUNG-HAN CHUANG |
