| 國立成功大學 |
2002-05 |
Interfacial reactions and electrical properties of Hf/p-Si0.85Ge0.15
|
Chung, Ming-Shaw; Wang, Ming-Jun; Lin, Wen-Tai; Chang, Tao-Chih; Fang, Yean-Kuen |
| 元智大學 |
2013-03 |
Interfacial Reactions and Electromigration in Flip-Chip Solder Joints
|
Cheng-En Ho; C. R. Kao; K. N. Tu |
| 國立臺灣科技大學 |
2009 |
Interfacial reactions and mechanism properties between SAC 405 and SACNG lead-free solders with Au/Ni(P)/Cu substrates reflowed by CO2 laser
|
Lo S.-C.; Hsieh Y.-P.; Yen Y.-W. |
| 國立東華大學 |
2006 |
Interfacial Reactions between Bi-Ag High Temperature Solders and Metallic Substrates
|
Song,J. M.; Chuang,H. Y.; Wu,Z. M. |
| 國立臺灣科技大學 |
2008 |
Interfacial reactions between Cu alloy and GaAs
|
Chu, J.P.;Leau, W.K.;Lin, C.H. |
| 臺大學術典藏 |
2019-11-27T02:02:30Z |
Interfacial reactions between Cu and Sn, Sn-Ag, Sn-Bi, Sn-Zn solder under space confinement for 3D IC micro joint applications
|
C. ROBERT KAO;Kao C.R.;Yu J.J.;Shih W.L.;Yang T.L.; Yang T.L.; Shih W.L.; Yu J.J.; Kao C.R.; C. ROBERT KAO |
| 國立交通大學 |
2015-07-21T08:28:57Z |
Interfacial reactions between Cu and SnAgCu solder doped with minor Ni
|
Cheng, Hsi-Kuei; Huang, Chin-Wen; Lee, Hsuan; Wang, Ying-Lang; Liu, Tzeng-Feng; Chen, Chih-Ming |
| 國立臺灣科技大學 |
2011 |
Interfacial reactions between high-Pb solders and Ag
|
Lin, C.P.;Chen, C.M.;Yen, Y.W.;Wu, H.J.;Chen, S.W. |
| 國立臺灣大學 |
2000 |
Interfacial Reactions between In10Ag Solders and Ag Substrates
|
Liu, Y. M.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:20Z |
Interfacial reactions between In10Ag solders and Ag substrates
|
TUNG-HAN CHUANG; Chuang, T.H.; Liu, Y.M. |
| 國立臺灣科技大學 |
2017 |
Interfacial reactions between lead-free solders and Cu-40Zn alloys
|
Yen, Yen Y.-W.;Chen, P.-Y.;Chen, G.-D. |
| 國立臺灣科技大學 |
2019 |
Interfacial Reactions Between Lead-Free Solders and Ni-Pd-Co Alloys
|
Yen, Yen Y.-W.;Hsiao, Hsiao H.-M.;Chen, K.-J.;Lin, Y.-S.;Lai, M.-T. |
| 國立臺灣科技大學 |
2009 |
Interfacial reactions between lead-free solders and the multilayer Au/Ni/SUS304 substrate
|
Yen Y.-W.; Lee C.-Y.; Kuo M.-H.; Chao K.-S.; Chen K.-D. |
| 國立臺灣大學 |
2000 |
Interfacial Reactions between Liquid In48Sn Solders and Ag Substrates
|
Huang, Y. T.; Chuang, T. H. |
| 國立臺灣大學 |
2000 |
Interfacial reactions between liquid indium and Au-deposited substrates
|
Liu, Y. M.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:20Z |
Interfacial reactions between liquid indium and Au-deposited substrates
|
Liu, Y.M.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
1999 |
Interfacial reactions between liquid indium and nickel substrate
|
Tseng, Y. H.; Yeh, M. S.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:22Z |
Interfacial Reactions between Liquid Indium and Nickel Substrate
|
Tseng, Y.H.; Yeh, M.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
2000 |
Interfacial Reactions between Liquid Indium and Silver Substrates
|
Liu, Y. M.; Chen, Y. L.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:20Z |
Interfacial reactions between liquid indium and silver substrates
|
Liu, Y.M.; Chen, Y.L.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:16Z |
Interfacial reactions between liquid Sn-8Zn-3Bi solders and Cu substrates
|
Lin, W.H.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立成功大學 |
2011-08 |
Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates
|
Wu, R. W.; Tsao, L. C.; Chang, S. Y.; Jain, C. C.; Chen, R. S. |
| 國立臺灣大學 |
2011 |
Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates
|
Wu, R.W.; Tsao, L.C.; Chang, S.Y.; Jain, C.C.; Chen, R.S. |
| 國立中山大學 |
1989 |
Interfacial Reactions Between Metal and Gallium Arsenide
|
L.C. Lin;K.J. Schulz;K.C. Hsieh;Y.A. Chang |
| 國立臺灣大學 |
1999-01 |
Interfacial reactions between Ni substrate and the component Bi in solders
|
Lee, M. S.; Liu, C. M.; Kao, and C. R. |
