| 臺大學術典藏 |
2018-09-10T03:26:01Z |
Thermal stability of poly(oxyalkylene)amine-grafted polypropylene copolymers
|
JIANG-JEN LIN;Wei, K.-M.;Shau, S.-M.;Lin, J.-J.;JIANG-JEN LIN; Lin, J.-J.; Shau, S.-M.; Wei, K.-M.; JIANG-JEN LIN |
| 國立交通大學 |
2014-12-08T15:26:54Z |
Thermal stability of PVD TiN gate and its impacts on characteristics of CMOS transistors
|
Wang, MF; Kao, YC; Huang, TY; Lin, HC; Chang, CY |
| 國立臺灣海洋大學 |
2018-07 |
Thermal stability of Ru–Al multilayered thin films on Inconel 617
|
Yung-I Chen; Zhi-Ting Zheng; Jia-Wei Jhang |
| 國立交通大學 |
2014-12-08T15:48:55Z |
Thermal stability of selective chemical vapor deposited tungsten contact and effects of in situ N-2 plasma treatment
|
Wang, MT; Wang, PC; Chuang, MC; Chen, LJ; Chen, MC |
| 國立交通大學 |
2020-02-02T23:55:33Z |
Thermal Stability of Shallow Ge N+-P Junction with Thin GeSn Top Layer
|
Liao, Hsiu-Hsien; Chen, Yi-Ju; Tsui, Bing-Yue |
| 臺大學術典藏 |
1999 |
Thermal stability of Si/Si1 – x – yGexCy/Si quantum wells grown by rapid thermal chemical vapor deposition
|
Liu, C. W.; Tseng, Y. D.; Chern, M. Y.; Chang, C. L.; Sturm, J. C.Liucw; Liu, C. W.; Tseng, Y. D.; Chern, M. Y.; Chang, C. L.; Sturm, J. C.; LiuCW |
| 國立臺灣大學 |
1999 |
Thermal stability of Si/Si1 – x – yGexCy/Si quantum wells grown by rapid thermal chemical vapor deposition
|
Liu, C. W.; Tseng, Y. D.; Chern, M. Y.; Chang, C. L.; Sturm, J. C. |
| 臺大學術典藏 |
2018-09-10T07:29:05Z |
Thermal stability of Si/Si1-x-yGexCy/Si quantum wells grown by rapid thermal chemical vapor deposition
|
Liu, C.W.; Tseng, Y.D.; Chern, M.Y.; Chang, C.L.; Sturm, J.C.; MING-YAU CHERN |
| 臺大學術典藏 |
2018-09-10T07:37:20Z |
Thermal stability of Si/Si1-x-yGexCy/Si quantum wells grown by rapid thermal chemical vapor deposition
|
Liu, C.W.; Tseng, Y.D.; Chern, M.Y.; Chang, C.L.; Sturm, J.C.; CHEE-WEE LIU |
| 國立臺灣大學 |
2004 |
Thermal stability of some naphthalene- and phenyl-based epoxy resins
|
Duann, Yeh-Fang; Liu, Tsan-Min; Cheng, Kuo-Chung; Su, W.-F. |
| 國立臺灣大學 |
2004 |
Thermal stability of some naphthalene- and phenyl-based epoxy resins
|
Duann, Yeh-Fang; Liu, Tsan-Min; Cheng, Kuo-Chung; Su, W.-F. |
| 臺大學術典藏 |
2018-09-10T05:02:51Z |
Thermal stability of some naphthalene- and phenyl-based epoxy resins
|
WEI-FANG SU;Su, W.-F.;Cheng, K.-C.;Liu, T.-M.;Duann, Y.-F.;WEI-FANG SU; Duann, Y.-F.; Liu, T.-M.; Cheng, K.-C.; Su, W.-F.; WEI-FANG SU |
| 國立成功大學 |
2001-09 |
Thermal stability of sputtered tungsten carbide as diffusion barrier for copper metallization
|
Wang, Shui-Jinn; Tsai, Hao-Yi; Sun, Shi-Chung; Shiao, M. H. |
| 中原大學 |
1995-06 |
Thermal Stability of Structural Aluminum in the Mesoporous Molecular Sieve MCM-41
|
Zhaohua Luan;Chi-Feng Cheng;Heyong He;Jacek Klinowski |
| 國立成功大學 |
2006-12-20 |
Thermal stability of Ta-Si-N nanocomposite thin films at different nitrogen flow ratios
|
Chung, Chen-Kuei; Chen, T. S.; Peng, C. C.; Wu, B. H. |
| 國立臺灣海洋大學 |
2014-11 |
Thermal stability of TaN, CrTaN, TaSiN, and CrTaSiN hard coatings in oxygen containing atmospheres
|
Yung-I Chen; Kun-Yi Lin; Hsiu-Hui Wang; Kuo-Cheng Lin |
| 國立交通大學 |
2014-12-08T15:18:31Z |
Thermal stability of trimethylsilylated mesoporous silica thin films as the ultralow-k dielectric for copper interconnects
|
Chen, JY; Pan, FM; Chang, L; Cho, AT; Chao, KJ |
| 中國醫藥大學 |
2014-08-21 |
Thermal stability of two monomers used in the chemical process
|
廖家玉(Jia-Yu Liao);陳濰君(Wei-Chun Chen);王義文(Wang, Yih-Wen);徐啟銘(Chi-Min Shu);(Jiann-Rong Chen) |
| 國立交通大學 |
2014-12-08T15:02:38Z |
Thermal stability of W-contacted junction diodes
|
Yeh, WK; Chan, KY; Chang, TC; Chen, MC; Lin, MS |
| 國立交通大學 |
2019-04-02T05:59:09Z |
Thermal stability of W-contacted junction diodes
|
Yeh, WK; Chan, KY; Chang, TC; Chen, MC; Lin, MS |
| 臺大學術典藏 |
2018-09-10T07:40:06Z |
Thermal stability studies of CVD-grown graphene nanoribbons: Defect annealing and loop formation
|
Kim, Y.A.; Hayashi, T.; Morelos-G\\'omez, A.; Hofmann, M.; Muramatsu, H.; Endo, M.; Terrones, H.; Shull, R.D.; Dresselhaus, M.S.; Terrones, M.; Campos-Delgado, J.; Mario Hofmann et al. |
| 國立臺灣科技大學 |
2009 |
Thermal stability study of Cu(MoN x ) seed layer on barrierless Si
|
Chu J.P.; Lin C.H.; Leau W.K.; John V.S. |
| 國立臺灣科技大學 |
2009 |
Thermal Stability Study of Cu(MoNx) Seed Layer on Barrierless Si
|
Chu, J.P.;Lin, C.H.;Leau, W.K.;John, V.S. |
| 國立交通大學 |
2014-12-08T15:42:52Z |
Thermal stability study of Ni/Ta n-GaN Schottky contacts
|
Chen, GL; Chang, FC; Shen, KC; Ou, J; Chen, WH; Lee, MC; Chen, WK; Jou, MJ; Huang, CN |
| 國立臺灣大學 |
2002 |
Thermal stability study of the insulator layer in NiFe/CoFe/Al2O3/Co spin-dependent tunnel junction
|
Liao, C. C.; Ho, C. H.; Huang, R. -T.; Chen, F. -R.; Kai, J. J.; Chen, L. -C.; Lin, M. -T.; Yao, Y. D. |
| 臺大學術典藏 |
2018-09-10T04:10:59Z |
Thermal stability study of the insulator layer in NiFe/CoFe/Al2O3/CO spin-dependent tunnel junction
|
Liao, C. C.;Ho, C. H.;Huang, R. T.;Chen, F. R.;Kai, J. J.;Chen, L. C.;Lin, M. T.;Yao, Y. D.; Liao, C. C.; Ho, C. H.; Huang, R. T.; Chen, F. R.; Kai, J. J.; Chen, L. C.; Lin, M. T.; Yao, Y. D.; MINN-TSONG LIN |
| 國立成功大學 |
2006-09 |
Thermal stability study on nanoscale polysilicide resistors
|
Chen, Yen-Ming; Wang, Ying-Lang; Hwang, Gwo-Jen; Juang, Yungder; Lee, Wen-His |
| 國立臺灣科技大學 |
2014 |
Thermal stability, adhesion and electrical studies on (Ti,Zr)Nx thin films as low resistive diffusion barriers between Cu and Si
|
Huang, C.-L.;Lai, C.-H.;Tsai, P.-H.;Kuo, Y.-L.;Lin, J.-C.;Lee, C. |
| 東海大學 |
2002-11-01 |
Thermal stabilization of chromium(VI) in kaolin
|
Wei, Y.-L., Chiu, S.-Y., Tsai, H.-N., Yang, Y.-W., Lee, J.-F. |
| 臺大學術典藏 |
2019-05-14T00:38:11Z |
Thermal stabilization of iron-rich sludge for high strength aggregates
|
Chien C.-Y.;Hong S.-Y.;Show K.-Y.;Tay J.-H.;Lee D.-J.; Tay J.-H.; Show K.-Y.; Hong S.-Y.; Chien C.-Y.; Lee D.-J. |
| 國立政治大學 |
2008-04 |
Thermal stabilizing mutants of cocaine esterase
|
柯美全 |
| 臺大學術典藏 |
2021-10-07T08:52:31Z |
Thermal Storage in a two-phase closed thermosyphom system
|
Bo-Ren Chen; Huei-Jiunn Chen; Sih-Li Chen; SIH-LI CHEN |
| 元智大學 |
2013-02 |
Thermal Strain Analysis of Optic Fiber Sensors
|
Shiuh-Chuan Her; Chih-Ying Huang |
| 元智大學 |
2015-11-27 |
Thermal Strain Measured by Fiber Bragg Grating Sensors
|
Shiuh-Chuan Her; Chih-Ying Huang |
| 元智大學 |
Sep-16 |
Thermal Strain Measured by Fiber Bragg Grating Sensors
|
Shiuh-Chuan Her; Chih-Ying Huang |
| 國立臺灣大學 |
2003-05 |
Thermal Stress Analysis for Rapid Thermal Processor
|
Chao, Ching-Kong; Hung, Shih-Yu; Yu, Cheng-Ching |
| 國立成功大學 |
2019-12 |
Thermal Stress Analysis of 3D Anisotropic Materials Involving Domain Heat Source by the Boundary Element Method
|
Shiah;Y, C.;Tuan, Nguyen Anh;Hematiyan;M, R. |
| 元智大學 |
2011-01 |
Thermal Stress Analysis of a Bi-Material Layered Structure
|
Shiuh-Chuan Her; Chin-Hsien Lin; Shun-Wen Yeh |
| 元智大學 |
2011-02 |
Thermal Stress Analysis of a Multi-Layered Structure
|
Shiuh-Chuan Her; Chin-Hsien Lin |
| 國立成功大學 |
2020-10 |
Thermal Stress Analysis of Annular Fin Subject To Varying Contact Pressure and Heat Conduction
|
Lai;Hsin-Yi;Wei;Jen-Hung;Chang;Kuei-Hao;Chen;Chao-Kuang |
| 國立成功大學 |
2020 |
Thermal Stress Analysis of Annular Fin Subject To Varying Contact Pressure and Heat Conduction [環形鰭片在不同接觸壓力與熱導下之熱應力分析]
|
Lai, H.-Y.;Wei, J.-H.;Chang, K.-H.;Chen, Chen C.-K. |
| 國立臺灣大學 |
2003 |
Thermal Stress at Wafer Contact Points in Rapid Thermal Processing Investigated by Repeated Spike Treatment before Oxidation
|
Hong, Chao-Chi; Chang, Chang-Yun; Lee, Chaung-Yuan; Hwu, Jenn-Gwo |
| 臺大學術典藏 |
2020-01-13T08:23:06Z |
Thermal stress aware design for stacking IC with through glass via
|
Chien, J.-H.; Yu, H.; Lung, C.-L.; Chang, H.-C.; Tsai, N.-Y.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN |
| 國立中山大學 |
2005-10 |
Thermal Stress Effect on the Ferroelectric Characteristics of BaTiO3 Thin Films for Nonvolatile Memory Applications
|
K.H. Chen;Y.C. Chen;S.Y. Lin;C.M. Wang;T.C. Chang |
| 南台科技大學 |
2007-06 |
Thermal Stress of Substrate in Laser-Assisted Nano-Imprinting Fabrication Using Molecular Dynamics Simulation
|
莊承鑫; Di-Bao Wang; Fei-Bin Hsiao; Yung-Chun Lee; Cheng-Hsing Chuang |
| 國立臺灣科技大學 |
2008 |
Thermal stress simulations of SOFC membrane-electrode assembly
|
Yeh T.Y.; Kuo D.H.; Shiue R.K. |
| 大葉大學 |
2016-07 |
Thermal Stresses Analysis and Optimized TTP Processes to Achieved CNT-Based Diaphragm for Thin Panel Speakers
|
Min, Lai Feng;Peng, Chang-Yi |
| 國立臺灣科技大學 |
2012 |
Thermal stresses in a nonuniformly coated circular inclusion
|
Chao, C.K. |
| 國立臺灣科技大學 |
2007 |
Thermal stresses in a viscoelastic three-phase composite cylinder
|
Chao, C.K.;Chuang, C.T.;Chang, R.C. |
| 國立臺灣科技大學 |
2010 |
Thermal stresses in a viscoelastic trimaterial
|
Chao C.K. |
