English  |  正體中文  |  简体中文  |  0  
???header.visitor??? :  52763015    ???header.onlineuser??? :  646
???header.sponsordeclaration???
 
臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
???ui.leftmenu.abouttair???

???ui.leftmenu.bartitle???

???index.news???

???ui.leftmenu.copyrighttitle???

???ui.leftmenu.link???

???jsp.browse.items-by-title.jump??? [ ???jsp.browse.general.jump2chinese??? ] [ ???jsp.browse.general.jump2numbers??? ] [ A B C D E F G H I J K L M N O P Q R S T U V W X Y Z ]
???jsp.browse.items-by-title.enter???   

Showing items 872941-872965 of 2348685  (93948 Page(s) Totally)
<< < 34913 34914 34915 34916 34917 34918 34919 34920 34921 34922 > >>
View [10|25|50] records per page

Institution Date Title Author
臺大學術典藏 2018-09-10T07:40:06Z Thermal stability studies of CVD-grown graphene nanoribbons: Defect annealing and loop formation Kim, Y.A.; Hayashi, T.; Morelos-G\\'omez, A.; Hofmann, M.; Muramatsu, H.; Endo, M.; Terrones, H.; Shull, R.D.; Dresselhaus, M.S.; Terrones, M.; Campos-Delgado, J.; Mario Hofmann et al.
國立臺灣科技大學 2009 Thermal stability study of Cu(MoN x ) seed layer on barrierless Si Chu J.P.; Lin C.H.; Leau W.K.; John V.S.
國立臺灣科技大學 2009 Thermal Stability Study of Cu(MoNx) Seed Layer on Barrierless Si Chu, J.P.;Lin, C.H.;Leau, W.K.;John, V.S.
國立交通大學 2014-12-08T15:42:52Z Thermal stability study of Ni/Ta n-GaN Schottky contacts Chen, GL; Chang, FC; Shen, KC; Ou, J; Chen, WH; Lee, MC; Chen, WK; Jou, MJ; Huang, CN
國立臺灣大學 2002 Thermal stability study of the insulator layer in NiFe/CoFe/Al2O3/Co spin-dependent tunnel junction Liao, C. C.; Ho, C. H.; Huang, R. -T.; Chen, F. -R.; Kai, J. J.; Chen, L. -C.; Lin, M. -T.; Yao, Y. D.
臺大學術典藏 2018-09-10T04:10:59Z Thermal stability study of the insulator layer in NiFe/CoFe/Al2O3/CO spin-dependent tunnel junction Liao, C. C.;Ho, C. H.;Huang, R. T.;Chen, F. R.;Kai, J. J.;Chen, L. C.;Lin, M. T.;Yao, Y. D.; Liao, C. C.; Ho, C. H.; Huang, R. T.; Chen, F. R.; Kai, J. J.; Chen, L. C.; Lin, M. T.; Yao, Y. D.; MINN-TSONG LIN
國立成功大學 2006-09 Thermal stability study on nanoscale polysilicide resistors Chen, Yen-Ming; Wang, Ying-Lang; Hwang, Gwo-Jen; Juang, Yungder; Lee, Wen-His
國立臺灣科技大學 2014 Thermal stability, adhesion and electrical studies on (Ti,Zr)Nx thin films as low resistive diffusion barriers between Cu and Si Huang, C.-L.;Lai, C.-H.;Tsai, P.-H.;Kuo, Y.-L.;Lin, J.-C.;Lee, C.
東海大學 2002-11-01 Thermal stabilization of chromium(VI) in kaolin Wei, Y.-L., Chiu, S.-Y., Tsai, H.-N., Yang, Y.-W., Lee, J.-F.
臺大學術典藏 2019-05-14T00:38:11Z Thermal stabilization of iron-rich sludge for high strength aggregates Chien C.-Y.;Hong S.-Y.;Show K.-Y.;Tay J.-H.;Lee D.-J.; Tay J.-H.; Show K.-Y.; Hong S.-Y.; Chien C.-Y.; Lee D.-J.
國立政治大學 2008-04 Thermal stabilizing mutants of cocaine esterase 柯美全
臺大學術典藏 2021-10-07T08:52:31Z Thermal Storage in a two-phase closed thermosyphom system Bo-Ren Chen; Huei-Jiunn Chen; Sih-Li Chen; SIH-LI CHEN
元智大學 2013-02 Thermal Strain Analysis of Optic Fiber Sensors Shiuh-Chuan Her; Chih-Ying Huang
元智大學 2015-11-27 Thermal Strain Measured by Fiber Bragg Grating Sensors Shiuh-Chuan Her; Chih-Ying Huang
元智大學 Sep-16 Thermal Strain Measured by Fiber Bragg Grating Sensors Shiuh-Chuan Her; Chih-Ying Huang
國立臺灣大學 2003-05 Thermal Stress Analysis for Rapid Thermal Processor Chao, Ching-Kong; Hung, Shih-Yu; Yu, Cheng-Ching
國立成功大學 2019-12 Thermal Stress Analysis of 3D Anisotropic Materials Involving Domain Heat Source by the Boundary Element Method Shiah;Y, C.;Tuan, Nguyen Anh;Hematiyan;M, R.
元智大學 2011-01 Thermal Stress Analysis of a Bi-Material Layered Structure Shiuh-Chuan Her; Chin-Hsien Lin; Shun-Wen Yeh
元智大學 2011-02 Thermal Stress Analysis of a Multi-Layered Structure Shiuh-Chuan Her; Chin-Hsien Lin
國立成功大學 2020-10 Thermal Stress Analysis of Annular Fin Subject To Varying Contact Pressure and Heat Conduction Lai;Hsin-Yi;Wei;Jen-Hung;Chang;Kuei-Hao;Chen;Chao-Kuang
國立成功大學 2020 Thermal Stress Analysis of Annular Fin Subject To Varying Contact Pressure and Heat Conduction [環形鰭片在不同接觸壓力與熱導下之熱應力分析] Lai, H.-Y.;Wei, J.-H.;Chang, K.-H.;Chen, Chen C.-K.
國立臺灣大學 2003 Thermal Stress at Wafer Contact Points in Rapid Thermal Processing Investigated by Repeated Spike Treatment before Oxidation Hong, Chao-Chi; Chang, Chang-Yun; Lee, Chaung-Yuan; Hwu, Jenn-Gwo
臺大學術典藏 2020-01-13T08:23:06Z Thermal stress aware design for stacking IC with through glass via Chien, J.-H.; Yu, H.; Lung, C.-L.; Chang, H.-C.; Tsai, N.-Y.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN
國立中山大學 2005-10 Thermal Stress Effect on the Ferroelectric Characteristics of BaTiO3 Thin Films for Nonvolatile Memory Applications K.H. Chen;Y.C. Chen;S.Y. Lin;C.M. Wang;T.C. Chang
南台科技大學 2007-06 Thermal Stress of Substrate in Laser-Assisted Nano-Imprinting Fabrication Using Molecular Dynamics Simulation 莊承鑫; Di-Bao Wang; Fei-Bin Hsiao; Yung-Chun Lee; Cheng-Hsing Chuang

Showing items 872941-872965 of 2348685  (93948 Page(s) Totally)
<< < 34913 34914 34915 34916 34917 34918 34919 34920 34921 34922 > >>
View [10|25|50] records per page