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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
國立成功大學 2016-09-30 Thermally-induced failures of copper through-silicon via structures evaluated by the strain energy density model Han, Chang-Fu; Lin, Jen-Fin
國立臺灣大學 2012 Thermallycrosslinkable poly(N-isopropylacrylamide) copolymers: Synthesis and characterization of temperature-responsivehydrogel Chuang, Wen-Ju; Chiu, Wen-Yen; Tai, Horng-Jer
臺大學術典藏 2018-09-10T15:00:27Z ThermalProbe: Exploring the Use OF Thermal Identification for Per-User Energy Metering Chuang-Wen You;Hsin-Liu (Cindy) Kao;Bo-Jhang Ho;Nan-Chen Chen;Yi-Hsuan Hsieh;Polly Huang;Hao-hua Chu; Chuang-Wen You; Hsin-Liu (Cindy) Kao; Bo-Jhang Ho; Nan-Chen Chen; Yi-Hsuan Hsieh; Polly Huang; Hao-hua Chu; POLLY HUANG
國立成功大學 2023--MAR ThermalProGAN: A sequence-based thermally stable protein generator trained using unpaired data Huang;Hui-Ling;Weng;Chong-Heng;Nordling;Torbjoern, E. M.;Liou;Yi-Fan
國立臺灣大學 2009-10 Thermal–electrical–luminous model of multi-chip polychromatic LED luminaire Huang, Bin-Juine; Tang, Chun-Wen
國立臺灣大學 2006 Thermal–solutal flows and segregation and their control by angular vibration in vertical Bridgman crystal growth Liu, Y.C.; Yu, W.C.; Roux, B.; Lyubimova, T.P.; Lan, C.W.
國立臺灣大學 2000-05 Thermionic emission dominated carrier dynamics in InGaN/GaN multiple quantum-wells Sun, Chi-Kuang; Liang, Jian-Chin; Yu, Xiang-Yang; Abare, Amber; DenBaars, Steven P.
臺大學術典藏 2018-09-10T03:29:17Z Thermionic emission dominated carrier dynamics in InGaN/GaN multiple-quantum-wells Sun, Chi-Kuang; Liang, Jian-Chin; Yu, Xiang-Yang; Abare, Amber; DenBaars, Steven P.; CHI-KUANG SUN
國立成功大學 2003 Thermionic emission of amorphous diamond and field emission of carbon nanotubes Kan, Ming-Chi; Huang, Jow-Lay; Sung, James C.; Chen, Kuei-Hsien; Yau, Bao-Shun
國立交通大學 2014-12-08T15:06:30Z THERMIONIC FIELD-EMISSION IN POLYCRYSTALLINE-SILICON FILMS LU, NCC; GERZBERG, L; LU, CY; MEINDL, JD
國立交通大學 2017-10-06T06:18:02Z Thermionic Injection and Space-Charge-Limited Current in Reach-Through p+np+ Structures 褚冀良; 施敏; J.L.Chu; S.M.Sze
國立聯合大學 2007 Thermo Effects on Flexible Panel Substrate S.-J. Hwang, M. C. Tseng, K. C. Hwang, H. H. Yu,
國立聯合大學 2006 Thermo Effects on the Novel Soft Electronic Substrates H. H. Yu, M.-C. Tseng, K.-C. Hwang, S.-J. Hwang
國立聯合大學 2004 THERMO TREATMENT EFFECT ON THE FLEXIBLE PANEL SUBSTRATES FOR OLED Hsin Her Yu, Kuo-Cheng Hwang, Ming-Chun Tsen and Shug-June Hwang
淡江大學 201606 Thermo- and pH-induced self-assembly of P(AA-b-NIPAAm-b-AA) triblock copolymers synthesized via RAFT polymerization Kuo, Chih-Yu;Don, Trong-Ming;Hsu, Shih-Chi;Lee, Chia-Fen;Chiu, Wen-Yen;Huang, Chih-Yuan
嘉南藥理大學 2016-04 Thermo- and pH-Induced Self-Assembly of P(AA-b-NIPAAm-b-AA) Triblock Copolymers Synthesized via RAFT Polymerization Kuo, Chih-Yu; Don, Trong-Ming; Hsu, Shih-Chi; Lee, Chia-Fen; Chiu, Wen-Yen; Huang, Chih-Yuan
中華大學 2007 Thermo-consolidation Due to a Point Heat Source Buried in a Poroelastic Half Space 呂志宗; Lu, John C.-C.
臺北醫學大學 1998 Thermo-debonding Mechanisms in Dentin Bonding System Using the Finite Element Method. 黃豪銘; Chiang H. -C.; Lee S. -Y.; Lin C. -T. Huang H. -M.
臺北醫學大學 2001 Thermo-debonding mechanisms in dentin bonding systems using finite element analysis. 李勝揚; 江心治; 黃豪銘; Yung-Hsun Shih; 鄭信忠; 董德瑞; 林哲堂
臺北醫學大學 2000 Thermo-debonding mechanisms in dentin bonding systems using finite element analysis. 黃豪銘; Lee; S.Y.; Chiang; H.C.; Huang; H.M.; Shih; Y.H.; Chen; H.C.; Dong; D.R.; Lin; C.T
臺北醫學大學 2001 Thermo-debonding mechanisms in dentin bonding systems using finite element analysis. 黃豪銘; Lee; S.Y.; Lin; C.T.; Chiang; H.C.; Huang; H.M.; Shih; Y.H.; Chen; H.C.; Dong; D.R.; Pan; L.C.
臺北醫學大學 1998 Thermo-debonding Mechanisms in Dentin Bonding Systems Using Finite Element Method. 李勝揚l; 林哲堂; Chiang H-C; Lee S-Y; Lin C-T; Huang H-M
臺北醫學大學 1997 Thermo-Debonding Mechanisms of Dental Composites and Dentin Bonding Systems 李勝揚
義守大學 2008 Thermo-hygro-mechanical design and reliability analysis for CMOS Image Sensor Hsiang-Chen Hsu;Hui-Yu Lee;Yu-Cha Hsu;Shen-Li Fu
義守大學 2008-10 Thermo-hygro-mechanical design and reliability analysis for CMOS image sensor Hsiang-Chen Hsu;Hui-Yu Lee;Yu-Cha Hsu;Shen-Li Fu

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