| 國立聯合大學 |
2007 |
Thermo Effects on Flexible Panel Substrate
|
S.-J. Hwang, M. C. Tseng, K. C. Hwang, H. H. Yu, |
| 國立聯合大學 |
2006 |
Thermo Effects on the Novel Soft Electronic Substrates
|
H. H. Yu, M.-C. Tseng, K.-C. Hwang, S.-J. Hwang |
| 國立聯合大學 |
2004 |
THERMO TREATMENT EFFECT ON THE FLEXIBLE PANEL SUBSTRATES FOR OLED
|
Hsin Her Yu, Kuo-Cheng Hwang, Ming-Chun Tsen and Shug-June Hwang |
| 淡江大學 |
201606 |
Thermo- and pH-induced self-assembly of P(AA-b-NIPAAm-b-AA) triblock copolymers synthesized via RAFT polymerization
|
Kuo, Chih-Yu;Don, Trong-Ming;Hsu, Shih-Chi;Lee, Chia-Fen;Chiu, Wen-Yen;Huang, Chih-Yuan |
| 嘉南藥理大學 |
2016-04 |
Thermo- and pH-Induced Self-Assembly of P(AA-b-NIPAAm-b-AA) Triblock Copolymers Synthesized via RAFT Polymerization
|
Kuo, Chih-Yu; Don, Trong-Ming; Hsu, Shih-Chi; Lee, Chia-Fen; Chiu, Wen-Yen; Huang, Chih-Yuan |
| 中華大學 |
2007 |
Thermo-consolidation Due to a Point Heat Source Buried in a Poroelastic Half Space
|
呂志宗; Lu, John C.-C. |
| 臺北醫學大學 |
1998 |
Thermo-debonding Mechanisms in Dentin Bonding System Using the Finite Element Method.
|
黃豪銘; Chiang H. -C.; Lee S. -Y.; Lin C. -T. Huang H. -M. |
| 臺北醫學大學 |
2001 |
Thermo-debonding mechanisms in dentin bonding systems using finite element analysis.
|
李勝揚; 江心治; 黃豪銘; Yung-Hsun Shih; 鄭信忠; 董德瑞; 林哲堂 |
| 臺北醫學大學 |
2000 |
Thermo-debonding mechanisms in dentin bonding systems using finite element analysis.
|
黃豪銘; Lee; S.Y.; Chiang; H.C.; Huang; H.M.; Shih; Y.H.; Chen; H.C.; Dong; D.R.; Lin; C.T |
| 臺北醫學大學 |
2001 |
Thermo-debonding mechanisms in dentin bonding systems using finite element analysis.
|
黃豪銘; Lee; S.Y.; Lin; C.T.; Chiang; H.C.; Huang; H.M.; Shih; Y.H.; Chen; H.C.; Dong; D.R.; Pan; L.C. |
| 臺北醫學大學 |
1998 |
Thermo-debonding Mechanisms in Dentin Bonding Systems Using Finite Element Method.
|
李勝揚l; 林哲堂; Chiang H-C; Lee S-Y; Lin C-T; Huang H-M |
| 臺北醫學大學 |
1997 |
Thermo-Debonding Mechanisms of Dental Composites and Dentin Bonding Systems
|
李勝揚 |
| 義守大學 |
2008 |
Thermo-hygro-mechanical design and reliability analysis for CMOS Image Sensor
|
Hsiang-Chen Hsu;Hui-Yu Lee;Yu-Cha Hsu;Shen-Li Fu |
| 義守大學 |
2008-10 |
Thermo-hygro-mechanical design and reliability analysis for CMOS image sensor
|
Hsiang-Chen Hsu;Hui-Yu Lee;Yu-Cha Hsu;Shen-Li Fu |
| 臺大學術典藏 |
2018-09-10T09:38:55Z |
Thermo-induced shape-memory PEG-PCL copolymer as a dual-drug-eluting biodegradable stent
|
Yang, C.-S. and Wu, H.-C. and Sun, J.-S. and Hsiao, H.-M. and Wang, T.-W.; JUI-SHENG SUN |
| 臺大學術典藏 |
2020-01-13T08:20:08Z |
Thermo-induced shape-memory PEG-PCL copolymer as a dual-drug-eluting biodegradable stent
|
Yang, C.-S.; Wu, H.-C.; Sun, J.-S.; Hsiao, H.-M.; Wang, T.-W.; HAO-MING HSIAO |
| 臺大學術典藏 |
2020-02-07T03:43:35Z |
Thermo-induced shape-memory PEG-PCL copolymer as a dual-drug-eluting biodegradable stent
|
Hsiao H.-M.; Wang T.-W.; JUI-SHENG SUN; Wu H.-C.; Yang C.-S.; Yang C.-S.;Wu H.-C.;Jui-Sheng Sun;Hsiao H.-M.;Wang T.-W. |
| 國立臺灣大學 |
2001 |
Thermo-kinematic evolution of the Taiwan oblique-collision mountain belt as revealed by zircon fission track dating
|
Liu, Tsung-Kwei; Hsieh, Sherry; Chen, Yue-Gau; Chen, Wen-Shan |
| 國立成功大學 |
2024-08-15 |
Thermo-kinetics study of microalgal biomass in oxidative torrefaction followed by machine learning regression and classification approaches
|
Chen;Wei-Hsin;Felix;Charles, B. |
| 國立成功大學 |
2021-01 |
Thermo-mechanical analysis of 3D manufactured electrodes for solid oxide fuel cells
|
Chueh;Chih-Che;Bertei;Antonio |
| 國立成功大學 |
2018-01 |
Thermo-mechanical analysis of laser peeling of ultrathin glass for removing edge flaws in web processing applications
|
Chen;Kuo-Shen;Yang;Tian-Shiang;Hong;Ron-Can;Chiu;Tz-Cheng;Lin;Mao-Chi |
| 國立成功大學 |
2003-01-15 |
Thermo-mechanical behavior of thick PECVD oxide films for power MEMS applications
|
Zhang, Xin; Chen, Kuo-Shen; Spearing, S.Mark |
| 國立中山大學 |
2004 |
Thermo-mechanical Behaviors of the Underfill/Solder Mask/Substrate Interface under Thermal Cycling
|
C.H. Chien; Y.C. Chen; C.C. Hsieh; Y.D. Wu; Y.T. Chiou |
| 國立中山大學 |
2006 |
Thermo-Mechanical Fatigue of Centrally Notched and Unnotched AS-4/PEEK APC-2 Composite Laminates
|
M.H.R. Jen; Y.C. Tseng; W.H. Lin |
| 國立成功大學 |
2019 |
Thermo-mechanical process emulation and sensitivity analysis of wafer warpage after reconstitution in fan-out packaging
|
Yang, C.-Y.;Chen, K.-S.;Yang, T.-S.G.;Chiu, T.-C.;Ho, C.-J. |
