| 國立交通大學 |
2014-12-08T15:40:21Z |
Wafer bonding by Ni-induced crystallization of amorphous silicon
|
Chao, CP; Wu, YCS; Lee, TL; Wang, YH |
| 國立交通大學 |
2014-12-08T15:19:18Z |
Wafer bonding for high-brightness light-emitting diodes via indium tin oxide intermediate layers
|
Liu, PC; Hou, CY; Wu, YCS |
| 國立彰化師範大學 |
2000 |
Wafer Bonding of 50 Mms Diameter Mirror Substrate to AlGaInP Light-emitting Diode Wafer
|
Seieh, C. H. ; Horng, R. H. ; Huang, Man-Fang; Wuu, D. S. ; Peng, W. C. ; Tsai, S. J. ; Liu, J. S. |
| 國立彰化師範大學 |
2001 |
Wafer Bonding of 50-mm-Diameter Mirror Substrates to AlGaInP Light-Emitting Diode Wafers
|
Horng, R. H. ; Wuu, D. S. ; Seieh, C. H. ; Peng, W. C. ; Huang, Man-Fang; Tsai, S. J. ; Liu, J. S. |
| 國立交通大學 |
2014-12-08T15:26:16Z |
Wafer bonding using indium tin oxide intermediate layer for high brightness LEDs
|
Liu, PC; Hou, CY; Wu, YCS |
| 國立臺灣海洋大學 |
2009-12 |
Wafer Defect Inspection by Neural Analysis of Region Features
|
Chuan-Yu Chang; Chun-Hsi Li; Yung-Chi Chang; MuDer Jeng |
| 國立交通大學 |
2014-12-08T15:09:01Z |
Wafer defect pattern recognition by multi-class support vector machines by using a novel defect cluster index
|
Chao, Li-Chang; Tong, Lee-Ing |
| 國立高雄第一科技大學 |
2012.05 |
Wafer Identification Recognition by Stroke Analysis and Template Matching
|
Hsu, Wei-Chih;Yu, Tsan-Ying;Chen, Kuan-Liang |
| 國立交通大學 |
2017-04-21T06:49:36Z |
Wafer Level Batch Fabrication and Assembly of Small Form Factor Optical Pickup Head
|
Hsiao, Sheng-Yi; Lee, Chih-Chun; Chiu, Yi; Shih, Hsi-Fu; Chiou, Jin-Chem; Shieh, Han-Ping D.; Fang, Weileun |
| 中華大學 |
2007 |
Wafer Level MEMS Vertical Probe Card Design
|
林君明; Lin, Jium-Ming |
| 國立交通大學 |
2014-12-16T06:14:01Z |
Wafer level packaging method and a packaging structure using thereof
|
Chen Tsung-Lin; Lien Jui-Chien |
| 中華大學 |
2008 |
Wafer Level Test Vertical Probe Design
|
林君明; Lin, Jium-Ming |
| 元智大學 |
2010-11 |
WAFER LITHOGRAPHIC MASK AND WAFER LITHOGRAPHY METHOD USING THE SAME
|
Shih-Cheng Tsai; Lin R.-B. |
| 元智大學 |
2010-11 |
WAFER LITHOGRAPHIC MASK AND WAFER LITHOGRAPHY METHOD USING THE SAME
|
Shih-Cheng Tsai; Lin R.-B. |
| 朝陽科技大學 |
2006-05 |
Wafer lot output time prediction with a hybrid artificial neural network
|
吳欣潔; Tsai, H.R.; Wu, H.C.; Chen, T. |
| 臺大學術典藏 |
2018-09-10T15:21:11Z |
Wafer map failure pattern recognition and similarity ranking for large-scale data sets
|
Wu, M.-J.;Jang, J.-S.R.;Chen, J.-L.; Wu, M.-J.; Jang, J.-S.R.; Chen, J.-L.; JYH-SHING JANG |
| 國立交通大學 |
2014-12-08T15:43:46Z |
Wafer rework strategies at the photolithography stage
|
Sha, DY; Hsieh, LF; Chen, KJ |
| 中原大學 |
2002-03-26 |
Wafer rinse tank for metal etching and method for using
|
陳志吉;鍾子揚;王思堯;潘昇良 |
| 國立交通大學 |
2017-04-21T06:56:39Z |
Wafer Scale Phase-Engineered 1T-and 2H-MoSe2/Mo Core-Shell 3D-Hierarchical Nanostructures toward Efficient Electrocatalytic Hydrogen Evolution Reaction
|
Qu, Yindong; Medina, Henry; Wang, Sheng-Wen; Wang, Yi-Chung; Chen, Chia-Wei; Su, Teng-Yu; Manikandan, Arumugam; Wang, Kuangye; Shih, Yu-Chuan; Chang, Je-Wei; Kuo, Hao-Chung; Lee, Chi-Yung; Lu, Shih-Yuan; Shen, Guozhen; Wang, Zhiming M.; Chueh, Yu-Lun |
| 國立交通大學 |
2018-08-21T05:56:49Z |
WAFER SIZE MOS2 WITH FEW MONOLAYER SYNTHESIZED BY H2S SULFURIZATION
|
Ho, Yen-Teng; Chu, Yung-Ching; Wei, Lin-Lung; Luong, Tien-Tung; Lin, Chih-Chien; Cheng, Chun-Hung; Hsu, Hung-Ru; Tu, Yung-Yi; Chang, Edward Yi |
| 國立交通大學 |
2014-12-08T15:47:47Z |
Wafer Sort Bitmap Data Analysis Using the PCA-Based Approach for Yield Analysis and Optimization
|
Hsieh, Yeou-lang; Tzeng, Gwo-hshiung; Lin, T. R.; Yu, Hsiao-cheng |
| 國立彰化師範大學 |
2000-04 |
Wafer-Bonded AlGaInP/Au/AuBe/SiO2/Si Light-Emitting Diodes
|
Horng, Ray-Hua; Wuu, Dong-Sing; Wei, Sun-Chin; Tseng, Chung-Yang; Huang, Man-Fang; Chang, Kuo-Hsiung; Liu, Pin-Hui; Lin, Kun-Chuan |
| 國立彰化師範大學 |
1999 |
Wafer-bonded InGaAlP/AuBe/glass Light-emitting Diodes
|
Horng, R. H. ; Wuu, D. S. ; Tseng, H. W. ; Wei, S. C. ; Huang, Man-Fang; Chang, K. H. ; Liu, P. H. ; Lin, K. C. |
| 國立交通大學 |
2014-12-08T15:20:30Z |
WAFER-LEVEL CHIP SCALE FLEXIBLE WIRELESS MICROSYSTEM FABRICATION
|
Chao, Tzu-Yuan; Cheng, Y. T. |
| 國立交通大學 |
2014-12-08T15:21:23Z |
Wafer-level Cu-Cu bonding technology
|
Tang, Ya-Sheng; Chang, Yao-Jen; Chen, Kuan-Neng |
