臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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Institution	Date	Title	Author
臺大學術典藏	2022-04-26T06:17:51Z	Wafer Bin Map Recognition with Autoencoder-based Data Augmentation in Semiconductor Assembly Process	Shen P;Lee C.; Shen P; Lee C.; CHIA-YEN LEE
國立成功大學	2022	Wafer Bin Map Recognition with Autoencoder-Based Data Augmentation in Semiconductor Assembly Process	Shen, P.-C.;Lee, C.-Y.
國立交通大學	2014-12-08T15:44:55Z	Wafer bonding by low-temperature soldering	Lee, C; Huang, WF; Shie, JS
國立交通大學	2014-12-08T15:40:21Z	Wafer bonding by Ni-induced crystallization of amorphous silicon	Chao, CP; Wu, YCS; Lee, TL; Wang, YH
國立交通大學	2014-12-08T15:19:18Z	Wafer bonding for high-brightness light-emitting diodes via indium tin oxide intermediate layers	Liu, PC; Hou, CY; Wu, YCS
國立彰化師範大學	2000	Wafer Bonding of 50 Mms Diameter Mirror Substrate to AlGaInP Light-emitting Diode Wafer	Seieh, C. H. ; Horng, R. H. ; Huang, Man-Fang; Wuu, D. S. ; Peng, W. C. ; Tsai, S. J. ; Liu, J. S.
國立彰化師範大學	2001	Wafer Bonding of 50-mm-Diameter Mirror Substrates to AlGaInP Light-Emitting Diode Wafers	Horng, R. H. ; Wuu, D. S. ; Seieh, C. H. ; Peng, W. C. ; Huang, Man-Fang; Tsai, S. J. ; Liu, J. S.
國立交通大學	2014-12-08T15:26:16Z	Wafer bonding using indium tin oxide intermediate layer for high brightness LEDs	Liu, PC; Hou, CY; Wu, YCS
國立臺灣海洋大學	2009-12	Wafer Defect Inspection by Neural Analysis of Region Features	Chuan-Yu Chang; Chun-Hsi Li; Yung-Chi Chang; MuDer Jeng
國立交通大學	2014-12-08T15:09:01Z	Wafer defect pattern recognition by multi-class support vector machines by using a novel defect cluster index	Chao, Li-Chang; Tong, Lee-Ing

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