| 國立臺灣科技大學 |
2008 |
Interfacial reactions between Ni/430 stainless steel as interconnect material and Ag-Cu alloy fillers in SOFC system
|
Yen, Y.-W.;Lee, C.-Y.;Huang, D.-P.;Su, J.-W. |
| 國立臺灣科技大學 |
2008 |
Interfacial reactions between Ni/430 stainless steel as the interconnect material and Ag-Cu alloy fillers in a solid oxide fuel cell system
|
Yen, Y.-W.;Lee, C.-Y.;Huang, D.-P.;Su, J.-W. |
| 國立臺灣科技大學 |
2018 |
Interfacial Reactions between Pb-free Solders and Cu-Ti Alloy (C1990HP)
|
安德罗 |
| 國立臺灣科技大學 |
2013 |
Interfacial reactions between SAC405 and SACNG lead-free solders with Au/Ni(P)/Cu substrate reflowed using the CO2 laser and hot-air methods
|
Yen, Y.-W.;Hsiao, H.-M.;Lo, S.-C.;Fu, S.-M. |
| 國立臺灣科技大學 |
2018 |
Interfacial reactions between Sn and Au-xCu alloys
|
Lin, C.H.;Yeh, C.Y.;Yen, Yen Y.W. |
| 國立臺灣科技大學 |
2009 |
Interfacial reactions between Sn-9Zn + Cu lead-free solders and the Au substrate
|
Liou W.-k.; Yen Y.-w.; Chen K.-d. |
| 國立臺灣科技大學 |
2009 |
Interfacial reactions between Sn-9Zn+Cu lead-free solders and the Au substrate
|
Liou, W.K.;Yen, Y.W.;Chen, K.D. |
| 國立臺灣科技大學 |
2012 |
Interfacial reactions between Sn-Zn alloys and Au substrate
|
Yen, Y.-W.;Lin, M.-C.;Lin, C.-K.;Chen, W.-C. |
| 國立交通大學 |
2020-02-02T23:54:41Z |
Interfacial reactions between Ti and Y2O3/Ca4Ti3O10 composites
|
Lu, Ming-Wei; Lin, Kun-Lin; Lin, Chien-Cheng |
| 國立交通大學 |
2014-12-08T15:45:57Z |
Interfacial reactions between Ti-6Al-4V alloy and zirconia mold during casting
|
Lin, KF; Lin, CC |
| 國立交通大學 |
2014-12-08T15:47:27Z |
Interfacial reactions between zirconia and titanium
|
Lin, KF; Lin, CC |
| 國立成功大學 |
2014-01 |
Interfacial Reactions in Cu/Ga and Cu/Ga/Cu Couples
|
Lin, Shih-kang; Cho, Cheng-liang; Chang, Hao-miao |
| 國立成功大學 |
2013-10-15 |
Interfacial reactions in Sn-20In-2.8Ag/Cu couples
|
Lin, Shih-kang; Hsu, Che-wei; Chen, Sinn-wen; Hsu, Chia-ming |
| 國立臺灣科技大學 |
2012 |
Interfacial reactions in Sn/Fe-xNi couples
|
Yen, Y.-W.;Hsiao, H.-M.;Lin, S.-W.;Huang, P.-J.;Lee, C. |
| 國立臺灣科技大學 |
2017 |
Interfacial reactions in the Au/Sn-xZn/Cu sandwich couples
|
Yen, Yen Y.-W;Lin, C.-Y;Hermana, G.N;Chen, P.-Y;Wu, Y.-P. |
| 中原大學 |
2005 |
Interfacial Reactions in the Sn-(Ag)/(Ni,V) Couples and Phase Equilibria of the Sn-Ni-V System at the Sn-rich Corner
|
Chih-chi Chen;Sinn-wen Chen;Ching-ya Kao; |
| 臺大學術典藏 |
2021-08-05T02:41:04Z |
Interfacial reactions in Zn4Sb3/titanium diffusion couples
|
Chen C.-H;Yeh W.-T;Chuang T.-H.; Chen C.-H; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG |
| 國立成功大學 |
2019 |
Interfacial reactions of 68In–32Bi, 50In–50Bi and 33In–67Bi low melting alloys on Cu substrates
|
Tseng, Tseng T.-H.;Yang, C.-H.;Chiang, J.-Y.;Huang, J.-J.;Chen, Chen C.-H.;Lin, S.-K.;Wang, C.-M.;Wu, A.T. |
| 國立交通大學 |
2014-12-08T15:46:21Z |
Interfacial reactions of Co/Si0.76Ge0.24 and Co(Si0.76Ge0.24)/Si0.76Ge0.24 by pulsed KrF laser annealing
|
Luo, JS; Hang, YL; Lin, WT; Chang, CY; Shih, PS |
| 國立臺灣科技大學 |
2014 |
Interfacial reactions of high-Bi alloys on various substrates
|
Wang, J.-Y.;Chen, C.-M.;Yen, Y.-W. |
| 國立成功大學 |
2004-12 |
Interfacial reactions of lead-free Sn-Zn based solders on Cu and Cu plated electroless Ni-P/Au layer under aging at 150 degrees C
|
Huang, Chia-Wei; Lin, Kwang-Lung |
| 國立臺灣大學 |
2002 |
Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films
|
Su, T. L.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films
|
Su, T.L.; Tsao, L.C.; Chang, S.Y.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立交通大學 |
2014-12-08T15:48:54Z |
Interfacial reactions of Ni on Si0.76Ge0.24 and Si by pulsed laser annealing
|
Luo, JS; Lin, WT; Chang, CY; Tsai, WC |
| 國立成功大學 |
1998-07 |
Interfacial reactions of Ni on Si0.76Ge0.24 and Si by pulsed laser annealing
|
Luo, Jian-Shing; Lin, Wen-Tai; Chang, C. Y.; Tsai, W. C. |
