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教育部委托研究计画 计画执行:国立台湾大学图书馆
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显示项目 519171-519180 / 2346275 (共234628页)
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每页显示[10|25|50]项目
| 國立臺灣科技大學 |
2008 |
Interfacial reactions between Ni/430 stainless steel as interconnect material and Ag-Cu alloy fillers in SOFC system
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Yen, Y.-W.;Lee, C.-Y.;Huang, D.-P.;Su, J.-W. |
| 國立臺灣科技大學 |
2008 |
Interfacial reactions between Ni/430 stainless steel as the interconnect material and Ag-Cu alloy fillers in a solid oxide fuel cell system
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Yen, Y.-W.;Lee, C.-Y.;Huang, D.-P.;Su, J.-W. |
| 國立臺灣科技大學 |
2018 |
Interfacial Reactions between Pb-free Solders and Cu-Ti Alloy (C1990HP)
|
安德罗 |
| 國立臺灣科技大學 |
2013 |
Interfacial reactions between SAC405 and SACNG lead-free solders with Au/Ni(P)/Cu substrate reflowed using the CO2 laser and hot-air methods
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Yen, Y.-W.;Hsiao, H.-M.;Lo, S.-C.;Fu, S.-M. |
| 國立臺灣科技大學 |
2018 |
Interfacial reactions between Sn and Au-xCu alloys
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Lin, C.H.;Yeh, C.Y.;Yen, Yen Y.W. |
| 國立臺灣科技大學 |
2009 |
Interfacial reactions between Sn-9Zn + Cu lead-free solders and the Au substrate
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Liou W.-k.; Yen Y.-w.; Chen K.-d. |
| 國立臺灣科技大學 |
2009 |
Interfacial reactions between Sn-9Zn+Cu lead-free solders and the Au substrate
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Liou, W.K.;Yen, Y.W.;Chen, K.D. |
| 國立臺灣科技大學 |
2012 |
Interfacial reactions between Sn-Zn alloys and Au substrate
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Yen, Y.-W.;Lin, M.-C.;Lin, C.-K.;Chen, W.-C. |
| 國立交通大學 |
2020-02-02T23:54:41Z |
Interfacial reactions between Ti and Y2O3/Ca4Ti3O10 composites
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Lu, Ming-Wei; Lin, Kun-Lin; Lin, Chien-Cheng |
| 國立交通大學 |
2014-12-08T15:45:57Z |
Interfacial reactions between Ti-6Al-4V alloy and zirconia mold during casting
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Lin, KF; Lin, CC |
显示项目 519171-519180 / 2346275 (共234628页)
<< < 51913 51914 51915 51916 51917 51918 51919 51920 51921 51922 > >>
每页显示[10|25|50]项目
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