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Institution	Date	Title	Author
臺大學術典藏	2018-09-10T07:42:41Z	Packaged Symmetric/Asymmetric Corrugated Long Period Fiber Gratings for Refractive Index Sensing Applications	Chih-Yu Huang,;Wen-Lin Chan,;Shih-Min Chuo,;Jer-Haur Chang,;Li-Lun Chen,;Lon A. Wang,; Chih-Yu Huang,; Wen-Lin Chan,; Shih-Min Chuo,; Jer-Haur Chang,; Li-Lun Chen,; Lon A. Wang,; LON A. WANG
國立成功大學	2003-05	Packaging a fiber Bragg grating with metal coating for an athermal design	Lo, Yu-Lung; Kuo, Chih-Ping
國立成功大學	2002-02	Packaging a fiber Bragg grating without preloading in a simple athermal bimaterial device	Lo, Yu-Lung; Kuo, Chih-Ping
南台科技大學	2003	Packaging design for e-commerce: Identifyingnew challenges and opportunities for online packaging	黃國禮; HUANG, K.L.;RUST, C.;PRESS, M.
義守大學	2004-03	Packaging Design for Implantable Microstimulator	Chi-Chan Hung;Cho-Liang Chung;Gin-Shu Young;Kang-Ping Lin;Jia-Jin Chen; 鍾卓良
國立交通大學	2019-04-02T06:04:52Z	Packaging Effect on the Flow Separation of CMOS Thermoresistive Micro Calorimetric Flow Sensors	Xu, Wei; Gao, Bo; Lee, Yi-Kuen; Chiu, Yi
國立中山大學	2009-05	Packaging effects on degrading the figure of merit of a CMOS low-noise amplifier: flip-chip versus wirebond	F.Y. Han;K.C. Lu;T.S. Horng;J.Y. Li;C.C. Chen;H.H. Chen;C.T. Chiu;C.P Hung
國立中山大學	2009-06	Packaging effects on the figure of merit of a CMOS cascode low-noise amplifier: flip-chip versus wire-bond	F.Y. Han;K.C. Lu;T.S. Horng;J. Lin;H.H. Cheng;C.T. Chiu;C.P. Hung
國立臺灣科技大學	2014	Packaging efficiency in phosphor-converted white LEDs and its impact to the limit of luminous efficacy	Sun, C.-C.;Chang, Y.-Y.;Yang, T.-H.;Chung, T.-Y.;Chen, C.-C.;Lee, T.-X.;Li, D.-R.;Lu, C.-Y.;Ting, Z.-Y.;Glorieux, B.;Chen, Y.-C.;Lai, K.-Y.;Liu, C.-Y.
國立臺灣大學	2005-02	Packaging Methods of Fiber Bragg Grating Sensors in Civil Structure Applications	Lin, Y. B.; Chang, K. C.; Chern, J. C.; Wang, L.

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