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教育部委托研究计画 计画执行:国立台湾大学图书馆
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显示项目 648386-648395 / 2348570 (共234857页)
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| 國立中山大學 |
2003-12-06 |
Package Implementation: A Study of Data and Output Misfit Identification
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Jen-Her Wu;Chi-Cheng Wu;Shin-Shing Shin |
| 淡江大學 |
2018-10-04 |
Package mTEXO for testing the presence of outliers in exponential samples
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Lin, Chien-Tai;Lee, Ying-Chen;Balakrishnan, Narayanaswamy |
| 淡江大學 |
2018-07-28 |
Package mTEXO for testing the presence of outliers in exponential samples
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Lin, C. T.;Lee, Y. C.;Balakrishnan, N. |
| 淡江大學 |
2018-10-04 |
Package mTEXO for testing the presence of outliers in exponential samples.
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Chien-Tai Lin, Ying Chen Lee, and N. Balakrishnan |
| 國立交通大學 |
2017-04-21T06:49:40Z |
Package Routability- and IR-Drop-Aware Finger/Pad Assignment in Chip-Package Co-Design
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Lu, Chao-Hung; Chen, Hung-Ming; Liu, Chien-Nan Jimmy; Shih, Wen-Yu |
| 國立交通大學 |
2014-12-08T15:31:26Z |
Package routability- and IR-drop-aware finger/pad planning for single chip and stacking IC designs
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Lu, Chao-Hung; Chen, Hung-Ming; Liu, Chien-Nan Jimmy; Shih, Wen-Yu |
| 國立交通大學 |
2015-12-04T07:03:11Z |
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
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LIN Chien-Chung; KUO Hao-Chung; CHEN Kuo-Ju; HAN Hau-Vei; CHEN Hsin-Chu |
| 國立交通大學 |
2017-02-09 |
PACKAGE STRUCTURE OF A LIGHT-EMITTING DEVICE
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Hsien-Hao Tu; Zong-Yi Tu; Kuo-Ju Chen; Hau-Vei Han; Chin-Wei Sher; Hao-Chung Kuo; Chien-Chung Lin |
| 國立臺灣科技大學 |
2020 |
Package structure of polarized white chip-on-board light-emitting diode with high thermal conductivity
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Su, J.-C.;Huang, S.-B. |
| 國立成功大學 |
2007-02 |
Package-induced cross-coupling effect on amplifier harmonic suppression
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Chen, Han-Jan; Huang, Tsung-Hui; Chang, Chin-Sheng; Chen, Lih-Shan; Horng, Jui-Hong; Wang, Yeong-Her; Houng, Mau-Phon |
显示项目 648386-648395 / 2348570 (共234857页)
<< < 64834 64835 64836 64837 64838 64839 64840 64841 64842 64843 > >>
每页显示[10|25|50]项目
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