| 建國科技大學 |
2010 |
"Thermal characteristics in asymmetrically heated channels fully filled with brass beads,"
|
曾憲中 |
| 國立臺灣海洋大學 |
2014-07 |
Thermal Characterisation Analysis of Heat-Sink Heat Pipes under Forced Convection
|
Jung-Chang Wang |
| 國立臺灣海洋大學 |
2015-11 |
Thermal Characteristics and Exhaust-gas Analysis behind Bluff-Body Frustums
|
Yen, S. C.；Huang, Y. Z.；San, K. C |
| 國立成功大學 |
2004-03 |
Thermal characteristics and intermetallic compounds formed at Sn-9Zn-0.5Ag/Cu interface
|
Chang, Tao-Chih; Hon, Min-Hsiung; Wang, Moo-Chin |
| 義守大學 |
2006-04 |
Thermal Characteristics and Morphology of Semi-conducting Poly(9,9’-dioctylfluorene-co-bithiophene) Film
|
TSAI DING-JIANG; CHEN CHIA-MIN;CHUNG CHO-LIANG; CHEN GUO-JU; FU SHEN-LI |
| 嘉南藥理大學 |
2009-06 |
Thermal characteristics and regeneration analyses of adsorbents by differential scanning calorimetry and scanning electron microscope
|
Chung-Hwei Su; Sheng-Hung Wu; Sun-Ju Shen; Gong-Yih Shiue; Yih-Weng Wang; Chi-Min Shu |
| 國立成功大學 |
2008-06 |
Thermal characteristics and thermomechanical reliability of board-level stacked-die packages subjected to coupled power and thermal cycling test
|
Wang, Tong Hong; Lee, Chang-Chi; Lai, Yi-Shao; Lin, Yu-Cheng |
| 國立中山大學 |
2009 |
Thermal characteristics evaluation for board-level high-performance flip-chip package equipped with vapor chamber
|
T.H. Wang;C.C. Lee;R.T. Liu;Y.S. Lai |
| 國立中山大學 |
2009 |
Thermal characteristics evaluation for board-level high-performance flip-chip package equipped with vapor chamber
|
T.H. Wang;C.C. Lee;R.T. Liu;Y.S. Lai |
| 建國科技大學 |
2011 |
Thermal characteristics in asymmetrically heated channels fully filled with brass beads
|
曾憲中 |
| 臺大學術典藏 |
2020-05-12T02:53:43Z |
Thermal characteristics of a two-phase composite
|
Hsu, H.-C.; Tuan, W.-H.; WEI-HSING TUAN |
| 國立中山大學 |
1988 |
Thermal Characteristics of Annular Flow with Asymmetrically Roughened Surfaces
|
S.S. Hsieh |
| 國立臺灣科技大學 |
2018 |
Thermal characteristics of carbon fiber reinforced epoxy containing multi-walled carbon nanotubes
|
Lee J.-W.; Park S.-J.; Kim Y.-H.; Riichi-Murakami |
| 中華大學 |
2013 |
Thermal Characteristics of High-Power LED Packages with Dissipation Film
|
林育立; Lin, Yuli |
| 淡江大學 |
2002-09-01 |
Thermal Characteristics of Ice under Constant Heat Flux and Melt Removal
|
Ho, Chii-dong; Yeh, Ho-ming; Wang, Wen-pen |
| 淡江大學 |
2002-04-20 |
Thermal Characteristics of Ice under Constant Heat Flux and Melt Removal
|
Ho, Chii-Dong;Yeh, Ho-Ming;Wang, Wen-Pen |
| 國立成功大學 |
2014 |
Thermal Characteristics of InGaN/GaN Flip-Chip Light Emitting Diodes with Diamond-Like Carbon Heat-Spreading Layers
|
Tsai, Pai-Yang; Huang, Hou-Kuei; Sung, Chien-Min; Kan, Ming-Chi; Wang, Yeong-Her |
| 國立成功大學 |
2024 |
Thermal characteristics of the phase transition near 100 K in BaFe2 Al9
|
Kuo;C, -N.;Huang;R, Y.;Wen;L, T.;Lee;H, Y.;Hong;C, K.;Ou;Y, R.;Kuo;Y, -K.;Lue;C, -S. |
| 國立成功大學 |
2024-07-15 |
Thermal characteristics of the phase transition near 100 K in BaFe2Al9
|
Kuo;C, N.;Huang;R, Y.;Wen;L, T.;Lee;H, Y.;Hong;C, K.;Ou;Y, R.;Kuo;Y, K.;Lue;C, S. |
| 國立交通大學 |
2020-05-05T00:01:57Z |
Thermal Characteristics of the Three-Section Distributed Feedback Lasers
|
Cheng, Yuh-Jen; Lin, Chien-Chung; Hsu, Shun-Chieh; Chang, Shu-Hsiu; Shih, Hsiang-Yun; Huang, Chung-Ping |
| 國立中山大學 |
1986 |
Thermal Characteristics of the Trombe Wall Applied to Passive Solar Heating/Storage Systems
|
S.S. Hsieh; C.T. Tsai |
| 建國科技大學 |
2011 |
Thermal Characteristics on Cooling Passage of Traditional Vehicle Braking Disc
|
蘇宏明 |
| 建國科技大學 |
2011 |
Thermal Characteristics on Cooling Passage of Traditional Vehicle Braking Disc
|
蘇宏明 |
| 國立臺灣科技大學 |
2013 |
Thermal characterization of a chip-on-wafer-on-substrate with wide-IO bus
|
Tsai, K.-Y.;Xu, S.S.-D.;Lo, Y.-K.;Chang, W.-Y. |
| 國立成功大學 |
2019-06-1 |
Thermal Characterization of a Heat Management Module Containing Microencapsulated Phase Change Material
|
Shih;H, M.;Lin;Yi-Pin;Lin;L, P.;Lai;Chi-Ming |
| 國立成功大學 |
2023-12 |
Thermal characterization of an interior permanent magnet electric motor
|
Chang;Woei, Shyy;Wu;Pey-Shey;Hong;Yu-Siang;Hsu;Yung-Chih;Huang;Shih-Hang |
| 國立交通大學 |
2014-12-08T15:19:50Z |
THERMAL CHARACTERIZATION OF HIGH THERMAL CONDUCTIVE GRAPHITES REINFORCED ALUMINUM MATRIX COMPOSITES
|
Chang, Chih-Jong; Chang, Chih-Hao; Hwang, Jen-Dong; Kuo, Cheng-Tzu |
| 國立高雄應用科技大學 |
2011 |
Thermal characterization of shrouded plate fin array on an LED backlight panel
|
Shyu, Jin-Cherng; Hsu, Keng-Wei; Yang, Kai-Shing; Wang, Chi-Chuan |
| 國立交通大學 |
2014-12-08T15:26:43Z |
Thermal characterization of shrouded plate fin array on an LED backlight panel
|
Shyu, Jin-Cherng; Hsu, Keng-Wei; Yang, Kai-Shing; Wang, Chi-Chuan |
| 國立交通大學 |
2014-12-08T15:05:38Z |
THERMAL CHARACTERIZATION OF SYNTHESIZED Y2O3-CEO2-ZRO2
|
DUH, JG; LEE, MY; CHIOU, BS |
| 中華大學 |
2008 |
THERMAL CHARACTERIZATION OF THERMAL INTERFACE MATERIALS
|
陳精一; Chen, Ching-I |
| 國立成功大學 |
2004-07-30 |
Thermal chip fabrication with arrays of sensors and heaters for micro-scale impingement cooling heat transfer analysis and measurements
|
Shen, C. H.; Gau, Chie |
| 國立成功大學 |
2024-05-15 |
Thermal Circuit Modeling and Numerical Verification for Concurrent Fluid Flows through an Iso-Flux Heated Concentric Double Tube
|
Ho;C, J.;Huang;Shih-Hui;Huang;Zai-Ping;Yen;Jung-Yi;Chen;K, S.;Lai;-Ming, Chi |
| 國立彰化師範大學 |
2005-06 |
Thermal Comfort Control on Multi-room Fan Coil Unit System Using LEE-based Fuzzy Logic
|
Chu, Chi-Min; Jong, Tai-Lang; Huang, Yue-Wei |
| 國立成功大學 |
2013 |
Thermal Comfort for Urban Parks in Subtropics: Understanding Visitor's Perceptions, Behavior and Attendance
|
Lin, Chuang-Hung; Lin, Tzu-Ping; Hwang, Ruey-Lung |
| 朝陽科技大學 |
2021-05-28 |
Thermal Comfort of a Walking Environment under an Elevated Urban Railway: A Case Study of Taichung Overpass
|
許國威 |
| 中國醫藥大學 |
2007-12 |
Thermal Comfort Requirements for Occupants of Semi-Outdoor and Outdoor Environments in Hot-Humid Regions
|
黃瑞隆(Reuy Lung Hwang); 林子平(Tzu-Ping Lin)* |
| 中國醫藥大學 |
2008.06 |
Thermal comfort requirements in air-conditioned residences in hot-humid climate
|
鄭明仁(Ming-Jen Cheng); 黃瑞隆(Reuy Lung Hwang)* |
| 國立成功大學 |
2004-02 |
Thermal compensation for a chirp fiber bragg grating bonded substrate
|
Chang, Y. M.; Cheng, Chih-Chun; Lo, Yu-Lung |
| 臺大學術典藏 |
2022-09-21T23:30:34Z |
Thermal Compression Cu-Cu bonding using electroless Cu and the evolution of voids within bonding interface
|
Huang, C. H.; Shih, P. S.; Huang, J. H.; Grafner, S. J.; Chen, Y. A.; Kao, C. R. |
| 國立交通大學 |
2019-04-03T06:39:00Z |
Thermal conductance and the Peltier coefficient of carbon nanotubes
|
Lin, MF; Chuu, DS; Shung, KWK |
| 臺大學術典藏 |
2018-09-10T07:09:18Z |
Thermal conduction analysis on microwave IC packages
|
J.-F. Kiang; S.-P. Liu; W.-T. Lo; JEAN-FU KIANG |
| 國立成功大學 |
2001-04 |
Thermal conduction of a circular inclusion with variable interface parameter
|
Chen, Tungyang |
| 國立臺灣科技大學 |
2013 |
Thermal conductive performance of organosoluble polyimide/BN and polyimide/(BN + ALN) composite films fabricated by a solution-cast method
|
Kuo, D.H.;Lin, C.Y.;Jhou, Y.C.;Cheng, J.Y.;Liou, G.S. |
| 臺大學術典藏 |
2018-09-10T09:43:06Z |
Thermal conductive performance of organosoluble polyimide/BN and polyimide/(BN + ALN) composite films fabricated by a solution-cast method
|
GUEY-SHENG LIOU;Liou, G.S.;Cheng, J.Y.;Jhou, Y.C.;Lin, C.Y.;Kuo, D.H.;GUEY-SHENG LIOU; Kuo, D.H.; Lin, C.Y.; Jhou, Y.C.; Cheng, J.Y.; Liou, G.S.; GUEY-SHENG LIOU |
| 元智大學 |
2015-07-12 |
THERMAL CONDUCTIVITIES OF ALIGNED CNT NANOCOMPOSITES
|
M. W. Wang; C. C. Liao; Niann-i YU |
| 元智大學 |
2011-12-10 |
Thermal Conductivities of CNT/Epoxy Composites
|
C. Huang; Niann-i YU |
| 元智大學 |
2017-07-16 |
THERMAL CONDUCTIVITIES OF GNP/CNT/EPOXY COMPOSITES
|
C.P. Su; Niann-i YU |
| 元智大學 |
2015-11-20 |
Thermal Conductivities of GNP/CNT/Epoxy Nanocomposites
|
C. P. Su; Niann-i YU |
| 元智大學 |
2014-11-21 |
Thermal Conductivities of GNP/Epoxy Composites
|
K. Y. Huang; Niann-i YU |
