| 建國科技大學 |
2010 |
"Thermal characteristics in asymmetrically heated channels fully filled with brass beads,"
|
曾憲中 |
| 國立臺灣海洋大學 |
2014-07 |
Thermal Characterisation Analysis of Heat-Sink Heat Pipes under Forced Convection
|
Jung-Chang Wang |
| 國立臺灣海洋大學 |
2015-11 |
Thermal Characteristics and Exhaust-gas Analysis behind Bluff-Body Frustums
|
Yen, S. C.；Huang, Y. Z.；San, K. C |
| 國立成功大學 |
2004-03 |
Thermal characteristics and intermetallic compounds formed at Sn-9Zn-0.5Ag/Cu interface
|
Chang, Tao-Chih; Hon, Min-Hsiung; Wang, Moo-Chin |
| 義守大學 |
2006-04 |
Thermal Characteristics and Morphology of Semi-conducting Poly(9,9’-dioctylfluorene-co-bithiophene) Film
|
TSAI DING-JIANG; CHEN CHIA-MIN;CHUNG CHO-LIANG; CHEN GUO-JU; FU SHEN-LI |
| 嘉南藥理大學 |
2009-06 |
Thermal characteristics and regeneration analyses of adsorbents by differential scanning calorimetry and scanning electron microscope
|
Chung-Hwei Su; Sheng-Hung Wu; Sun-Ju Shen; Gong-Yih Shiue; Yih-Weng Wang; Chi-Min Shu |
| 國立成功大學 |
2008-06 |
Thermal characteristics and thermomechanical reliability of board-level stacked-die packages subjected to coupled power and thermal cycling test
|
Wang, Tong Hong; Lee, Chang-Chi; Lai, Yi-Shao; Lin, Yu-Cheng |
| 國立中山大學 |
2009 |
Thermal characteristics evaluation for board-level high-performance flip-chip package equipped with vapor chamber
|
T.H. Wang;C.C. Lee;R.T. Liu;Y.S. Lai |
| 國立中山大學 |
2009 |
Thermal characteristics evaluation for board-level high-performance flip-chip package equipped with vapor chamber
|
T.H. Wang;C.C. Lee;R.T. Liu;Y.S. Lai |
| 建國科技大學 |
2011 |
Thermal characteristics in asymmetrically heated channels fully filled with brass beads
|
曾憲中 |
| 臺大學術典藏 |
2020-05-12T02:53:43Z |
Thermal characteristics of a two-phase composite
|
Hsu, H.-C.; Tuan, W.-H.; WEI-HSING TUAN |
| 國立中山大學 |
1988 |
Thermal Characteristics of Annular Flow with Asymmetrically Roughened Surfaces
|
S.S. Hsieh |
| 國立臺灣科技大學 |
2018 |
Thermal characteristics of carbon fiber reinforced epoxy containing multi-walled carbon nanotubes
|
Lee J.-W.; Park S.-J.; Kim Y.-H.; Riichi-Murakami |
| 中華大學 |
2013 |
Thermal Characteristics of High-Power LED Packages with Dissipation Film
|
林育立; Lin, Yuli |
| 淡江大學 |
2002-09-01 |
Thermal Characteristics of Ice under Constant Heat Flux and Melt Removal
|
Ho, Chii-dong; Yeh, Ho-ming; Wang, Wen-pen |
| 淡江大學 |
2002-04-20 |
Thermal Characteristics of Ice under Constant Heat Flux and Melt Removal
|
Ho, Chii-Dong;Yeh, Ho-Ming;Wang, Wen-Pen |
| 國立成功大學 |
2014 |
Thermal Characteristics of InGaN/GaN Flip-Chip Light Emitting Diodes with Diamond-Like Carbon Heat-Spreading Layers
|
Tsai, Pai-Yang; Huang, Hou-Kuei; Sung, Chien-Min; Kan, Ming-Chi; Wang, Yeong-Her |
| 國立成功大學 |
2024 |
Thermal characteristics of the phase transition near 100 K in BaFe2 Al9
|
Kuo;C, -N.;Huang;R, Y.;Wen;L, T.;Lee;H, Y.;Hong;C, K.;Ou;Y, R.;Kuo;Y, -K.;Lue;C, -S. |
| 國立成功大學 |
2024-07-15 |
Thermal characteristics of the phase transition near 100 K in BaFe2Al9
|
Kuo;C, N.;Huang;R, Y.;Wen;L, T.;Lee;H, Y.;Hong;C, K.;Ou;Y, R.;Kuo;Y, K.;Lue;C, S. |
| 國立交通大學 |
2020-05-05T00:01:57Z |
Thermal Characteristics of the Three-Section Distributed Feedback Lasers
|
Cheng, Yuh-Jen; Lin, Chien-Chung; Hsu, Shun-Chieh; Chang, Shu-Hsiu; Shih, Hsiang-Yun; Huang, Chung-Ping |
| 國立中山大學 |
1986 |
Thermal Characteristics of the Trombe Wall Applied to Passive Solar Heating/Storage Systems
|
S.S. Hsieh; C.T. Tsai |
| 建國科技大學 |
2011 |
Thermal Characteristics on Cooling Passage of Traditional Vehicle Braking Disc
|
蘇宏明 |
| 建國科技大學 |
2011 |
Thermal Characteristics on Cooling Passage of Traditional Vehicle Braking Disc
|
蘇宏明 |
| 國立臺灣科技大學 |
2013 |
Thermal characterization of a chip-on-wafer-on-substrate with wide-IO bus
|
Tsai, K.-Y.;Xu, S.S.-D.;Lo, Y.-K.;Chang, W.-Y. |
| 國立成功大學 |
2019-06-1 |
Thermal Characterization of a Heat Management Module Containing Microencapsulated Phase Change Material
|
Shih;H, M.;Lin;Yi-Pin;Lin;L, P.;Lai;Chi-Ming |
