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教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
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顯示項目 872216-872225 / 2348719 (共234872頁)
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每頁顯示[10|25|50]項目
| 建國科技大學 |
2010 |
"Thermal characteristics in asymmetrically heated channels fully filled with brass beads,"
|
曾憲中 |
| 國立臺灣海洋大學 |
2014-07 |
Thermal Characterisation Analysis of Heat-Sink Heat Pipes under Forced Convection
|
Jung-Chang Wang |
| 國立臺灣海洋大學 |
2015-11 |
Thermal Characteristics and Exhaust-gas Analysis behind Bluff-Body Frustums
|
Yen, S. C.；Huang, Y. Z.；San, K. C |
| 國立成功大學 |
2004-03 |
Thermal characteristics and intermetallic compounds formed at Sn-9Zn-0.5Ag/Cu interface
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Chang, Tao-Chih; Hon, Min-Hsiung; Wang, Moo-Chin |
| 義守大學 |
2006-04 |
Thermal Characteristics and Morphology of Semi-conducting Poly(9,9’-dioctylfluorene-co-bithiophene) Film
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TSAI DING-JIANG; CHEN CHIA-MIN;CHUNG CHO-LIANG; CHEN GUO-JU; FU SHEN-LI |
| 嘉南藥理大學 |
2009-06 |
Thermal characteristics and regeneration analyses of adsorbents by differential scanning calorimetry and scanning electron microscope
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Chung-Hwei Su; Sheng-Hung Wu; Sun-Ju Shen; Gong-Yih Shiue; Yih-Weng Wang; Chi-Min Shu |
| 國立成功大學 |
2008-06 |
Thermal characteristics and thermomechanical reliability of board-level stacked-die packages subjected to coupled power and thermal cycling test
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Wang, Tong Hong; Lee, Chang-Chi; Lai, Yi-Shao; Lin, Yu-Cheng |
| 國立中山大學 |
2009 |
Thermal characteristics evaluation for board-level high-performance flip-chip package equipped with vapor chamber
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T.H. Wang;C.C. Lee;R.T. Liu;Y.S. Lai |
| 國立中山大學 |
2009 |
Thermal characteristics evaluation for board-level high-performance flip-chip package equipped with vapor chamber
|
T.H. Wang;C.C. Lee;R.T. Liu;Y.S. Lai |
| 建國科技大學 |
2011 |
Thermal characteristics in asymmetrically heated channels fully filled with brass beads
|
曾憲中 |
顯示項目 872216-872225 / 2348719 (共234872頁)
<< < 87217 87218 87219 87220 87221 87222 87223 87224 87225 87226 > >>
每頁顯示[10|25|50]項目
|
