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显示项目 519111-519120 / 2346260 (共234626页)
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| 元智大學 |
2013-12-1 |
Interfacial reaction and mechanical reliability of PTH solder joints with different solder/surface finish combinations
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C. H. Kao; H. H. Hua; H. Y. Chan; T. H. Yang; Kuen-Song Lin; Cheng-En Ho |
| 國立交通大學 |
2014-12-08T15:16:20Z |
Interfacial reaction and shear strength of Pb-free SnAg2.5Cu0.86b0.5 and SnAg3.0Cu0.5Sb0.2 solder bumps on Au/Ni(P) metallization
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Hsu, YC; Huang, YM; Chen, C; Wang, H |
| 國立臺灣大學 |
2012 |
Interfacial Reaction and Wettability of 72Ag-28Cu Braze on CP-Ti Substrate Using Infrared Heating
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Shiue, R.K.; Wu, S.K.; Chen, F.Y.; Yang, T.E. |
| 臺大學術典藏 |
2018-09-10T09:17:50Z |
Interfacial reaction and wettability of 72Ag-28Cu braze on CP-Ti substrate using infrared heating
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Lin, Ming-Tsan;Yang, T.E.;Chen, F.Y.;Wu, S.K.;Shiue, R.K.;Yang, T.E.;Chen, F.Y.;Wu, S.K.;Shiue, R.K.;陳炯年;李伯皇;楊博仁;楊偉勛;林明燦;Yu, Linda Chia-Hui;Lee, Po-Huang;Chen, Chiung-Nien;Yang, T.E.;Chen, F.Y.;Nien, Hsiao-Ching;Wu, S.K.;Yang, Wei-Shiung;Shiue, R.K.;SHYI-KAAN WU;Yang, Po-Jen; Shiue, R.K.; Wu, S.K.; Chen, F.Y.; Yang, T.E.; Shiue, R.K.; Wu, S.K.; Chen, F.Y.; Yang, T.E.; Yang, Po-Jen; SHYI-KAAN WU; Shiue, R.K.; Yang, Wei-Shiung; Wu, S.K.; Nien, Hsiao-Ching; Chen, F.Y.; Yang, T.E.; Chen, Chiung-Nien; Lee, Po-Huang; Yu, Linda Chia-Hui; Lin, Ming-Tsan; 林明燦; 楊偉勛; 楊博仁; 李伯皇; 陳炯年 |
| 國立臺灣大學 |
2010 |
Interfacial Reaction Between 95Pb-5Sn Solder Bump and 37Pb-63Sn Presolder in Flip-Chip Solder Joints
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Chang, C.C.; Wang, Y.W.; Lai, Y.S.; Kao, C.R. |
| 臺大學術典藏 |
2020-04-28T07:11:48Z |
Interfacial Reaction Between 95Pb-5Sn Solder Bump and 37Pb-63Sn Presolder in Flip-Chip Solder Joints
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Chang, C. C.; Wang, Y. W.; Lai, Y. S.; Kao, C. R.; CHIEN-CHENG CHANG |
| 國立交通大學 |
2014-12-08T15:17:35Z |
Interfacial Reaction Between Eutectic Sn-Pb Solder and Electroplated-Ni as well as Electroless-Ni Metallization During Reflow
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Chen, Hsiao-Yun; Chen, Chih |
| 國立臺灣大學 |
2002 |
Interfacial Reaction between Liquid Sn-20In-2.8Ag Solder and Ag Substrate
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Chiang, M. J.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Interfacial reaction between liquid Sn-20In-2.8Ag solder and Ag substrate
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Chiang, M.J.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立成功大學 |
2014-05 |
Interfacial Reaction Between Low-Temperature Co-fired Ceramics and NiCuZn Ferrites in Multilayer Composites
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Hsiang, Hsing-I; Lyu, Bing Jyun; Mei, Li-Then; Hsi, Chi-Shiung |
显示项目 519111-519120 / 2346260 (共234626页)
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