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教育部委托研究计画 计画执行:国立台湾大学图书馆
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显示项目 519131-519140 / 2346275 (共234628页)
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每页显示[10|25|50]项目
| 國立臺灣大學 |
2002 |
Interfacial Reaction between Liquid Sn-20In-2.8Ag Solder and Ag Substrate
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Chiang, M. J.; Chuang, T. H. |
| 國立成功大學 |
2014-05 |
Interfacial Reaction Between Low-Temperature Co-fired Ceramics and NiCuZn Ferrites in Multilayer Composites
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Hsiang, Hsing-I; Lyu, Bing Jyun; Mei, Li-Then; Hsi, Chi-Shiung |
| 國立臺灣科技大學 |
2019 |
Interfacial reaction between sn and cu-ti alloy (C1990hp)
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Laksono, A.D.;Chang, J.-S.;Yan, J.;Yen, Yen Y.-W. |
| 國立交通大學 |
2014-12-08T15:09:47Z |
Interfacial reaction between Sn-1Ag-0.5Cu(-Co) solder and Cu substrate with Au/Ni surface finish during reflow reaction
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Lin, K. S.; Huang, H. Y.; Chou, C. P. |
| 國立成功大學 |
2019 |
Interfacial reaction between YSZ electrolyte and La 0.7 Sr 0.3 VO 3 perovskite anode for application
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Liu, C.-Y.;Tsai, S.-Y.;Ni, C.-T.;Fung, K.-Z. |
| 國立成功大學 |
2019-03 |
Interfacial reaction between YSZ electrolyte and La0.7Sr0.3VO3 perovskite anode for application
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Liu;Chi-Yang;Tsai;Shu-Yi;Ni;Chung-Ta;Fung;Kuan-Zong |
| 國立中山大學 |
1992 |
Interfacial Reaction Characterization in Aluminum Base Composites
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Y.S. Lo;J.C. Huang |
| 國立臺灣大學 |
2007 |
Interfacial reaction issues for lead-free electronic solders
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Ho, C. E.; Yang, S. C.; Kao, C. R. |
| 臺大學術典藏 |
2001 |
Interfacial reaction of infrared brazed NiAl/Al/NiAl and Ni3Al/Al/Ni3Al joints
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Yang, T.Y.; Wu, S.K.; Shiue, R.K.; SHYI-KAAN WU; SHYI-KAAN WU;Shiue, R.K.;Wu, S.K.;Yang, T.Y.;SHYI-KAAN WU |
| 國立臺灣大學 |
2001 |
Interfacial reaction of infrared brazed NiAl/Al/NiAl and Ni3Al/Al/Ni3Al joints
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Yang, T. Y.; Wu, S. K.; Shiue, R. K. |
显示项目 519131-519140 / 2346275 (共234628页)
<< < 51909 51910 51911 51912 51913 51914 51915 51916 51917 51918 > >>
每页显示[10|25|50]项目
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