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显示项目 873071-873080 / 2348685 (共234869页)
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机构 日期 题名 作者
元智大學 2014-04-11 Thermal-aware task mapping for reconfigurable channel decoding Shu-Yen Lin; Cheng-Hung Lin; Ho-Yun Su
元智大學 2014-08-05 Thermal-aware task mapping for three-dimensional reconfigurable channel decoding Shu-Yen Lin; Cheng-Hung Lin; Ho-Yun Su
臺大學術典藏 2018-09-10T09:25:31Z Thermal-aware Test Schedule and TAM Co-Optimization for Three Dimensional IC C. J. Shih;C. Y. Hsu;C. Y. Kou;J. C. M. Li;J. C. Rau;K. Chakrabarty; C. J. Shih; C. Y. Hsu; C. Y. Kou; J. C. M. Li; J. C. Rau; K. Chakrabarty; CHIEN-MO LI
淡江大學 2012-10-18 Thermal-Aware Test Schedule and TAM Co-Optimization for Three-Dimensional IC Shih, Chi-Jih; Hsu, Chih-Yao; Kuo, Chun-Yi; Li, James; Rau, Jiann-Chyi; Krishnendu Chakrabarty
臺大學術典藏 2018-09-10T08:47:25Z Thermal-aware Test scheduling for 3D ICs CY Hsu; JCM Li; K. Chakrbarty; CHIEN-MO LI
臺大學術典藏 2020-01-06T03:05:17Z Thermal-capillary analysis of floating-zone growth of tube crystals: steady-state and conduction dominated calculations Lan, C.W.; CHUNG-WEN LAN
中華大學 2003 Thermal-chemical polishing device and method thereof 馬廣仁; Ma, Kung-Jen
淡江大學 2003-05-27 Thermal-chemical polishing devices and method thereof 趙崇禮; Chao, Choung-lii; Ma, Kung-jeng; Lin, Hung-yi
元智大學 May-22 Thermal-constrained memory management for three-dimensional DRAM-PCM memory with deep neural network applications Shu-Yen Lin; Shao-Cheng Wang
國立交通大學 2015-12-02T02:59:38Z Thermal-Constrained Task Scheduling on 3-D Multicore Processors for Throughput-and-Energy Optimization Liao, Chien-Hui; Wen, Charles H. -P.

显示项目 873071-873080 / 2348685 (共234869页)
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