| 國立臺灣大學 |
2002 |
Thermal stability study of the insulator layer in NiFe/CoFe/Al2O3/Co spin-dependent tunnel junction
|
Liao, C. C.; Ho, C. H.; Huang, R. -T.; Chen, F. -R.; Kai, J. J.; Chen, L. -C.; Lin, M. -T.; Yao, Y. D. |
| 臺大學術典藏 |
2018-09-10T04:10:59Z |
Thermal stability study of the insulator layer in NiFe/CoFe/Al2O3/CO spin-dependent tunnel junction
|
Liao, C. C.;Ho, C. H.;Huang, R. T.;Chen, F. R.;Kai, J. J.;Chen, L. C.;Lin, M. T.;Yao, Y. D.; Liao, C. C.; Ho, C. H.; Huang, R. T.; Chen, F. R.; Kai, J. J.; Chen, L. C.; Lin, M. T.; Yao, Y. D.; MINN-TSONG LIN |
| 國立成功大學 |
2006-09 |
Thermal stability study on nanoscale polysilicide resistors
|
Chen, Yen-Ming; Wang, Ying-Lang; Hwang, Gwo-Jen; Juang, Yungder; Lee, Wen-His |
| 國立臺灣科技大學 |
2014 |
Thermal stability, adhesion and electrical studies on (Ti,Zr)Nx thin films as low resistive diffusion barriers between Cu and Si
|
Huang, C.-L.;Lai, C.-H.;Tsai, P.-H.;Kuo, Y.-L.;Lin, J.-C.;Lee, C. |
| 東海大學 |
2002-11-01 |
Thermal stabilization of chromium(VI) in kaolin
|
Wei, Y.-L., Chiu, S.-Y., Tsai, H.-N., Yang, Y.-W., Lee, J.-F. |
| 臺大學術典藏 |
2019-05-14T00:38:11Z |
Thermal stabilization of iron-rich sludge for high strength aggregates
|
Chien C.-Y.;Hong S.-Y.;Show K.-Y.;Tay J.-H.;Lee D.-J.; Tay J.-H.; Show K.-Y.; Hong S.-Y.; Chien C.-Y.; Lee D.-J. |
| 國立政治大學 |
2008-04 |
Thermal stabilizing mutants of cocaine esterase
|
柯美全 |
| 臺大學術典藏 |
2021-10-07T08:52:31Z |
Thermal Storage in a two-phase closed thermosyphom system
|
Bo-Ren Chen; Huei-Jiunn Chen; Sih-Li Chen; SIH-LI CHEN |
| 元智大學 |
2013-02 |
Thermal Strain Analysis of Optic Fiber Sensors
|
Shiuh-Chuan Her; Chih-Ying Huang |
| 元智大學 |
2015-11-27 |
Thermal Strain Measured by Fiber Bragg Grating Sensors
|
Shiuh-Chuan Her; Chih-Ying Huang |
| 元智大學 |
Sep-16 |
Thermal Strain Measured by Fiber Bragg Grating Sensors
|
Shiuh-Chuan Her; Chih-Ying Huang |
| 國立臺灣大學 |
2003-05 |
Thermal Stress Analysis for Rapid Thermal Processor
|
Chao, Ching-Kong; Hung, Shih-Yu; Yu, Cheng-Ching |
| 國立成功大學 |
2019-12 |
Thermal Stress Analysis of 3D Anisotropic Materials Involving Domain Heat Source by the Boundary Element Method
|
Shiah;Y, C.;Tuan, Nguyen Anh;Hematiyan;M, R. |
| 元智大學 |
2011-01 |
Thermal Stress Analysis of a Bi-Material Layered Structure
|
Shiuh-Chuan Her; Chin-Hsien Lin; Shun-Wen Yeh |
| 元智大學 |
2011-02 |
Thermal Stress Analysis of a Multi-Layered Structure
|
Shiuh-Chuan Her; Chin-Hsien Lin |
| 國立成功大學 |
2020-10 |
Thermal Stress Analysis of Annular Fin Subject To Varying Contact Pressure and Heat Conduction
|
Lai;Hsin-Yi;Wei;Jen-Hung;Chang;Kuei-Hao;Chen;Chao-Kuang |
| 國立成功大學 |
2020 |
Thermal Stress Analysis of Annular Fin Subject To Varying Contact Pressure and Heat Conduction [環形鰭片在不同接觸壓力與熱導下之熱應力分析]
|
Lai, H.-Y.;Wei, J.-H.;Chang, K.-H.;Chen, Chen C.-K. |
| 國立臺灣大學 |
2003 |
Thermal Stress at Wafer Contact Points in Rapid Thermal Processing Investigated by Repeated Spike Treatment before Oxidation
|
Hong, Chao-Chi; Chang, Chang-Yun; Lee, Chaung-Yuan; Hwu, Jenn-Gwo |
| 臺大學術典藏 |
2020-01-13T08:23:06Z |
Thermal stress aware design for stacking IC with through glass via
|
Chien, J.-H.; Yu, H.; Lung, C.-L.; Chang, H.-C.; Tsai, N.-Y.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN |
| 國立中山大學 |
2005-10 |
Thermal Stress Effect on the Ferroelectric Characteristics of BaTiO3 Thin Films for Nonvolatile Memory Applications
|
K.H. Chen;Y.C. Chen;S.Y. Lin;C.M. Wang;T.C. Chang |
| 南台科技大學 |
2007-06 |
Thermal Stress of Substrate in Laser-Assisted Nano-Imprinting Fabrication Using Molecular Dynamics Simulation
|
莊承鑫; Di-Bao Wang; Fei-Bin Hsiao; Yung-Chun Lee; Cheng-Hsing Chuang |
| 國立臺灣科技大學 |
2008 |
Thermal stress simulations of SOFC membrane-electrode assembly
|
Yeh T.Y.; Kuo D.H.; Shiue R.K. |
| 大葉大學 |
2016-07 |
Thermal Stresses Analysis and Optimized TTP Processes to Achieved CNT-Based Diaphragm for Thin Panel Speakers
|
Min, Lai Feng;Peng, Chang-Yi |
| 國立臺灣科技大學 |
2012 |
Thermal stresses in a nonuniformly coated circular inclusion
|
Chao, C.K. |
| 國立臺灣科技大學 |
2007 |
Thermal stresses in a viscoelastic three-phase composite cylinder
|
Chao, C.K.;Chuang, C.T.;Chang, R.C. |
