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教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
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顯示項目 872956-872965 / 2348719 (共234872頁)
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每頁顯示[10|25|50]項目
| 元智大學 |
2015-11-27 |
Thermal Strain Measured by Fiber Bragg Grating Sensors
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Shiuh-Chuan Her; Chih-Ying Huang |
| 國立臺灣大學 |
2003-05 |
Thermal Stress Analysis for Rapid Thermal Processor
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Chao, Ching-Kong; Hung, Shih-Yu; Yu, Cheng-Ching |
| 國立成功大學 |
2019-12 |
Thermal Stress Analysis of 3D Anisotropic Materials Involving Domain Heat Source by the Boundary Element Method
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Shiah;Y, C.;Tuan, Nguyen Anh;Hematiyan;M, R. |
| 元智大學 |
2011-01 |
Thermal Stress Analysis of a Bi-Material Layered Structure
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Shiuh-Chuan Her; Chin-Hsien Lin; Shun-Wen Yeh |
| 元智大學 |
2011-02 |
Thermal Stress Analysis of a Multi-Layered Structure
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Shiuh-Chuan Her; Chin-Hsien Lin |
| 國立成功大學 |
2020-10 |
Thermal Stress Analysis of Annular Fin Subject To Varying Contact Pressure and Heat Conduction
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Lai;Hsin-Yi;Wei;Jen-Hung;Chang;Kuei-Hao;Chen;Chao-Kuang |
| 國立成功大學 |
2020 |
Thermal Stress Analysis of Annular Fin Subject To Varying Contact Pressure and Heat Conduction [環形鰭片在不同接觸壓力與熱導下之熱應力分析]
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Lai, H.-Y.;Wei, J.-H.;Chang, K.-H.;Chen, Chen C.-K. |
| 國立臺灣大學 |
2003 |
Thermal Stress at Wafer Contact Points in Rapid Thermal Processing Investigated by Repeated Spike Treatment before Oxidation
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Hong, Chao-Chi; Chang, Chang-Yun; Lee, Chaung-Yuan; Hwu, Jenn-Gwo |
| 臺大學術典藏 |
2020-01-13T08:23:06Z |
Thermal stress aware design for stacking IC with through glass via
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Chien, J.-H.; Yu, H.; Lung, C.-L.; Chang, H.-C.; Tsai, N.-Y.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN |
| 國立中山大學 |
2005-10 |
Thermal Stress Effect on the Ferroelectric Characteristics of BaTiO3 Thin Films for Nonvolatile Memory Applications
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K.H. Chen;Y.C. Chen;S.Y. Lin;C.M. Wang;T.C. Chang |
顯示項目 872956-872965 / 2348719 (共234872頁)
<< < 87291 87292 87293 87294 87295 87296 87297 87298 87299 87300 > >>
每頁顯示[10|25|50]項目
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