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Institution	Date	Title	Author
國立成功大學	2003-03-24	Intermetallic compounds formation and interfacial adhesion strength of Sn-9Zn-0.5Ag solder alloy hot-dipped on Cu substrate	Chang, Tao-Chih; Hon, Min-Hsiung; Wang, Moo-Chin
國立聯合大學	2004	Intermetallic Compounds Formation of the Sn-9Zn-xAg Lead-free Solders Hot-dipped on Cu Substrate	T.C. Chang , . M.C. Wang(王木琴) and M..H. Hon
國立成功大學	2003-04-30	Intermetallic compounds formed at the interface between Cu substrate and an Sn-9Zn-0.5Ag lead-free solder	Chang, Tao-Chih; Hon, Min-Hsiung; Wang, Moo-Chin
國立臺灣大學	2002	Intermetallic compounds formed at the interface between liquid indium and copper substrates	Yu, C. L.; Wang, S. S.; Chuang, T. H.
臺大學術典藏	2020-05-12T02:53:18Z	Intermetallic compounds formed at the interface between liquid indium and copper substrates	Yu, C.L.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG
臺大學術典藏	2020-05-12T02:53:14Z	Intermetallic compounds formed during diffusion soldering of Au/Cu/Al 2O3 and Cu/Ti/Si with Sn/In interlayer	Chuang, T.-H.; Lin, H.-J.; Tsao, C.-W.; TUNG-HAN CHUANG
臺大學術典藏	2009-01-06T01:29:28Z	Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayer	Tsao, Cheng-Wen; Chuang, Tung-Han; Lin, Hsiu-Jen; Chuang, Tung-Han; Lin, Hsiu-Jen; Tsao, Cheng-Wen
國立臺灣大學	2006	Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayer	Chuang, Tung-Han; Lin, Hsiu-Jen; Tsao, Cheng-Wen
國立臺灣大學	2002	Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates	Chiu, M. Y.; Wang, S. S.; Chuang, T. H.
臺大學術典藏	2020-05-12T02:53:18Z	Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates	Chiu, M.Y.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG

Showing items 520061-520070 of 2346275 (234628 Page(s) Totally)
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