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Institution	Date	Title	Author
國立臺灣大學	2006	Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates	Wang, S. S.; Tseng, Y. H.; Chuang, T. H.
臺大學術典藏	2020-05-12T02:53:14Z	Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates	Wang, S.S.; Tseng, Y.H.; Chuang, T.H.; TUNG-HAN CHUANG
臺大學術典藏	2020-05-12T02:53:29Z	Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates	Wang, S. S.; Tseng, Y. H.; Chuang, T. H.; TUNG-HAN CHUANG
國立臺灣大學	2004	Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu Solder Ball Grid Array Packages	Cheng, M. D.; Chang, S. Y.; Yen, S. F.; Chuang, T. H.
臺大學術典藏	2020-05-12T02:53:29Z	Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages (vol 33, pg 171, 2004)	TUNG-HAN CHUANG; Yen, S. F.; Chuang, T. H.; Chang, S. Y.; Cheng, M. D.
臺大學術典藏	2020-05-12T02:53:15Z	Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20ln-2Ag-0.5Cu Solder Ball Grid Array Packages	Cheng, M.D.; Yen, S.F.; Yen, S.F.; Chuang, T.H.; TUNG-HAN CHUANG
臺大學術典藏	2020-05-12T02:53:17Z	Intermetallic compounds formed during the reflow of In-49Sn solder ball-grid array packages	Chuang, T.H.; Chang, S.Y.; Tsao, L.C.; Weng, W.P.; Wu, H.M.; TUNG-HAN CHUANG
臺大學術典藏	2018-06-28T22:11:27Z	Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages	Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; ChuangTH
國立臺灣大學	2003	Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages	Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.
國立臺灣大學	2002	Intermetallic Compounds formed during the Soldering Reactions of Eutectic Sn-9Zn with Cu and Ni Substrates	Chan, Y. C.; Chiu, M. Y.; Chuang, T. H.

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