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Showing items 520091-520100 of 2346275  (234628 Page(s) Totally)
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Institution Date Title Author
國立東華大學 2008 Intermetallic Formation Induced Substrate Dissolution in Electroless Ni(P)-solder Interconnections Song,J. M.; Liu,Y. R.; Chiu,Y. T.; Lai,Y. S.; Su,C. W.
國立交通大學 2014-12-08T15:05:34Z INTERMETALLIC FORMATION ON THE FRACTURE OF SN/PB SOLDER AND PD/AG CONDUCTOR INTERFACES CHIOU, BS; LIU, KC; DUH, JG; PALANISAMY, PS
臺大學術典藏 2022-03-22T08:27:50Z Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes Chen C.-H;Lee P.-I;Yeh W.-T;Chuang T.-H.; Chen C.-H; Lee P.-I; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:30:50Z Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes Chen C.-H;Lee P.-I;Yeh W.-T;Chuang T.-H.; Chen C.-H; Lee P.-I; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:30:52Z Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes Chen C.-H;Lee P.-I;Yeh W.-T;Chuang T.-H.; Chen C.-H; Lee P.-I; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2021-11-21T23:18:55Z Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes CHUN-HAO CHEN; Lee, Pei Ing; Yeh, Wei Ting; TUNG-HAN CHUANG
國立中山大學 2001 Intermetallic Growth of Wire-bond at 175 °C High Temperature Aging Hen-So Chang;J.X. Pon;Ker-Chang Hsieh;C.C. Chen
國立勤益科技大學 1999-06 Intermetallic phase formation and shear strength of a Au-In microjoint Shieu, F.S.;Chen, C.F.;Sheen, J.G.;Chang, Z.C.
國立成功大學 2014 Intermetallic Phase on the Interface of Ag-Au-Pd/Al Structure Hsueh, Hao-Wen; Hung, Fei-Yi; Lui, Truan-Sheng; Chen, Li-Hui; Chen, Kuan-Jen
臺大學術典藏 2018-06-28T22:11:31Z Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads Wu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han; Wu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han

Showing items 520091-520100 of 2346275  (234628 Page(s) Totally)
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