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Institution	Date	Title	Author
臺大學術典藏	2009-01-06T01:28:22Z	Intermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu pads	Chuang, Tung-Han; Chi, Chih-Chien; Chi, Chih-Chien; Chuang, Tung-Han
國立臺灣大學	2006	Intermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu pads	Chi, Chih-Chien; Chuang, Tung-Han
臺大學術典藏	2006	Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads	Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han; Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han
國立臺灣大學	2006	Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads	Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han
臺大學術典藏	2020-05-12T02:53:14Z	Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads	Liu, Y.U.-C.; Lin, W.-H.; Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG
臺大學術典藏	2006	Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes	ChuangTH; Cheng, M. D.; Yen, S. F.; Chuang, T. H.; Chuang, T. H.; Yen, S. F.; Cheng, M. D.Chuangth
國立臺灣大學	2006	Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes	Chuang, T. H.; Yen, S. F.; Cheng, M. D.
臺大學術典藏	2020-05-12T02:53:13Z	Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes	Chuang, T.H.; Yen, S.F.; Cheng, M.D.; TUNG-HAN CHUANG
國立成功大學	2012-10	Intermetallic solid solution Fe1-xCoxGa3: Synthesis, structure, NQR study and electronic band structure calculations	Verchenko, V. Yu; Likhanov, M. S.; Kirsanova, M. A.; Gippius, A. A.; Tkachev, A. V.; Gervits, N. E.; Galeeva, A. V.; Buettgen, N.; Kraetschmer, W.; Lue, C. S.; Okhotnikov, K. S.; Shevelkov, A. V.
嘉南藥理大學	2009	Intermetallics	Elsevier SDOL

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