| 國立臺灣大學 |
2003-05 |
Thermal Stress Analysis for Rapid Thermal Processor
|
Chao, Ching-Kong; Hung, Shih-Yu; Yu, Cheng-Ching |
| 國立成功大學 |
2019-12 |
Thermal Stress Analysis of 3D Anisotropic Materials Involving Domain Heat Source by the Boundary Element Method
|
Shiah;Y, C.;Tuan, Nguyen Anh;Hematiyan;M, R. |
| 元智大學 |
2011-01 |
Thermal Stress Analysis of a Bi-Material Layered Structure
|
Shiuh-Chuan Her; Chin-Hsien Lin; Shun-Wen Yeh |
| 元智大學 |
2011-02 |
Thermal Stress Analysis of a Multi-Layered Structure
|
Shiuh-Chuan Her; Chin-Hsien Lin |
| 國立成功大學 |
2020-10 |
Thermal Stress Analysis of Annular Fin Subject To Varying Contact Pressure and Heat Conduction
|
Lai;Hsin-Yi;Wei;Jen-Hung;Chang;Kuei-Hao;Chen;Chao-Kuang |
| 國立成功大學 |
2020 |
Thermal Stress Analysis of Annular Fin Subject To Varying Contact Pressure and Heat Conduction [環形鰭片在不同接觸壓力與熱導下之熱應力分析]
|
Lai, H.-Y.;Wei, J.-H.;Chang, K.-H.;Chen, Chen C.-K. |
| 國立臺灣大學 |
2003 |
Thermal Stress at Wafer Contact Points in Rapid Thermal Processing Investigated by Repeated Spike Treatment before Oxidation
|
Hong, Chao-Chi; Chang, Chang-Yun; Lee, Chaung-Yuan; Hwu, Jenn-Gwo |
| 臺大學術典藏 |
2020-01-13T08:23:06Z |
Thermal stress aware design for stacking IC with through glass via
|
Chien, J.-H.; Yu, H.; Lung, C.-L.; Chang, H.-C.; Tsai, N.-Y.; Chou, Y.-F.; Chen, P.-H.; Chang, S.-C.; Kwai, D.-M.; PING-HEI CHEN |
| 國立中山大學 |
2005-10 |
Thermal Stress Effect on the Ferroelectric Characteristics of BaTiO3 Thin Films for Nonvolatile Memory Applications
|
K.H. Chen;Y.C. Chen;S.Y. Lin;C.M. Wang;T.C. Chang |
| 南台科技大學 |
2007-06 |
Thermal Stress of Substrate in Laser-Assisted Nano-Imprinting Fabrication Using Molecular Dynamics Simulation
|
莊承鑫; Di-Bao Wang; Fei-Bin Hsiao; Yung-Chun Lee; Cheng-Hsing Chuang |
| 國立臺灣科技大學 |
2008 |
Thermal stress simulations of SOFC membrane-electrode assembly
|
Yeh T.Y.; Kuo D.H.; Shiue R.K. |
| 大葉大學 |
2016-07 |
Thermal Stresses Analysis and Optimized TTP Processes to Achieved CNT-Based Diaphragm for Thin Panel Speakers
|
Min, Lai Feng;Peng, Chang-Yi |
| 國立臺灣科技大學 |
2012 |
Thermal stresses in a nonuniformly coated circular inclusion
|
Chao, C.K. |
| 國立臺灣科技大學 |
2007 |
Thermal stresses in a viscoelastic three-phase composite cylinder
|
Chao, C.K.;Chuang, C.T.;Chang, R.C. |
| 國立臺灣科技大學 |
2010 |
Thermal stresses in a viscoelastic trimaterial
|
Chao C.K. |
| 國立臺灣科技大學 |
2008 |
Thermal stresses in a viscoelastic trimaterial with a combination of a point heat source and a point heat sink
|
Porter, G.A.;Chuang, C.T.;Chao, C.K.;Chang, R.C. |
| 國立臺灣大學 |
2008-06 |
Thermal Stresses in Anisotropic and Radially Inhomogeneous Annular Domains
|
Tokovyy, Yu. V.; Ma, Chien-Ching |
| 臺大學術典藏 |
2018-09-10T06:58:31Z |
Thermal stresses in anisotropic and radially inhomogeneous annular domains
|
Ma, Chien-Ching;CHIEN-CHING MA;Tokovyy, Yu. V.;Ma, Chien-Ching;Tokovyy, Yu. V.;Ma, Chien-Ching;CHIEN-CHING MA;Tokovyy, Yu. V.; Tokovyy, Yu. V.; Ma, Chien-Ching; Tokovyy, Yu. V.; CHIEN-CHING MA; Ma, Chien-Ching |
| 國立成功大學 |
2002-05 |
Thermal stresses in annular fins with temperature-dependent conductivity under periodic boundary condition
|
Chiu, Ching-Huang; Chen, Cha'o-Kuang |
| 國立高雄第一科技大學 |
1999.04 |
Thermal stresses in box-type laser packages
|
W.H.Cheng;Y.D.Yang;T.C.Liang;G.L.Wang;M.T.Sheen;J.H.Kuang |
| 國立中山大學 |
1999 |
Thermal Stresses in Box-Type Laser Packages
|
W.H. Cheng; Y.D. Yang; T.C. Liang; G.L. Wang; M.T. Sheen; J.H. Kuang |
| 國立中山大學 |
1999 |
Thermal Stresses in Box-Type Laser Packages
|
W.H. Cheng;Y.D. Yang; T.C. Liang; G.L. Wang; M.T. Sheen;J.H. Kuang |
| 國立臺灣科技大學 |
2017 |
Thermal stresses induced by a remote uniform heat flow interacting with two circular inclusions
|
Chao, Chao C.K;Chen, F.M;Lin, T.H. |
| 國立成功大學 |
2016-08-02 |
Thermal Structure of Methane Hydrate Fueled Flames
|
Wu, Fang-Hsien; Padilla, R.-E; Dunn-Rankin, D.; Chen, G.-B; Chao, Yei-Chin |
| 國立成功大學 |
2017 |
Thermal structure of methane hydrate fueled flames
|
Wu;F, H.;Padilla;R, E.;Dunn-Rankin;D;Chen;G, B.;Chao;Y, C. |
