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Institution	Date	Title	Author
國立臺灣大學	2005	Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads	Wu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han
臺大學術典藏	2008	Intermetallic Reactions in a Sn-51In Solder BGA Package with immersion Ag Surface Finish	Chuang, Tung-Han; Wu, Hui-Min; Jain, Chao-Chi; Wang, Shiuan-Sheng; Jain, Chao-Chi; Wang, Shiuan-Sheng; Wu, Hui-Min; Chuang, Tung-Han
國立臺灣大學	2008	Intermetallic Reactions in a Sn-51In Solder BGA Package with immersion Ag Surface Finish	Jain, Chao-Chi; Wang, Shiuan-Sheng; Wu, Hui-Min; Chuang, Tung-Han
臺大學術典藏	2020-05-12T02:53:11Z	Intermetallic reactions in a Sn-51In solder BGA package with immersion Ag surface finish	Jain, C.-C.; Wang, S.-S.; Wu, H.-M.; Chuang, T.-H.; TUNG-HAN CHUANG
國立臺灣大學	2008	Intermetallic Reactions in Reflowed and Aged Sn-58Bi BGA Packages with Au/Ni/Cu Pads	Chi, C.C.; Tsao, L.C.; Tsao, C.W.; Chuang, T.H.
臺大學術典藏	2020-05-12T02:53:12Z	Intermetallic reactions in reflowed and aged Sn-58Bi BGA packages with Au/Ni/Cu pads	Chi, C.C.; Tsao, L.C.; Tsao, C.W.; Chuang, T.H.; TUNG-HAN CHUANG
國立臺灣大學	2006	Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads	Lin, Hsiu-Jen; Chuang, Tung-Han
臺大學術典藏	2020-05-12T02:53:14Z	Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu Pads	TUNG-HAN CHUANG; Chuang, T.-H.; Lin, H.-J.
臺大學術典藏	2008	Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish	ChuangTH; Wu, H.M.; Jain, C.C.; Chuang, T.H.; Chuang, T.H.; Jain, C.C.; Wu, H.M.
國立臺灣大學	2008	Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish	Chuang, T.H.; Jain, C.C.; Wu, H.M.

Showing items 520101-520110 of 2346275 (234628 Page(s) Totally)
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