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显示项目 520106-520115 / 2346288 (共234629页)
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| 國立勤益科技大學 |
1999-06 |
Intermetallic phase formation and shear strength of a Au-In microjoint
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Shieu, F.S.;Chen, C.F.;Sheen, J.G.;Chang, Z.C. |
| 國立成功大學 |
2014 |
Intermetallic Phase on the Interface of Ag-Au-Pd/Al Structure
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Hsueh, Hao-Wen; Hung, Fei-Yi; Lui, Truan-Sheng; Chen, Li-Hui; Chen, Kuan-Jen |
| 臺大學術典藏 |
2018-06-28T22:11:31Z |
Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads
|
Wu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han; Wu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han |
| 國立臺灣大學 |
2005 |
Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads
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Wu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han |
| 臺大學術典藏 |
2008 |
Intermetallic Reactions in a Sn-51In Solder BGA Package with immersion Ag Surface Finish
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Chuang, Tung-Han; Wu, Hui-Min; Jain, Chao-Chi; Wang, Shiuan-Sheng; Jain, Chao-Chi; Wang, Shiuan-Sheng; Wu, Hui-Min; Chuang, Tung-Han |
| 國立臺灣大學 |
2008 |
Intermetallic Reactions in a Sn-51In Solder BGA Package with immersion Ag Surface Finish
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Jain, Chao-Chi; Wang, Shiuan-Sheng; Wu, Hui-Min; Chuang, Tung-Han |
| 臺大學術典藏 |
2020-05-12T02:53:11Z |
Intermetallic reactions in a Sn-51In solder BGA package with immersion Ag surface finish
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Jain, C.-C.; Wang, S.-S.; Wu, H.-M.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
2008 |
Intermetallic Reactions in Reflowed and Aged Sn-58Bi BGA Packages with Au/Ni/Cu Pads
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Chi, C.C.; Tsao, L.C.; Tsao, C.W.; Chuang, T.H. |
| 臺大學術典藏 |
2020-05-12T02:53:12Z |
Intermetallic reactions in reflowed and aged Sn-58Bi BGA packages with Au/Ni/Cu pads
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Chi, C.C.; Tsao, L.C.; Tsao, C.W.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
2006 |
Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads
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Lin, Hsiu-Jen; Chuang, Tung-Han |
显示项目 520106-520115 / 2346288 (共234629页)
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